JPS60141194U - package cooling system - Google Patents

package cooling system

Info

Publication number
JPS60141194U
JPS60141194U JP2651184U JP2651184U JPS60141194U JP S60141194 U JPS60141194 U JP S60141194U JP 2651184 U JP2651184 U JP 2651184U JP 2651184 U JP2651184 U JP 2651184U JP S60141194 U JPS60141194 U JP S60141194U
Authority
JP
Japan
Prior art keywords
cooling system
package
package cooling
partition plate
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2651184U
Other languages
Japanese (ja)
Inventor
仙波　務
安掛　孝信
正夫 西牧
Original Assignee
日立工機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立工機株式会社 filed Critical 日立工機株式会社
Priority to JP2651184U priority Critical patent/JPS60141194U/en
Publication of JPS60141194U publication Critical patent/JPS60141194U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の冷却装置の一例を示す平面図、第２図は
放熱器表面の温度分布を示す特性図、第３図は本考案の
一実施例を示す平面図、第４図は第３図の実施例におけ
る加熱器表面の温度分布を示す特性図、第５図及び６図
は本考案装置の他の′実施例を平面図、第７図は第６図
の仕切板の側面図である。 図において、３はパラ、ケージ、５．５０は仕切板、７
はカードバスケットである。Fig. 1 is a plan view showing an example of a conventional cooling device, Fig. 2 is a characteristic diagram showing the temperature distribution on the surface of a radiator, Fig. 3 is a plan view showing an embodiment of the present invention, and Fig. 4 is a plan view showing an example of a conventional cooling device. Figure 3 is a characteristic diagram showing the temperature distribution on the surface of the heater in the embodiment, Figures 5 and 6 are plan views of other embodiments of the device of the present invention, and Figure 7 is a side view of the partition plate in Figure 6. It is. In the figure, 3 is a para, cage, 5.50 is a partition plate, 7
is a card basket.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子回路用部品を印刷配線板に実装したパッケージを収
納するためのカードバスケット内に、風の流れの方向に
通風路を狭くするような仕切板を設けたことを特徴とす
るパッケージ冷却装置。A package cooling device characterized in that a partition plate is provided in a card basket for storing a package in which electronic circuit components are mounted on a printed wiring board to narrow a ventilation passage in the direction of air flow.
JP2651184U 1984-02-24 1984-02-24 package cooling system Pending JPS60141194U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2651184U JPS60141194U (en) 1984-02-24 1984-02-24 package cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2651184U JPS60141194U (en) 1984-02-24 1984-02-24 package cooling system

Publications (1)

Publication Number Publication Date
JPS60141194U true JPS60141194U (en) 1985-09-18

Family

ID=30522582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2651184U Pending JPS60141194U (en) 1984-02-24 1984-02-24 package cooling system

Country Status (1)

Country Link
JP (1) JPS60141194U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338300A (en) * 1986-08-01 1988-02-18 富士通株式会社 Structure for cooling electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527279U (en) * 1978-08-10 1980-02-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527279U (en) * 1978-08-10 1980-02-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6338300A (en) * 1986-08-01 1988-02-18 富士通株式会社 Structure for cooling electronic device

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