JPS58135950U - Fixed structure of IC heatsink - Google Patents
Fixed structure of IC heatsinkInfo
- Publication number
- JPS58135950U JPS58135950U JP3272782U JP3272782U JPS58135950U JP S58135950 U JPS58135950 U JP S58135950U JP 3272782 U JP3272782 U JP 3272782U JP 3272782 U JP3272782 U JP 3272782U JP S58135950 U JPS58135950 U JP S58135950U
- Authority
- JP
- Japan
- Prior art keywords
- heatsink
- heat sink
- fixed structure
- fixing structure
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のIC用放熱器の固定構造を説明するため
のaは正面図、bは側面図、第2図は本考案に係るIC
用放熱器の固定構造の一実施例を −説明するため
のaは正面図、bは押え金具の平面図、第3図は本考案
に係るIC用放熱器の固定構造の他の実施例を説明する
ためのaは正面図、bは押え金具の斜視図である。
図において、1はIC,2は放熱器、3はフンパウンド
、4はプリント板、5および6は押え金具、51および
61は押え部、52および62は立上り部、53および
63は引掛は部をそれぞれ示す。Fig. 1 is a front view, b is a side view, and Fig. 2 is an IC according to the present invention for explaining the fixing structure of a conventional IC heatsink.
3 shows another example of the fixing structure of the IC heat sink according to the present invention. For the purpose of explanation, a is a front view, b is a plan view of the holding fitting, and FIG. For purposes of explanation, a is a front view, and b is a perspective view of the presser fitting. In the figure, 1 is an IC, 2 is a heat radiator, 3 is a support plate, 4 is a printed board, 5 and 6 are presser fittings, 51 and 61 are presser parts, 52 and 62 are rising parts, and 53 and 63 are hook parts. are shown respectively.
Claims (1)
であって、該固定構造は一旦放熱器をIC′ の
上面に載置接着したるのち、該ICと放熱器を1本のM
9状に折り曲げ形成した線状弾性体部材で挾持するよう
にしたことを特徴とするIC用放熱器の固定構造。This is a structure in which a heat sink is placed and fixed on the top surface of an IC that requires heat dissipation, and the fixing structure is such that the heat sink is placed and bonded on the top surface of the IC', and then the IC and the heat sink are assembled into a single piece. M
A fixing structure for an IC heatsink, characterized in that it is held between linear elastic members bent into nine shapes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3272782U JPS58135950U (en) | 1982-03-08 | 1982-03-08 | Fixed structure of IC heatsink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3272782U JPS58135950U (en) | 1982-03-08 | 1982-03-08 | Fixed structure of IC heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58135950U true JPS58135950U (en) | 1983-09-13 |
Family
ID=30044316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3272782U Pending JPS58135950U (en) | 1982-03-08 | 1982-03-08 | Fixed structure of IC heatsink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58135950U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133557A (en) * | 1986-09-11 | 1988-06-06 | スアーマロイ、インコーパレイテイド | Assembly apparatus for attaching heatsink and means and frame of the same |
-
1982
- 1982-03-08 JP JP3272782U patent/JPS58135950U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133557A (en) * | 1986-09-11 | 1988-06-06 | スアーマロイ、インコーパレイテイド | Assembly apparatus for attaching heatsink and means and frame of the same |
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