JPS6338300A - Structure for cooling electronic device - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A cooling structure for an electronic device that houses a plurality of printed circuit boards mounted with high-density integrated components, the cooling structure being integrated with a mounting shelf and a guide rail. The printed circuit board is mounted on the guide rail of the planar duct, and a large number of spray holes having different openings are formed on a surface of the planar duct opposite to the component mounting surface of the printed circuit board, and the planar duct is provided with a plurality of spray holes having different openings. Cooling air from the air conditioner is blown onto electronic components via a cold air blower and cold air pipe to efficiently remove heat generated from electronic components, improving the reliability of electronic devices and achieving high-density packaging.

[Industrial Field of Application] The present invention relates to a cooling structure for various electronic devices such as an electronic exchange, and particularly to a cooling structure for an electronic device in which cold air is blown onto individual electronic components mounted on a printed circuit board.

In recent years, with the demand for electronic devices to be smaller and lighter, electronic components mounted on printed circuit boards have been integrated at a higher density, resulting in a dramatic increase in heat generation density. In order to operate electronic devices using electronic devices stably and over a long period of time, it is necessary to efficiently remove the heat generated from the electronic components, so there is a strong demand for the development of a cooling structure for these electronic devices.

[Conventional technology]

Conventional cooling structures for electronic devices either use a natural air cooling method that uses convection (a natural phenomenon) to cool the heat generated within the device, or they install a fan (N1) in the device to forcefully remove the heat generated within the device. A forced air cooling method is used to discharge the air to the outside.

[Problem that the invention seeks to solve]

The conventional cooling structure for electronic devices, that is, the natural air cooling method, is as follows:
It relies only on the convection effect caused by natural phenomena and is applied only to low heat generation devices. In addition, even forced air cooling has its own limitations as a cooling method for the highly integrated parts of recent years, making it difficult to cool to the optimum operating temperature and also causing problems such as contamination due to dust, etc. there were.

[Means for Solving the Problems] The present invention solves the above problems and provides a cooling structure for electronic devices that maintains the optimum operating temperature of electronic components.

That is, a cooling structure for an electronic device that houses a plurality of printed circuit boards on which a large number of electronic components are mounted and has ventilation holes on the top surface is installed in the guide rail of a planar duct that integrates the mounting part and the guide rail. mount the printed circuit board on the
A large number of blowing holes having different openings are formed on the surface of the planar duct that faces the component mounting surface of the printed circuit board, and cooling air from the air conditioner is electronically supplied to the planar duct through a cold air blower and a cold air blowing pipe. This problem can be solved by spraying it onto the parts.

[Effect]

The above-mentioned cooling structure for an electronic device is such that a planar duct is formed by integrating a mounting part and a guide rail, and the printed circuit board is mounted on the guide rail. A number of blow holes having different openings for evenly removing heat generated from mounted components are formed on a surface of the planar duct facing the component mounting surface of the printed circuit board, and a cold air blower is provided in the planar duct. Cooling air from the air conditioner is blown onto electronic components through the cold air blowing pipe, allowing the installed components to operate at optimal operating temperatures and maintaining equipment reliability.

〔Example〕

FIG. 1 is a diagram illustrating a schematic configuration example of the present invention, in which fat is a perspective view and FIG. 1B is a side view of a main part.

In the figure, an electronic device 1 that houses a plurality of printed circuit boards 2 each having a large number of electronic components (not shown) mounted thereon is formed by a flat duct 5 that integrates a mounting section 13 and a guide rail 14. There are multiple (4 in the drawing) on the top of the casing.
) is attached with an exhaust fan 4 and an exhaust duct 6,
Cold air blowing vibros, 7 on both sides of the top and bottom 3 of the plane duct 5.
Attached.

The external cold air introduction source to the cold air blowing vibro, 7 is performed by an air conditioner 10 provided separately from the electronic device 1, and a connection part between the cold air blowing duct 6.7 and the air conditioner is provided with a cold air supply source. A throttle duct 8 and a cold air blower 9 are provided to increase the flow velocity.

The cooling temperature of the air conditioner 10 needs to be set to a temperature lower than the general electronic device equipment environment temperature of 30°C. Blow holes 51 having different openings are formed in the plane duct 5, the details of which will be explained in FIG. 2.

Figures 2, 3, and 4 are diagrams for explaining one embodiment of the present invention, in which Figure 2 is an exploded perspective view, Figure 3 is a side sectional view of main parts, and Figure 4 is a front view. In the main part sectional view, the same parts as in FIG. 1 are given the same reference numerals.

In the figure, a mounting part 13 for mounting a plurality of printed circuit boards 2 and a front plate 17 corresponding to the guide rail 14 are attached to the plane duct 5 on the front side, and the structure is integrated and orthogonal to the plane duct 5 on the back side. Therefore, the planar duct 5 and the printed circuit board 2 on the front side are arranged alternately, and a plurality of ventilation holes 15 are provided above where the printed circuit board 2 is inserted.

Furthermore, a socket connector 1 for connecting a printed circuit board 2 is provided.
Since the backboard 11 with the bank board 1 attached thereto is disposed on the back side of the planar duct 5 on the front side,
The orthogonal part between 1 and the plane duct 5 on the front side is the backboard 11
As shown in Fig. 3, the cold air from the flat duct 5 on the back side is sent through the upper and lower narrow parts of the flat duct 5 on the front side as shown by the arrows, increasing the flow velocity. There is.

The plane duct 5 on the front side is provided with a large number of blowing holes 51 having different openings corresponding to the electronic components 3 mounted on the printed circuit board 2, and the blowing holes 51 are connected to the plane duct 5 on the back side.
In order to evenly blow a larger amount of air onto the electronic components 3, the side closer to the flat duct 5 on the back side (backboard side) is smaller;
Although it is made larger toward the far side, the opening of the blowing hole 51 may be arbitrarily adjusted depending on the amount of heat generated by the electronic component 3.

Then, the air blown out from the blowing hole 51 and deprived of the heat generated by the electronic component 3 is exhausted to the outside of the electronic device via the exhaust duct 16 by the exhaust fan 4 described in FIG.

The reliability of the electronic component 3 (semiconductor element) is guaranteed by the junction temperature, and the general formula is: T 3 = Tr + Ts + Ri c - PLsi ・
11) Where: Tj: Junction temperature (°C) Tr: Environmental temperature (°C) Ts: Temperature rise value around the semiconductor element (°C) Ric: Thermal resistance ('C/W) Pl, si: Temperature of the element Calorific value Proving the implementation effect of the present invention (using equation 11), the thermal resistance:
150 °C/W PLsi: 230 mW, the junction temperature is: In conventional forced air cooling, assuming the installation environment temperature is 30 °C, Tj = 30 + 25 + 150 x 0. 23';90''
C If the external cold air temperature is 5°C when the present invention is applied, then Tj=5+25+150x0.23#65°C.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the ambient temperature of electronic components can be significantly reduced, so it is expected that the reliability of electronic components and devices will be improved, as well as increase in power consumption of semiconductor elements and dust intrusion. The effect of preventing this is extremely effective.

[Brief explanation of the drawing]

FIG. 1 is a diagram for explaining a schematic configuration example of the present invention (al is a perspective view, (b) is a side view of main parts, FIG. 2 is an exploded perspective view, FIG. 3 is a side sectional view of the main part, and FIG. 4 is a sectional view of the main part from the front. In the figure, 1 is an electronic device; 2 is a printed circuit board, 3 is an electronic component, 4 is an exhaust fan, 5 is a flat duct, 6.7 is a cold air blower pipe, 8 is a throttle duct, 9 is a cold air blower, 1
0 is an air conditioner, 11 is a backboard, 12 is a socket connector, 13 is a mounting shelf, 14 is a guide rail, 15 is a ventilation hole, 16 is an exhaust duct, 17 is a front plate, and 51 is a blowing hole.

Claims (1)

[Claims] A printed circuit board (
2) in a cooling structure for an electronic device in which a plurality of boards are stored and a ventilation hole is provided on the top surface, the cooling structure is installed in a flat duct (5) that integrates a mounting shelf (13) and a guide rail (14). Guide rail (
14), and a large number of blowing holes (51
), and a cold air blower (9) is installed in the plane duct (5).
and the air conditioner (
A cooling structure for an electronic device, characterized in that the cooling air of 10) is blown onto the electronic component (3).