JPH02211700A - Cooling mechanism of electronic equipment - Google Patents

Cooling mechanism of electronic equipment

Info

Publication number
JPH02211700A
JPH02211700A JP1032269A JP3226989A JPH02211700A JP H02211700 A JPH02211700 A JP H02211700A JP 1032269 A JP1032269 A JP 1032269A JP 3226989 A JP3226989 A JP 3226989A JP H02211700 A JPH02211700 A JP H02211700A
Authority
JP
Japan
Prior art keywords
air
direction control
air holes
cooling mechanism
blown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1032269A
Other languages
Japanese (ja)
Other versions
JPH0632407B2 (en
Inventor
Nobuyoshi Takagi
高木　悦義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Electronics Co
Original Assignee
Asia Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Electronics Co filed Critical Asia Electronics Co
Priority to JP1032269A priority Critical patent/JPH0632407B2/en
Publication of JPH02211700A publication Critical patent/JPH02211700A/en
Publication of JPH0632407B2 publication Critical patent/JPH0632407B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To control the direction of air and the quantity of air, and to blow air uniformly against the whole printed board by making air-hole formation density differ according to places. CONSTITUTION:A cylindrical air-direction control plate 11 with a side-wall to which a plurality of air holes 12 are bored and arranged is installed inside printed wiring boards 4, 4..., to which legs are mounted and which are disposed radially. Whole diameters are reduced upward and increased downward in said air holes 12. Air 6 from the fans 2 is blown in the direction of (a), pressure is elevated in the air-direction control plate 11, particularly on the upper side of the plate 11, and air 6 is blown off in the direction of the arrow (b) from each hole 12, but hole diameters are reduced upward and enlarged downward in the air holes 12, thus keeping the quantity of air blown off from the inside of the air-direction control plate 11 constant in upper and lower sections, then uniformly cooling each printed wiring board 4 as a whole.

Description

【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は電子機器の冷却機構に関し、特にＩＣテスタ装
置のテストヘッド冷却機構として使用されるものである
。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a cooling mechanism for electronic equipment, and is particularly used as a test head cooling mechanism for an IC tester.

（従来の技術） 近時、ＩＣテスタ装置のテストヘッドは小形化、高速化
の傾向にあり、このテストヘッドを構成する半導体集積
回路素子等による発熱を効率よく装置外に導き出し、さ
らに温度分布を均一にしなければならない。(Prior art) In recent years, the test heads of IC tester equipment have become smaller and faster, and the heat generated by the semiconductor integrated circuit elements that make up the test head can be efficiently guided out of the equipment and the temperature distribution can be further improved. It has to be uniform.

第２図（ａ）は従来のテストヘッド！本体（３１Δ１り
部）１の平面的構成図、同図（ｂ）は同図（ａ）の断面
的側面図で、２は冷却用ファン、３は筒状部、４はその
まわりに放射状に配列された印刷配線板（プリント基板
）、５はファン２からの風６を導く通風部（すき間）で
ある。Figure 2 (a) is a conventional test head! A planar configuration diagram of the main body (31Δ1 portion) 1, FIG. The arranged printed wiring boards (printed circuit boards), 5 are ventilation parts (gap) that guide the wind 6 from the fan 2.

（発明が解決しようとする課題） 従来のテストヘッドはファン２によって、第２図の如く
強制的に通風していたため、風の直進性によって印刷配
線板２の上部部分に風６が強く吹きつけられ、風６の流
れが不均一になっていた。(Problem to be Solved by the Invention) In the conventional test head, the fan 2 forced ventilation as shown in FIG. As a result, the flow of wind 6 was uneven.

従って放熱効果、温度分布が均一でないため、計Δ１リ
データにばらつきがあり、安定した精度を確保できない
欠点があった。Therefore, since the heat dissipation effect and temperature distribution are not uniform, there are variations in the total Δ1 redata, and there is a drawback that stable accuracy cannot be ensured.

そこで本発明の目的は、ＩＣテスタ装置のテストヘッド
の如き電子機器の印刷配線板に、全体的に均等に風を送
ることによって、温度上昇が均一化されるようにしたも
のである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to uniformize the temperature rise by uniformly blowing air over the entire printed wiring board of an electronic device such as a test head of an IC tester.

〔発明の＋＋ｌ）成〕[++l) formation of invention]

（課題を解決するための手段と作用） 本発明は、配列された複数の印刷配線板に沿い筒状の風
向制御板を配置し、この風向制御板の側壁には複数の風
孔が開口かつ配列され、前記筒状の風向制御板内に送風
する送風手段を具備し、前記風孔はその設置場所によっ
て不規則に設けられていることを特徴とする電子機器の
冷却機構である。(Means and effects for solving the problem) The present invention includes a cylindrical wind direction control board arranged along a plurality of arranged printed wiring boards, and a plurality of air holes opened and opened in the side wall of this wind direction control board. The cooling mechanism for electronic equipment is characterized in that the air blowing means is arranged to blow air into the cylindrical air direction control plate, and the air holes are provided irregularly depending on the installation location.

即ち本発明は、風向制御板の風孔を、その設置場所によ
って不規則に設け、例えば設置場所によって孔径を異な
らせたり、風孔設置密度を場所によって異ならせたりす
ることにより、風向及び風量を制御し、印刷基板全体に
均一に風を当てられるようにしたものである。That is, the present invention makes it possible to control the wind direction and air volume by providing the air holes of the wind direction control board irregularly depending on the installation location, for example, by varying the hole diameter depending on the installation location, or by varying the installation density of the air holes depending on the installation location. This allows the air to be applied uniformly to the entire printed circuit board.

（実施例） 以下図面を参照して本発明の一実施例を説明する。第１
図（ａ）は同実施例の平面的ＪＡＩ＋−成図、同図（ｂ
）は同断面的側面図、同図（Ｃ）は同構成の要部拡大図
であるが、これは第２図のものと対応させた場合の例で
あるから、対応個所には同一符号を付して説明を省略し
、特徴とする点を説明する。本実施例の特徴は、放射状
に立脚配置された印刷配線板４，４．・・・の内側に、
複数の風孔１２が開口かつ配列された側壁を有する筒状
の風向制御板１１を設けたことてあり、また上記風孔１
２は、第１図（ｃ）にも示される如く上に行くほど孔径
を小さく、下に行くほど孔径を大きくしたことである。(Example) An example of the present invention will be described below with reference to the drawings. 1st
Figure (a) is a planar JAI+- diagram of the same example, and Figure (b)
) is a cross-sectional side view of the same, and figure (C) is an enlarged view of the main parts of the same configuration, but since this is an example of a case where it corresponds to that in Figure 2, corresponding parts are given the same reference numerals. The description will be omitted and the characteristic points will be explained. The feature of this embodiment is that printed wiring boards 4, 4. Inside the...
A cylindrical wind direction control plate 11 having a side wall in which a plurality of air holes 12 are opened and arranged is provided.
2, as shown in FIG. 1(c), the pore diameter is made smaller as it goes up, and becomes larger as it goes down.

この風向制御板１１の天井は蓋された形になっている。The ceiling of this wind direction control board 11 is covered.

第１図において、ファン２からの風６はａ方向に吹きつ
けられ、風向制御板１１内で特にその上側で圧力を上げ
、名札１２から矢印す方向（直進方向）に風６か吹き出
すか、風孔］２は、上へ行くほど小さく、下へ行くほと
孔径が大きくなっているため、風向制御板］］内から吹
き出す風量は上、下一定であり、従って各印刷配線板４
は、全体的に均一に冷却されるものである。In FIG. 1, the wind 6 from the fan 2 is blown in the direction a, and the pressure is increased in the wind direction control board 11, especially above it, and the wind 6 is blown out from the name tag 12 in the direction indicated by the arrow (straight direction). Since the diameter of the air holes 2 becomes smaller toward the top and becomes larger toward the bottom, the amount of air blown from inside the wind direction control board is constant at the top and bottom, and therefore each printed wiring board 4
is cooled uniformly throughout.

なお本発明は上記実施例に限られず種々の応用が可能で
ある。例えば実施例では、本発明をＩＣテスタ装置のテ
ストヘッドに適用したが、その他発熱物体が装置内部に
あり、その外側を架で囲う電子機器などで冷却効果をも
たせ、さらに冷却効果を均一にしたいものにも適用でき
る。また本発明にあっては、例えば風向制御板の風孔の
配置密度を上にいくほど小に、下に行くほど大にしても
、実施例と同様に風量一定の効果が得られる。Note that the present invention is not limited to the above embodiments, and can be applied in various ways. For example, in the embodiment, the present invention was applied to the test head of an IC tester device, but there are other heat-generating objects inside the device, and it is desired to provide a cooling effect by using an electronic device or the like that is surrounded by a rack on the outside, and to further make the cooling effect uniform. It can also be applied to things. Further, according to the present invention, even if the arrangement density of the air holes of the wind direction control plate is made smaller as it goes upwards and becomes larger as it goes downwards, the effect of keeping the air volume constant can be obtained as in the embodiment.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く本発明によれば、熱源となる印刷配線
板の冷却効果が良くなり、しかも温度上昇分布が均一化
されるものである。As explained above, according to the present invention, the cooling effect of the printed wiring board serving as the heat source is improved, and the temperature rise distribution is made uniform.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）は本発明の一実施例の平面的構成図、第１
図（ｂ）は同断面的側面図、第１図（Ｃ）は同要部拡大
図、第２図（ａ）は従来機構の平面的構成図、第２図（
ｂ）は同断面的側面図である。 １・・・テストヘッド計測部、２・・・ファン、４・・
・印刷配線板、５・・・すき間、１１・・・風向制御板
、１２・・・風孔。FIG. 1(a) is a planar configuration diagram of an embodiment of the present invention.
Figure (b) is a cross-sectional side view of the same, Figure 1 (C) is an enlarged view of the same main part, Figure 2 (a) is a planar configuration diagram of the conventional mechanism, Figure 2 (
b) is the same cross-sectional side view. 1...Test head measurement section, 2...Fan, 4...
- Printed wiring board, 5... Gap, 11... Wind direction control board, 12... Air hole.

Claims (3)

【特許請求の範囲】[Claims] （１）配列された複数の印刷配線板に沿い筒状の風向制
御板を配置し、この風向制御板の側壁には複数の風孔が
開口かつ配列され、前記筒状の風向制御板内に送風する
送風手段を具備し、前記風孔はその設置場所によって不
規則に設けられていることを特徴とする電子機器の冷却
機構。(1) A cylindrical wind direction control board is arranged along a plurality of arranged printed wiring boards, and a plurality of air holes are opened and arranged in the side wall of this wind direction control board, and inside the cylindrical wind direction control board. 1. A cooling mechanism for electronic equipment, comprising an air blowing means for blowing air, and the air holes are provided irregularly depending on the installation location. （２）前記風孔はその設置場所によって孔径が異なるも
のであることを特徴とする請求項１に記載の電子機器の
冷却機構。(2) The cooling mechanism for an electronic device according to claim 1, wherein the air hole has a hole diameter that differs depending on the installation location. （３）前記風孔はその設置場所によって設置密度が異な
るものであることを特徴とする請求項１に記載の電子機
器の冷却機構。(3) The cooling mechanism for electronic equipment according to claim 1, wherein the air holes have different installation densities depending on their installation locations.
JP1032269A 1989-02-10 1989-02-10 Cooling mechanism for electronic devices Expired - Lifetime JPH0632407B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1032269A JPH0632407B2 (en) 1989-02-10 1989-02-10 Cooling mechanism for electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1032269A JPH0632407B2 (en) 1989-02-10 1989-02-10 Cooling mechanism for electronic devices

Publications (2)

Publication Number Publication Date
JPH02211700A true JPH02211700A (en) 1990-08-22
JPH0632407B2 JPH0632407B2 (en) 1994-04-27

Family

ID=12354282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1032269A Expired - Lifetime JPH0632407B2 (en) 1989-02-10 1989-02-10 Cooling mechanism for electronic devices

Country Status (1)

Country Link
JP (1) JPH0632407B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742184U (en) * 1991-02-18 1995-07-21 アジアエレクトロニクス株式会社 Electronic device cooling device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758686A (en) * 1980-07-25 1982-04-08 Schwabe Willmar Aminodesoxy-1,4;3,6-dianhydrohexitol nitrate, preparation and drug composition
JPS6338300A (en) * 1986-08-01 1988-02-18 富士通株式会社 Structure for cooling electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758686A (en) * 1980-07-25 1982-04-08 Schwabe Willmar Aminodesoxy-1,4;3,6-dianhydrohexitol nitrate, preparation and drug composition
JPS6338300A (en) * 1986-08-01 1988-02-18 富士通株式会社 Structure for cooling electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742184U (en) * 1991-02-18 1995-07-21 アジアエレクトロニクス株式会社 Electronic device cooling device

Also Published As

Publication number Publication date
JPH0632407B2 (en) 1994-04-27

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