JPH0370196A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPH0370196A JPH0370196A JP20631989A JP20631989A JPH0370196A JP H0370196 A JPH0370196 A JP H0370196A JP 20631989 A JP20631989 A JP 20631989A JP 20631989 A JP20631989 A JP 20631989A JP H0370196 A JPH0370196 A JP H0370196A
- Authority
- JP
- Japan
- Prior art keywords
- fan
- screening plate
- substrate
- electronic components
- wind
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000005192 partition Methods 0.000 claims description 19
- 238000007664 blowing Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 2
- 238000012216 screening Methods 0.000 abstract 7
- 238000005422 blasting Methods 0.000 abstract 3
- 230000000644 propagated effect Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000009499 grossing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は一対の基板を対向状に配置した電子装置に間す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device in which a pair of substrates are arranged facing each other.
従来装置を第４図、第５図に示す。この装置は一対の基
板１Ｏ１１７をもつ。一方の入力用の基板４の片面には
、整流用ダイオードスタック５、平滑用電解コンデンサ
２．３、ノイズ用フィルターコイル７、リレー９などが
装着されている。もう一方の出力用の基板１７０片面に
は、主スイツチングトランジスタ２２、出カドランス１
３、チョークコイル１１．１２、電解コンデンサ１５．
１６などが装着されている。この様な２枚の基板４．１
７を対向状に配置したものを、ケース１８に装着した冷
却用のファンｌとケース１８に設けた風穴１９を使って
冷却する。A conventional device is shown in FIGS. 4 and 5. This device has a pair of substrates 1O117. A rectifying diode stack 5, a smoothing electrolytic capacitor 2.3, a noise filter coil 7, a relay 9, etc. are mounted on one side of the input substrate 4. On one side of the other output substrate 170, there is a main switching transistor 22, an output transistor 1
3. Choke coil 11.12, Electrolytic capacitor 15.
16 etc. are installed. Two boards like this 4.1
7 are arranged facing each other and are cooled using a cooling fan l attached to a case 18 and an air hole 19 provided in the case 18.
前記従来のものではファント風穴１９間の通風で、基板
４．１７を一様に冷却する。そのいずれか一方側の冷却
を強め（他方側を弱め）ることは困難である。このため
、共通なファン１のそれ全体の送風能力は十分であるに
もかかわらず、何れか一方の基板４または１７の電子部
品がその定格値よりも過熱するという問題が生ずる。In the conventional device, the substrate 4.17 is uniformly cooled by ventilation between the fan air holes 19. It is difficult to strengthen cooling on either side (weaken the other side). For this reason, even though the overall air blowing capacity of the common fan 1 is sufficient, a problem arises in that the electronic components of either one of the boards 4 or 17 become overheated beyond their rated values.
本発明は共通なファンの送風能力を配分可能にすること
を目的とする。An object of the present invention is to make it possible to allocate the air blowing capacity of a common fan.
一対の基板の間に、その間を仕切る仕切り板を配置する
。また、仕切り板の側縁でファンの送風面を分割する。A partition plate is placed between the pair of substrates to partition the space between them. In addition, the fan's air blowing surface is divided by the side edges of the partition plate.
ファンによる送風の一部は仕切り板の一方の片面と一方
の基板の間を通過する。これにより該基板の電子部品が
冷却される。仕切り板のもう一方の片面、もう一方の基
板、その間の電子部品についても事情は同じである。か
くして、ファンによる送風は仕切り板の両側でなされる
。その間の送風量の比はファン送風面の仕切り板１！１
＆ｌによる分割比に応じる。A portion of the air blown by the fan passes between one side of the partition plate and one of the substrates. This cools the electronic components of the board. The same situation applies to the other side of the partition plate, the other board, and the electronic components between them. Thus, air is blown by the fan on both sides of the partition plate. The ratio of air flow between them is 1:1 on the partition plate on the fan air blowing surface.
According to the division ratio by &l.
以下本発明の一実施例を第１図、第２図により説明する
。入力用の基板４０片面には！！流用ダイオードスタッ
ク６、平滑用電解コンデンサ２．３、ノイズ用フィルタ
ーコイル７、リレー９などが付属する。出力用の基板１
７には主スイツチングトランジスタ２２、出カドランス
１３、チョークコイル１１．１２、電解コンデンサ１５
．１６などが付属する。この様な２枚の基板４．１７が
互いに上下向かい合いとなる取付は構造において、２枚
の基板４．１７の間に仕切り板４を配置する。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. On one side of the input board 40! ! A diode stack 6, a smoothing electrolytic capacitor 2.3, a noise filter coil 7, a relay 9, etc. are included. Output board 1
7 includes a main switching transistor 22, an output transformer 13, a choke coil 11.12, and an electrolytic capacitor 15.
．． 16 etc. are included. In such an installation in which two substrates 4.17 are vertically opposed to each other, the partition plate 4 is disposed between the two substrates 4.17.
これは各電子部品が基板４．１７閏にあるような対向状
の配置である。かかる配置でケース１日に収納される。This is a face-to-face arrangement such that each electronic component is on a board 4.17 leapfrog. With this arrangement, the cases are stored in one day.
１はケース１８の一側に取付けられた冷却用のファン、
１９はケース１８の別の一例に多数、均等に設けられた
風穴である。1 is a cooling fan attached to one side of the case 18;
Reference numeral 19 denotes a large number of evenly spaced air holes in another example of the case 18.
１０は基板４．１７閏に配置された仕切り板である。こ
の仕切り板１０は一方の基板４とその電子部品を、他方
の基板１７とその電子部品に対して仕切る。仕切り板１
０のファン１例の側６１１０−はファン１に隣接し、そ
の送風面を分割する。Reference numeral 10 denotes a partition plate placed on the board 4.17. This partition plate 10 partitions one board 4 and its electronic components from the other board 17 and its electronic components. Partition plate 1
Side 6110- of example fan 0 is adjacent to fan 1 and divides its blowing surface.
この分割比に応じて、基板４（１０）側に回り込む風量
が加減される。側［１１０−は第２１！ｌのように送風
面に対して直角であるが、第３図のように側縁１０−を
曲げて分割比を変えることもできる。Depending on this division ratio, the amount of air flowing around to the substrate 4 (10) side is adjusted. Side [110- is the 21st! Although it is perpendicular to the air blowing surface as shown in FIG. 1, the division ratio can also be changed by bending the side edge 10- as shown in FIG.
本実施例における仕切り板１０は金属製であって、シー
ルド板としての役目を兼ねる。これは出力側の基板１７
の放射雑音が入力端の基板４へ伝わるのを遮断する。仕
切り板１０を絶縁するか、もともと絶縁性のものを使え
ば上下の電子部品間の絶縁（絶縁距離を長くすること）
に役立つ。The partition plate 10 in this embodiment is made of metal and also serves as a shield plate. This is the output side board 17
The transmission of the radiation noise to the board 4 at the input end is blocked. If you insulate the partition plate 10 or use something that is originally insulating, you can insulate the upper and lower electronic components (increase the insulation distance)
useful for.
風は電子部品相互の隙間を介してファンｌから風穴１９
に向かう。あるいは逆の向きに流れる。Air flows from the fan l through the gap between the electronic components to the air hole 19.
Head to. Or it flows in the opposite direction.
然して、各電子部品の高さがまちまちで、渦ができたり
して流れが乱れる。仕切り板１０はこの乱れを防′ぐ整
風板としても機能する。However, the heights of the electronic components vary, creating vortices and disrupting the flow. The partition plate 10 also functions as a wind regulating plate to prevent this disturbance.
本発明はファンの送風面を分割する仕切り板を利用した
もので、各基板に向かう送風量の比率を簡単に変えるこ
とが可能である。このため、ファンの能力を有効に活用
することができるなどの効果が得られる。The present invention utilizes a partition plate that divides the air blowing surface of the fan, and it is possible to easily change the ratio of the amount of air blown to each board. Therefore, effects such as being able to effectively utilize the capacity of the fan can be obtained.
第１図は本発明装置を透視状に示した斜視図、第２図は
その断面図、第３図は他の実施例を示す同様の断面図、
第４図は従来装置を透視状に示した斜視図、第５図はそ
の断面図である。
１・・・ファン、２．３．１５．ＩＢ・・・電解コンデ
ンサ、４・・・入力端の基板、５・・・整流ダイオード
スタック、６．８・・・フィルムコンデンサ、７・・・
フィルターチョーク、９・・・リレー、１０・・・仕切
り板、１〇−・・・そのＩ１１縁、１１１２・・・チョ
ーク、１３・・・発振トランス、１４・・・抵抗、１７
・・・出力側の基板、１８・・・ケース、１９・・・風
穴、２０．２１・・・放射板。FIG. 1 is a perspective view of the apparatus of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a similar sectional view showing another embodiment.
FIG. 4 is a perspective view of the conventional device, and FIG. 5 is a sectional view thereof. 1...Fan, 2.3.15. IB... Electrolytic capacitor, 4... Input end board, 5... Rectifier diode stack, 6.8... Film capacitor, 7...
Filter choke, 9... Relay, 10... Partition plate, 10-... Its I11 edge, 1112... Choke, 13... Oscillation transformer, 14... Resistor, 17
...Output side board, 18...Case, 19...Air hole, 20.21...Radiation plate.
Claims (1)
電子部品が基板相互間にあるように対向状に配置し、そ
れらをケースに収納し、ケースに冷却用のフアンを取付
けたものにおいて、前記一対の基板の間に、その間を仕
切る仕切り板を配置し、前記仕切り板の側縁を、前記フ
アンの送風面を分割するように該フアンに隣接させたこ
とを特徴とする電子装置。1. A pair of boards with electronic components mounted on one side are arranged facing each other so that the electronic parts are between the boards, and they are housed in a case, and a cooling fan is attached to the case. 1. An electronic device, characterized in that a partition plate is disposed between a pair of substrates, and a side edge of the partition plate is adjacent to the fan so as to divide the air blowing surface of the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20631989A JPH0370196A (en) | 1989-08-09 | 1989-08-09 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20631989A JPH0370196A (en) | 1989-08-09 | 1989-08-09 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0370196A true JPH0370196A (en) | 1991-03-26 |
Family
ID=16521332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20631989A Pending JPH0370196A (en) | 1989-08-09 | 1989-08-09 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0370196A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008059985A (en) * | 2006-09-01 | 2008-03-13 | Matsushita Electric Ind Co Ltd | Induction heating cooker |
| JP2008140801A (en) * | 2006-11-30 | 2008-06-19 | Mitsubishi Electric Corp | Choke coil unit, and power apparatus employing it |
| JP2016106426A (en) * | 2010-04-23 | 2016-06-16 | ナパテック アクティーゼルスカブ | Thermal control-type assembly |
| JP2020150124A (en) * | 2019-03-13 | 2020-09-17 | Fdk株式会社 | Electronic apparatus |
-
1989
- 1989-08-09 JP JP20631989A patent/JPH0370196A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008059985A (en) * | 2006-09-01 | 2008-03-13 | Matsushita Electric Ind Co Ltd | Induction heating cooker |
| JP2008140801A (en) * | 2006-11-30 | 2008-06-19 | Mitsubishi Electric Corp | Choke coil unit, and power apparatus employing it |
| JP2016106426A (en) * | 2010-04-23 | 2016-06-16 | ナパテック アクティーゼルスカブ | Thermal control-type assembly |
| JP2020150124A (en) * | 2019-03-13 | 2020-09-17 | Fdk株式会社 | Electronic apparatus |
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