JPH11224989A - Case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep a case high in heat dissipating properties, even if a communication equipment or books are placed on it by a method wherein the parallel bent corners of a case are rounded, and a vent hole is provided to the rounded parallel bent corners respectively. SOLUTION: An arc R is provided to the bent corners C of a case 10 respectively for rounding, and vent holes 11 and 12 are each provided to the bent corners C rounded like an arc R. A stepped part may be provided to the bent corners C of the case in place of an arc R. The vent holes 11 and 12 are provided to the diagonally arranged bent corners C of the case, and a flow of air is moved along a long path along a board, so that a heat, releasing body mounted on the board can be cooled down by a flow of air. Through this setup, the vent holes 11 and 12 are hardly stopped up, even if a communication equipment and books are placed on the case 10, and the case 10 can be kept high in an air-cooling effect. The parallel bent corners C of the case 10 are arranged diagonally, and a flow of air is moved along a long path along a board, so that a heat releasing body mounted on the board can be air cooled down.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cooling inside a housing containing a heating element, particularly to air cooling.

[0002]

2. Description of the Related Art For example, ventilation holes are usually provided on the top and side surfaces of a housing for heat radiation from inside a housing for housing electronic components that may generate heat. FIG. 9 shows a case where a ventilation hole 91 is provided on the upper surface of a housing 90. FIG.
0 is provided with a ventilation hole 101 on the side surface of the housing 100. Further, what is shown in FIG. 11 is what is called FIG. 9 and FIG.
In the figure, a ventilation hole 111 is provided on the upper surface of the housing 110, and a ventilation hole 112 is provided on the side surface thereof.

[0003]

When a ventilation hole is provided on the upper surface of a housing, a communication device, a book, and the like are often placed on the housing, and the ventilation hole is easily blocked. If the ventilation holes are provided on the side surface of the housing, it is likely to be blocked by a wall or the like, and neither can provide a sufficient heat radiation effect. In addition, if a ventilation hole is provided on the upper surface of the housing, dust may fall from the ventilation hole when a substrate having a heating element is installed below the ventilation hole, which may cause malfunction.

[0004]

According to the present invention, there is provided a housing having a slope in a parallel bent portion of the housing and a ventilation hole provided in the slope. The parallel bent portion of the housing may be in the diagonal direction of the housing, or may have a ventilation hole in the parallel bent portion of the housing sharing the upper surface of the housing, and may be formed in a plane perpendicular to the upper surface. It has a ventilation hole. A projection is provided around an upper portion of a ventilation hole provided on a plane perpendicular to the upper plane, and the projection is an eave. The inclination of the casing is an arc, and the board is accommodated in a region other than the projection range of the upper ventilation hole in the vertical direction when the casing is placed in a normal state.

[0005]

1 and 2 show a case 10 in which a bent portion C of a casing 10 has an arc R formed as a gradient, and a vent hole 11 and a vent hole 12 are formed at the arc R. Is provided. The gradient may be stepped, and is not limited to the arc R. The air holes 11 and the air holes 12 correspond to diagonal directions of the housing 10, and the air flow 14 moves along a long path along the substrate 13,
The heating element (not shown) mounted on the substrate 13 can be air-cooled.

FIGS. 3 and 4 show a housing 3.
0, the parallel bent portion C of the housing 30 as if sharing the upper plane.
Has a vent hole 32 and a vent hole 33 and a vent hole 34 in a plane perpendicular to the upper plane. A projection called an eave 35 is provided around the upper portion of the ventilation hole 34 to prevent intrusion of dust. Airflow 37
Can enter the air hole 34 and move along the substrate 36, and escape from the air hole 32 and the air hole 33 to the outside, thereby air-cooling a heating element (not shown) mounted on the substrate 36. You can do it.

FIGS. 5 and 6 show a housing 5.
0, the parallel bent portion C of the housing 50 as if sharing the upper plane.
And a pair of ventilation holes 54 and 55 on a plane perpendicular to the upper plane. A projection called an eave 56 is provided around an upper portion of the ventilation hole 54 and the ventilation hole 55 to prevent dust from entering. The airflow 58 enters through the ventilation holes 54 and 55 and moves along the substrate 57, and passes through the ventilation holes 52 and 53 to the outside, so that a heating element (not shown) mounted on the substrate 57. Can be air-cooled.

In each case, the board is housed in the housing, but the board is housed outside the projection range of the upper ventilation hole in the vertical direction when the housing is placed in a normal state. In FIG. 7, the vent hole 71 provided in the housing 70 is provided at a position where the vent hole is opened.
A substrate is accommodated in a region other than the projection range of No. 1. Also,
In FIG. 8, the vent hole 81 provided in the housing 80 accommodates a substrate at a position where the vent hole is opened, except for the projection range of the vent hole 81.

[0009]

According to the present invention, since a parallel bent portion of the housing has a slope and a ventilation hole is provided in the slope, even if a communication device or a book is placed on the housing. The air holes are not blocked, and a sufficient air cooling effect can be obtained. Also,
Since the parallel bent part of the case is in the diagonal direction of the case,
The air flow moves along a long path along the substrate and can air-cool a heating element mounted on the substrate. In addition, since the casing has a ventilation hole in a parallel bent portion of the casing sharing the upper plane, and has a ventilation hole in a plane perpendicular to the upper plane, sufficient air cooling can be achieved even if the casing is mounted on a wall, for example. It is possible.

[0010] Further, since a projection such as an eave is provided around the upper portion of the ventilation hole provided on a plane perpendicular to the upper plane, even if the housing is adjacent to other equipment, air is sufficiently introduced into the housing to allow air cooling. You can do it. Since the slope at the bent portion of the housing is an arc, the housing can be processed relatively easily. In addition, since the board is housed outside the projected range of the upper vent in the vertical direction when the housing is placed in a normal state, dust is more likely to pass through the vent than in the case where there is a vent on the top of the housing. Is less likely to fall and cause malfunction.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a configuration in an embodiment of the present invention.

FIG. 2

FIG. 1 is a schematic diagram of an airflow in a housing shown in FIG.

FIG. 3 is a schematic perspective view showing a configuration in another embodiment of the present invention.

FIG. 4

FIG. 3 is a schematic diagram of an airflow in a housing shown in FIG.

FIG. 5 is a schematic perspective view showing a configuration in another embodiment of the present invention.

FIG. 6

FIG. 5 is a schematic diagram of an airflow in a housing shown in FIG.

FIG. 7 is a schematic cross-sectional view showing a configuration in an example of the present invention.

FIG. 8 is a schematic sectional view showing a configuration according to another embodiment of the present invention.

FIG. 9 is a schematic perspective view showing a housing in a conventional example.

FIG. 10 is a schematic perspective view showing another housing in the conventional example.

FIG. 11 is a schematic perspective view showing another housing in the conventional example.

[Explanation of symbols]

C: bent portion R: arc 10, 30, 50, 70, 80: housing 11, 12, 32, 33, 34, 52, 53, 54, 5
5, 71, 81: Vent holes 14, 37, 58: Airflow 13, 36, 57, 72, 82: Substrate 35, 56: Eaves

Claims (7)

[Claims] 1. A housing characterized in that a parallel bent portion of the housing has a slope and a ventilation hole is provided in the slope. 2. The housing according to claim 1, wherein the parallel bent portions of the housing are in a diagonal direction of the housing. 3. The case according to claim 1, wherein the case has an air hole in a parallel bent portion of the case that shares the upper surface of the case, and has an air hole in a plane perpendicular to the upper surface. 4. The housing according to claim 3, wherein a projection is provided around an upper portion of the ventilation hole provided on a plane perpendicular to the upper plane. 5. The housing according to claim 4, wherein the projection is an eave. 6. The housing according to claim 1, wherein the slope is a circular arc. 7. The housing according to claim 1, wherein the substrate is accommodated in a region other than a projection range of the upper ventilation hole in a vertical direction when placed in a normal state.