JPS6011840B2 - Cooling structure of electronic circuit package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling structure for an electronic circuit package used in electronic devices and the like.

Conventionally, electronic devices such as computers that consist of a large number of elements have multiple electronic circuit packages mounted on printed wiring boards with multiple electronic components mounted on them, and the packages are cooled by forced air cooling using a blower. is being carried out.

Since the amount of heat generated by each conventional electronic component is almost the same, it can be assumed that the heat density on the printed wiring board is also almost uniform.
Each electronic circuit package is cooled using a specified uniform air velocity.

However, due to the high integration of logic elements and the high density mounting of electronic components, electronic circuit packages are being used in which electronic components that generate a large amount of heat and conventional electronic components that generate a relatively low amount of heat are mounted on the printed wiring slope. Currently, traditional packaging has the following drawbacks:

In other words, if uniform air was supplied as in the past, a large amount of air would have to be applied to the entire electronic circuit package in order to keep the high heat generating components below the specified temperature, which would require a large amount of airflow. do.

Additionally, parts with low heat generation will be overcooled. Furthermore, in order to supply a large amount of air, it is necessary to increase the size of the blower, which causes various problems such as an increase in noise. As a countermeasure to these problems, a structure is adopted in which a heat sink is attached to reduce the thermal resistance.However, the size of the heat sink is limited by the requirements for high-density mounting and the structure of electronic components, so it cannot be increased without limit. It is not possible. SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling structure for an electronic circuit package that eliminates the above-mentioned drawbacks.

The cooling structure of the present invention includes a plurality of electrical components mounted on a printed wiring board, each of which has a flat board perpendicular to the printed wiring board along a component row in which components with a high heat generation amount are arranged. In order to introduce the air sent from the blower into the component row and cool the components that generate a high amount of heat, one end of each of the flat plates is bent outward by a predetermined angle, and one end of the A predetermined portion is bent outward by a predetermined angle, a plurality of holes are provided in one end portion of the bracket, and the plurality of holes are inserted into a plurality of components having a low heat generation value mounted on the printed wiring slope outside each of the flat plates. It has a configuration in which air is sent through the air to cool the parts. Next, the present invention will be explained in detail with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of the present invention.

In this embodiment, along a component row in which components 3 having a high heat generation amount among a plurality of electrical components mounted on a printed wiring board 1 are lined up, a flat plate is placed perpendicularly to the printed wiring board 1 on both sides of this component row. 5 is installed on each flat plate in order to introduce wind (sent from the direction of the arrow in the figure) from a blower (not shown) into the component rows to cool the components 3 that generate a high amount of heat. Fold one end of 5 outward by a predetermined angle,
Furthermore, a predetermined component at one end is bent outward by a predetermined angle, a plurality of holes 6 are provided in one end of the bracket, and a plurality of low heat generation components are mounted on the printed wiring board 1 on the outside of each flat plate 5. It has a configuration in which air is sent to the component 2 through a plurality of holes 6 to cool the component 2. Here, the size of the hole 6 is determined according to the amount of heat generated by the low heat generation component 2.

Air is supplied to the three rows of high heat generating components in a narrowed manner through a figure-of-eight portion 5' formed by one end of the two flat plates 5. In other words, the wind other than the wind passing through the holes 6 flows to the three rows of high-heat-generating parts.Moreover, the two flat plates 5 provided along the parts 3 prevent the wind from leaking on the way, resulting in a high wind speed. It will be done. Here, v and S are the wind speed necessary for cooling the low calorific value component 2 and the cross-sectional area to which the wind is supplied, respectively, and the wind speed and cross-sectional area to which the wind is supplied necessary for cooling the high calorific value component 3 are v and S, respectively. v2 and S2 (
However, v. <v2), the amount of air required to cool the conventional package Q. is Q,=v2(S, 10S
2) Furthermore, the amount of consideration Q2 required to cool the package to which the present invention is applied is Q2=v,S, 10vbu2, and it is clearly seen that Q,>Q2.

That is, in this embodiment, the components mounted on the electronic circuit package can be cooled to below the specified temperature with a smaller air volume. FIG. 2 is a diagram showing a second embodiment of the present invention.

This embodiment includes a printed wiring board 1, a low calorific value component 2,
It is composed of a high heat generating component 3, a connector 7 for electrically connecting the component and the printed wiring board 1, a heat sink 4, and a flat plate 5. Figure 3 is A- in Figure 2.
It is an A' sectional view.

The size of the heat sink 4 is limited by the structure of the connector 7, and if the flat plate 5 is not provided, the air flowing through the shaded area in FIG. 3 will not contribute to cooling at all. However, in this embodiment, in which a flat plate is provided near the heat sink 4 along three rows of high-heat-generating components, the wind flowing through the diagonal area is also moved to the heat sink 4 by the figure-of-eight portion 5'.
Since the air flows nearby, the wind speed increases, making it possible to cool parts that generate a larger amount of heat. As described above, the present invention has the effect that it is possible to improve the cooling efficiency of an electronic circuit package in which high heat generating components and the like are mounted.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the present invention, and FIG. 2 is a diagram showing a second embodiment of the present invention.
The figure showing this embodiment and FIG. 3 are cross-sectional views taken along line A-A' in FIG. In the figure, 1... printed wiring board, 2...
...Low calorific value parts, 3...Retracted heat value parts, 4
...Heat sink, 5...Duct, 5'...
...Figure-of-eight portion, 6...hole, 7...connector. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. In a cooling structure for cooling an electronic circuit package in which a plurality of electrical components are mounted on a printed wiring board using an air blower, components having a high calorific value among the plurality of electrical components mounted on the printed wiring board are arranged side by side. A flat plate is provided perpendicularly to the printed wiring board on both sides of the component row along the component row, and air blown from the blower is introduced into the component row to cool the components that generate a high amount of heat. To do this, one end of each of the flat plates is bent outward by a predetermined angle, and a predetermined portion of this one end is further bent outward by a predetermined angle, and a plurality of holes are provided in the one end portion so that the outside of each of the flat plates is bent. A cooling structure for an electronic circuit package, characterized in that air is sent through the plurality of holes to cool the plurality of components having a low calorific value mounted on the printed wiring board.