JPH05251883A - Cooling mechanism for electronic device - Google Patents

Abstract

PURPOSE:To evenly cool all highly heat generating electronic circuit parts by providing a fin plate having a V-shaped heat radiating fin. CONSTITUTION:Multiple heat radiating fins 8a are arranged in parallel with specified intervals so that they farm a V-shape in a plane on a square-shaped fin plate 8. To cool a highly heat generating electronic circuit parts 4, a cooling air current is generated and supplied to the fin plate 8 of respective highly heat generating electronic circuit parts 4 from nozzles 7 through a cooling duct. Then, the cooling air current colliding with the fin plate 8, with the help of sucking upward current produced by an exhaust fan 9, goes up along the V-shaped heat radiating fins 8a whose open ends face upward, and at the same time, branches into left and right, and then pushed out of the area of the fin plate 8. Further, it is exhausted out of the system through gaps s that exist between adjoining nozzles 7. As a result, all highly heat generating electronic circuit parts are evenly cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an impinging jet type cooling device for directly cooling a high heat generating electronic circuit component mounted on a printed circuit board with an air stream for forced cooling.

[0002]

2. Description of the Related Art In recent years, in general electronic devices, the speeding up and cost reduction of systems have been advanced, and along with that, the high integration of internal electronic circuit parts has been developed. For this reason, the amount of heat generated by the electronic circuit component is significantly increased, and efficient cooling of the component is a problem. As this cooling method, there has been a shift from conventional natural air cooling to forced air cooling, but among them, the collision jet cooling method that blows an air current vertically to high heat generating electronic circuit components mounted flat on the printed circuit board is effective. Is.

An example of the collision jet cooling mechanism will be described with reference to FIG. A backboard 3 is installed on the back side of a shelf 2 housed in a stacked manner in a cabinet 1, and a plurality of electronic circuit components 4 having high heat generation are arranged in parallel in a matrix in a planar manner on the surface thereof. There is. Cabinet 1
Inside the cooling duct 6 with a blower fan 5 at the bottom
Is provided, and a plurality of nozzles 7 formed on one surface of the nozzle are attached so as to face each of the high heat generating electronic circuit components 4. With this configuration, the cooling airflow formed by the blower fan 5 is blown vertically to each high heat generating electronic circuit component 4 through each nozzle 7 to cool it.

[0004]

Conventionally, a fin plate 8 having a large number of heat radiation fins 8a arranged in parallel as shown in FIG. 7 is mounted on the heat transfer surface of the high heat generating electronic circuit component 4. The heat generated from the circuit component 4 is transferred to the surface of the heat radiation fin to improve the cooling efficiency. Usually, as shown in FIGS. 8 and 9, the fin plate 8 is mounted so that the radiation fins are oriented in the vertical direction, so that the cooling airflow blown at right angles from the nozzle 7 to the fin plate 8 is the plate of the fin. After colliding with, it rises as it is along this fin row and penetrates into the region of the high heat generating electronic circuit component 4 arranged immediately above. For this reason,
The heat radiation fins of the high-heat-generating electronic circuit components located above are supplied with a mixture of the airflow of which the temperature is high due to the cooling of the high-heat-generating electronic circuit components below, which deteriorates the cooling efficiency. Can be seen. In order to prevent this, it is sufficient to provide cooling equipment having the ability to sufficiently cool the high-heat-generating electronic circuit components located at the top even when warm air is mixed. However, excessive cooling is performed on other high heat generating electronic circuit components, resulting in a wasteful investment.

[0005]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art and uses equipment having an appropriate cooling capacity, regardless of the arrangement position of high heat generating electronic circuit components. It is an object of the present invention to provide a structure of a radiation fin and a nozzle capable of uniformly cooling the high heat generating electronic circuit component.

[0006]

The object of the present invention is to cool high-heat-generating electronic circuit components arranged in a matrix on one surface of a vertically installed printed circuit board in an electronic device. A cooling mechanism comprising a fin plate mounted on a heat transfer surface of a heat-generating electronic circuit component and a nozzle for blowing a cooling airflow in a direction perpendicular to the fin plate, wherein the fin plate has a V-shape that opens upward in a plan view. A plurality of heat dissipating fins are arranged in parallel with each other, the nozzle is installed to face each fin plate, and the tip thereof has a rectangular shape of about 1/2 of the area of the fin plate and is adjacent to each other on the left and right. The cooling mechanism is characterized in that a predetermined gap is formed between the nozzles.

[0007]

The cooling airflow blown perpendicularly to the fin plate is redirected by a collision and then rises along the V-shaped radiating fins to be discharged outside the area of the plane projection of the fin plate. , Continues to rise through the gap between the nozzles and is discharged to the outside of the system. Therefore,
The airflow of which the temperature has risen by cooling each high heat generating electronic circuit component does not enter the fin plate region of the high heat generating electronic circuit component installed above it to prevent the cooling of the circuit component, Uniform and good cooling is guaranteed irrespective of the location of the high-heat electronic components.

Hereinafter, based on the preferred embodiment shown in the drawings,
The present invention will be described in more detail.

[0009]

1 shows the shape of a fin plate 8 used in the present invention. Each radiating fin 8a has a V shape in a plan view, and a plurality of radiating fins are arranged in parallel at a predetermined interval on a square fin plate 8. This fin plate 8 is used for the backboard 3
As shown in FIG. 2, for each of the high heat generating electronic circuit components 4 arranged in a matrix in the orderly multi-stage, as shown in FIG.
The character is attached with the character opened upward.

As shown in FIG. 3, nozzles 7 arranged on one surface of a cooling duct (not shown) correspond to the high heat generating electronic circuit component group having the fin plate 8 mounted thereon. As shown in FIG. 5, the nozzle 7 has a rectangular cross section having an area about half that of the fin plate 8.
As a result, a predetermined gap s is formed between the nozzles 7 of the high heat generating electronic circuit components 4 adjacent to each other on the left and right.

When cooling the high heat generating electronic circuit component 4,
A cooling airflow is generated by a blower fan (not shown) and is supplied from each nozzle 7 through the cooling duct in a direction perpendicular to the fin plate 8 of each high heat generation electronic circuit component 4. Then, as shown in FIGS. 4 and 5, the cooling airflow that collides with the fin plate 8 is opened upward by the aid of the suction rising airflow created by the exhaust fan 9, and the V-shaped heat dissipation fin 8 is opened upward.
It rises along a as indicated by the arrow, and at the same time, it is split into right and left and pushed out of the region of the fin plate 8.

Then, it rises through the gap s between the adjacent nozzles 7 and is discharged to the outside of the system. That is, as in the conventional cooling mechanism, the high-heat-generating electronic circuit component 4 arranged in the lower stage is cooled and the temperature of the airflow rises as it is into the fin plate region of the upper-heat generating electronic circuit component in the upper stage and is supplied to it. It is prevented that the cooling efficiency is deteriorated by combining with the fresh cooling air flow.

[0013]

As described above, according to the present invention, the fin plate having the V-shaped radiating fins splits the cooling airflow vertically blown to each high heat generating electronic circuit component to the left and right, and the upper stage. The high heat generating electronic circuit in the lower stage is designed so that it does not enter into the fin plate area of the high heat generating electronic circuit part and is discharged to the outside of the system through the gap formed between the left and right nozzles. The warm airflow that cools the parts interferes with the upper fin plate,
The drawbacks that impede its cooling are eliminated.

[Brief description of drawings]

FIG. 1 is a perspective view showing the shape of a fin plate used in the present invention.

FIG. 2 is a plan view showing high heat generating electronic circuit components mounted with a fin plate of the present invention and arranged in a matrix.

FIG. 3 is a perspective view showing a positional relationship between a nozzle and a fin plate according to the present invention.

FIG. 4 is a schematic side view showing the flow of an airflow by the cooling mechanism of the present invention.

FIG. 5 is a plan view of the same.

FIG. 6 is a perspective view showing a configuration of a cooling mechanism of a general electronic device.

FIG. 7 is a perspective view showing the shape of a conventional fin plate.

FIG. 8 is a schematic side view showing a flow of an airflow by a conventional cooling mechanism.

FIG. 9 is a plan view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Cabinet 2 ... Shelf 3 ... Backboard 4 ... High heat generation electronic circuit component 5 ... Blower fan 6 ... Cooling duct 7 ... Nozzle 8 ... Fin plate 8a ... Radiating fin 9 ... Exhaust fan

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 7/20 H8727-4E

Claims (1)

[Claims] 1. A high heat-generating electronic circuit component (4) for cooling a high heat generating electronic circuit component (4) arranged in a matrix on one surface of a vertically mounted printed circuit board (3) in an electronic device. A cooling mechanism comprising a fin plate (8) mounted on a heat transfer surface of a circuit component (4) and a nozzle (7) for blowing a cooling airflow at a right angle to the fin plate (8), wherein the fin plate (8) comprises: A plurality of V-shaped radiating fins (8a) opened upward in a plan view are arranged in parallel with each other, and the nozzle (7) is installed to face each fin plate (7), and its tip is According to a cooling mechanism, which has a rectangular shape of about half the area of the fin plate (8) and a predetermined gap (s) is formed between adjacent nozzles (7) on the left and right. To be achieved.