JPH0314298A - Cooling structure for electronic device - Google Patents
Cooling structure for electronic deviceInfo
- Publication number
- JPH0314298A JPH0314298A JP15126289A JP15126289A JPH0314298A JP H0314298 A JPH0314298 A JP H0314298A JP 15126289 A JP15126289 A JP 15126289A JP 15126289 A JP15126289 A JP 15126289A JP H0314298 A JPH0314298 A JP H0314298A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- heat sink
- electronic device
- unit
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 230000005855 radiation Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000009423 ventilation Methods 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概要〕
複数の電子ユニットを重畳して構成した電子装置にかか
わり、特に電子ユニットの冷却構造に関し、
冷却性能が良い電子ユニットの冷却構造を提供すること
を目的とし、
複数の電子ユニットを、電子装置架に重畳した電子装置
において、放熱フィンの溝筋が前後方向に走行するよう
、放熱板を該電子ユニットに取付け、正面視で該電子ユ
ニットの横に並列し、ファンの送風口が平面視で該放熱
フィンに斜めに対向するよう、ファンユニットを該電子
装置架に装着して、該ファンユニットの送出風が、該放
熱板に水平に吹きつけられた後、該電子装置架の後方に
排出される構成とする。[Detailed Description of the Invention] [Summary] The present invention relates to an electronic device configured by stacking a plurality of electronic units, and in particular relates to a cooling structure for an electronic unit, and aims to provide a cooling structure for an electronic unit with good cooling performance. In an electronic device in which a plurality of electronic units are stacked on an electronic device rack, a heat dissipation plate is attached to the electronic unit so that the grooves of the heat dissipation fins run in the front-rear direction, and the heat dissipation plate is arranged next to the electronic unit when viewed from the front, After mounting the fan unit on the electronic device rack so that the fan's air outlet faces diagonally to the heat sink in plan view, and blowing the air from the fan unit horizontally onto the heat sink, It is configured to be ejected to the rear of the electronic device rack.
本発明は、複数の電子ユニットを重畳して構成した電子
装置にかかわり、特に電子ユニットの冷却構造に関する
。The present invention relates to an electronic device configured by stacking a plurality of electronic units, and particularly to a cooling structure for the electronic unit.
通信機器等の電子装置には、第２図に示すように、小形
化の要求に伴い、幅が小さく縦長の箱形のシェルフ３に
電子ユニット４を収容し、このようなシェルフ３を重畳
して、それぞれのシェルフ３の左右の側面をフレーム２
に固着した電子装置架１が近年使用されている。As shown in Fig. 2, in electronic devices such as communication equipment, due to the demand for miniaturization, an electronic unit 4 is housed in a vertically long box-shaped shelf 3 with a small width, and such shelves 3 are overlapped. and attach the left and right sides of each shelf 3 to the frame 2.
In recent years, electronic device racks 1 that are fixed to a wall have been used.
上述のシェルフ３には、上下及び後面の側板に通風スリ
ン）３Ａを多数配設して、自然通風により電子ユニット
を冷却している。The above-mentioned shelf 3 is provided with a large number of ventilation racks (3A) on the upper, lower, and rear side plates to cool the electronic unit through natural ventilation.
しかし、この際特に発熱量が大きい電子ユニットは、強
制冷却することが要求さる。However, in this case, electronic units that generate a particularly large amount of heat require forced cooling.
上述のように強制冷却を必要とする電子ユニットは、従
来は第２回に示すように、電子ユニット４の下部にファ
ンユニット５を取付ける。Conventionally, for an electronic unit that requires forced cooling as described above, a fan unit 5 is attached to the lower part of the electronic unit 4, as shown in the second part.
一方、電子装置架１の前面に取付ける正面板６の一部に
多数の通風孔を設けて、通風板部６Ａとする。On the other hand, a large number of ventilation holes are provided in a part of the front plate 6 attached to the front surface of the electronic device rack 1 to form a ventilation plate portion 6A.
そしてファンユニット５を駆動して、通風板部６八を通
して空気を電子装置架１の正面側から、シェルフ３内に
吸い込み、電子ユニット４に送風することで、冷却して
いる。Then, the fan unit 5 is driven to suck air into the shelf 3 from the front side of the electronic device rack 1 through the ventilation plate portion 68, and blow the air to the electronic unit 4, thereby cooling the electronic unit 4.
このような従来の構成を、第３図を参照しながら詳述す
る。Such a conventional configuration will be described in detail with reference to FIG.
第３図において、電子ユニット４をシェルフに収容して
、シェルフをフレーム２に取付けることで、電子ユニッ
ト４が電子装置架１に装着されている。In FIG. 3, the electronic unit 4 is mounted on the electronic device rack 1 by housing the electronic unit 4 in a shelf and attaching the shelf to the frame 2.
８は、溝筋が上下方向に走行する多数の放熱フィン９が
基板の表面側に配列した放熱板である。Reference numeral 8 denotes a heat dissipation plate in which a large number of heat dissipation fins 9 with grooves running in the vertical direction are arranged on the front surface side of the substrate.
放熱板８はシェルフの垂直な裏面側に取付けである。The heat sink 8 is attached to the vertical back side of the shelf.
そして、電子ユニット４を構成する電子部品の中で、発
熱量が特に大きい部品（例えば半導体部品）は、その熱
が放熱板８に効率良く伝達されるように、電子部品のハ
ウジングの底面を放熱板８の基板の裏面に密着させであ
る。Among the electronic components constituting the electronic unit 4, components that generate a particularly large amount of heat (for example, semiconductor components) are designed to radiate heat from the bottom surface of the housing of the electronic component so that the heat is efficiently transferred to the heat sink 8. It is placed in close contact with the back surface of the substrate of plate 8.
一方、電子ユニット４の後方の放熱板８の下部に、ファ
ンの回転軸を垂直にして、即ち送出風がはぼ垂直に上昇
するよう、ファンユニット５を取付ける。On the other hand, the fan unit 5 is attached to the lower part of the heat sink 8 at the rear of the electronic unit 4 so that the axis of rotation of the fan is vertical, that is, the blown air rises almost vertically.
上述のようなファンユニット５を駆動することで、電子
装置架１の前面の空気は、通風板部６Ａを経てほぼ水平
方向に後方に吸い込まれ、ファンユニット５により上方
に方向変換されて、放熱フィン９の表面に送風される。By driving the fan unit 5 as described above, the air in front of the electronic device rack 1 is sucked backward in an almost horizontal direction through the ventilation plate section 6A, and the direction is changed upward by the fan unit 5 to dissipate heat. Air is blown onto the surface of the fins 9.
即ち、ファンユニット５の送出風は放熱板８の熱を奪い
その後、放熱板８の直上或いは斜め上方に排出される。That is, the air blown by the fan unit 5 absorbs heat from the heat sink 8 and is then discharged directly above or diagonally above the heat sink 8.
上記従来の放熱板は、放熱フィンを設ける基板の形状を
、電子ユニットの底面の形状にほぼ等しくしである。し
たがって放熱フィンの上下方向の高さが、電子ユニット
の高さにほぼ等しくて大きい。よって、ファンの送出風
の放熱フィンの表面における摩擦抵抗が比較的大きい。In the conventional heat sink, the shape of the substrate on which the heat sink fins are provided is approximately equal to the shape of the bottom surface of the electronic unit. Therefore, the height of the radiation fin in the vertical direction is approximately equal to the height of the electronic unit and is large. Therefore, the frictional resistance of the air blown by the fan on the surface of the radiation fins is relatively large.
また、冷却すべき電子ユニットの上部に、他の電子ユニ
ットを装着しであるので、放熱板の上方への風の流れが
妨げられる。Furthermore, since other electronic units are mounted above the electronic unit to be cooled, the flow of air above the heat sink is obstructed.
上述のことに起因して、放熱フィン間を上昇した空気が
上昇過程において、抵抗の小さい方向即ち放熱フィンの
後方に逃げ出すことになり、電子ユニットの上部が充分
に冷却されず、冷却性能が劣るという問題点があった。Due to the above, the air that has risen between the radiating fins escapes in the direction of lower resistance, that is, to the rear of the radiating fins, and the upper part of the electronic unit is not sufficiently cooled, resulting in poor cooling performance. There was a problem.
本発明はこのような点に鑑みて創作されたもので、冷却
性能が良い電子ユニットの冷却構造を提供することを目
的としている。The present invention was created in view of these points, and an object of the present invention is to provide a cooling structure for an electronic unit with good cooling performance.
上記の目的を達成するために本発明は、第１図に例示し
たように、複数の電子ユニット４を、電子装置架１に重
畳した電子装置において、放熱フィン１９の溝筋が前後
方向に走行するよう、放熱板１８を電子ユニット４に取
付ける。To achieve the above object, the present invention provides an electronic device in which a plurality of electronic units 4 are stacked on an electronic device rack 1, as illustrated in FIG. The heat sink 18 is attached to the electronic unit 4 so as to
一方、正面視で電子ユニット４の横に並列し、ファンの
送風口が平面視で放熱フィン１９に斜めに対向するよう
、ファンユニット１０をフレーム２に装着する。On the other hand, the fan unit 10 is attached to the frame 2 so that it is parallel to the side of the electronic unit 4 when viewed from the front, and the fan's air outlet is diagonally opposed to the radiation fins 19 when viewed from above.
へ
そして、ファンユニット１０の送出風が、放熱板１８に
水平に吹きつけられた後、電子装置架１の後方に排出さ
れるような構成とする。The configuration is such that the air blown by the fan unit 10 is blown horizontally onto the heat sink 18 and then discharged to the rear of the electronic device rack 1.
上述の電子ユニット４の奥行きは、上下の高さに較べて
小さい。また、放熱板１Ｂは電子ユニット４の裏面側に
、放熱フィン１９の溝筋が水平に走行するように取付け
である。The depth of the electronic unit 4 described above is smaller than the vertical height. Further, the heat sink 1B is attached to the back side of the electronic unit 4 so that the grooves of the heat sink fins 19 run horizontally.
よって、放熱フィン１９の前後方向の長さ、即ち溝筋方
向の長さが短くて、送出風の放□熱フィンの表面におけ
る摩擦抵抗が小さい。Therefore, the length of the heat dissipation fins 19 in the front-rear direction, that is, the length in the groove direction is short, and the frictional resistance on the surface of the heat fins for discharging the air is small.
さらに、放熱板１８の後方、即ち電子装置架１の後方に
は、風の排出を妨げる電子ユニット等がないので、送出
風の排出が円滑である。Further, since there is no electronic unit or the like that obstructs air discharge behind the heat sink 18, that is, behind the electronic device rack 1, the air is smoothly exhausted.
一方、ファンユニット０の送出風は、斜め前方から水平
に放熱フィン１９に吹きつけている。On the other hand, the air blown by the fan unit 0 is blown horizontally onto the radiation fins 19 from diagonally forward.
したがって、全放熱フィン１９にほぼ等量の風量がむら
無く吹きつけられ、吹きつけられた送出風は滞ることな
く後方に排出される。Therefore, substantially the same amount of air is evenly blown onto all the radiation fins 19, and the blown air is discharged rearward without stagnation.
即ち、電子ユニット４の総ての部位がほぼ平等に冷却さ
れ、冷却性能が良い。That is, all parts of the electronic unit 4 are cooled almost equally, and the cooling performance is good.
以下図を参照しながら、本発明を具体的に説明する。な
お、全図を通じて同一符号は同一対象物を示す。The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.
第１図は本発明の実施例の図で、（ａ）は要部を示す斜
視図、（ｂ）は断面図である。FIG. 1 is a diagram of an embodiment of the present invention, in which (a) is a perspective view showing the main part, and (b) is a sectional view.
第１図において、左右の幅及び奥行きが小さい縦長のシ
ェルフ３内に、電子ユニット４を装着しである。In FIG. 1, an electronic unit 4 is mounted inside a vertically long shelf 3 having a small left and right width and a small depth.
１８は、基板の表面側に、溝筋が水平に前後方向に走行
する多数の放熱フィン１９を有する、放熱板である。Reference numeral 18 denotes a heat dissipation plate having a large number of heat dissipation fins 19 with grooves running horizontally in the front-rear direction on the front side of the substrate.
正面板６に直交するシェルフ３の裏面側に、放熱板１８
を取付けて、電子ユニット４を構成する電子部品の中で
、発熱量が特に大きい部品（例えば半導体部品）は、そ
の熱が放熱板１８に効率良く伝達されるように、部品の
ハウジングの底面を放熱板１８の基板の裏面に密着させ
である。A heat dissipation plate 18 is placed on the back side of the shelf 3 perpendicular to the front plate 6.
Among the electronic components constituting the electronic unit 4, components that generate a particularly large amount of heat (e.g. semiconductor components) are installed on the bottom surface of the component housing so that the heat is efficiently transferred to the heat sink 18. The heat dissipating plate 18 is brought into close contact with the back surface of the substrate.
そして、シェルフ３をフレーム２に固着し、複数重畳す
ることで電子装置架１が構成される。Then, the electronic device rack 1 is constructed by fixing the shelves 3 to the frame 2 and stacking a plurality of them.
なお、このシェルフ３の上下・及び後面側板には、第２
図に図示したように多数の通風スリットを配列しである
。In addition, the upper and lower and rear side plates of this shelf 3 are provided with a second
A large number of ventilation slits are arranged as shown in the figure.
一方、放熱板１８側が開口したファンケース１１を、電
子ユニット４に対向してフレーム２に取付け、ファンケ
ース１１内に数個（例えば３個）のファンユニット１０
を、それぞれの送風口が同一垂直面内で並ぶように上下
に積層して装着しである。On the other hand, a fan case 11 with an open side on the heat sink 18 is attached to the frame 2 facing the electronic unit 4, and several (for example, three) fan units 10 are installed in the fan case 11.
are stacked one on top of the other so that their respective ventilation ports are lined up in the same vertical plane.
これらのファンユニットＩＯは、そのファンの送風口が
平面視で後方が拡開するように、放熱フィンＩ９に対し
て斜めＱこ取付けるものとする。These fan units IO are installed at an angle Q with respect to the heat dissipation fins I9 so that the ventilation ports of the fans expand at the rear in plan view.
また、電子装置架１の前面に取付ける正面板６は、ファ
ンユニン目０に対応する部分に、多数の通風孔を設けて
通風板部６八としである。Further, the front plate 6 attached to the front surface of the electronic device rack 1 is provided with a large number of ventilation holes in a portion corresponding to fan unit 0 to form a ventilation plate portion 68.
なお、電子装置架の正面側のファンケース１１の側板を
枠形にすることで、通風板部６Ａを通った空気がファン
ユニット１０の吸込口に流れ込むようにしである。Note that by forming the side plate of the fan case 11 on the front side of the electronic device rack into a frame shape, air passing through the ventilation plate portion 6A flows into the suction port of the fan unit 10.
また、ファンユニット１０の後方に整風板１２を取付け
ることで、ファンユニン目０の送風口から放出される送
出風が、放熱板１８方向に円滑に流れるようにしである
。Furthermore, by attaching the air baffle plate 12 to the rear of the fan unit 10, the air discharged from the air outlet of the fan unit 0 flows smoothly in the direction of the heat sink 18.
上述のように構成しであるので、ファンユニット１０を
駆動すると、電子装置架１の前面側の空気が通風板部６
Ａを経て、ファンユニット１０の吸込口に吸い込まれ、
送風口から排出され、その送出風は斜め前方から水平に
、全放熱フィン１９の表面に、はぼ等量の風量で吹きつ
ける。Since the configuration is as described above, when the fan unit 10 is driven, the air on the front side of the electronic device rack 1 flows through the ventilation plate section 6.
A, and is sucked into the suction port of the fan unit 10,
The air is discharged from the air outlet, and the air is blown diagonally forward and horizontally onto the surfaces of all the heat radiation fins 19 at an approximately equal amount.
そして、放熱フィン１９の表面に沿って、水平に後方に
吹き抜けて、放熱板１８から熱を奪い、電子装置架１の
後方に滞ることなく排出される。The heat then blows horizontally backward along the surface of the heat dissipation fins 19, removes heat from the heat dissipation plate 18, and is discharged to the rear of the electronic device rack 1 without being delayed.
即ち、電子ユニット４の総ての部位がほぼ平等に冷却さ
れる。That is, all parts of the electronic unit 4 are cooled almost equally.
以上説明したように本発明は、空気の摩擦抵抗が小さい
放熱板構造とし、さらにファンユニットから冷却風を全
放熱フィンにほぼ平等になるように吹きつけるようにし
た電子ユニットの冷却構造であって、冷却性能が良いと
いう優れた効果を奏する。As explained above, the present invention is a cooling structure for an electronic unit, which has a heat sink structure with low air frictional resistance, and which blows cooling air from a fan unit almost equally to all the heat sink fins. , it has excellent cooling performance.
第１図は本発明の実施例の図で、
（ａ）は要部を示す斜視図、
（ｂ）は断面図、
第２図は電子装置の斜視図、
第３図は従来例の斜視図である。
図において、
１は電子装置架、 ２はフレーム、３はシェルフ、
４は電子ユニット、５．１０はファンユニッ
ト、
６は正面板、
６Ａは通風板部、 ８．１８は放熱板、９．１９
は放熱フィンをそれぞれ示す。Fig. 1 is a diagram of an embodiment of the present invention, (a) is a perspective view showing main parts, (b) is a sectional view, Fig. 2 is a perspective view of an electronic device, and Fig. 3 is a perspective view of a conventional example. It is. In the figure, 1 is an electronic device rack, 2 is a frame, 3 is a shelf,
4 is an electronic unit, 5.10 is a fan unit, 6 is a front plate, 6A is a ventilation plate, 8.18 is a heat sink, 9.19
indicate heat dissipation fins.
Claims (1)
畳した電子装置において、 放熱フィン（１９）の溝筋が前後方向に走行するよう、
放熱板（１８）を該電子ユニット（４）に取付け、正面
視で該電子ユニット（４）の横に並列し、ファンの送風
口が平面視で該放熱フィン（１９）に斜めに対向するよ
う、ファンユニット（１０）を該電子装置架（１）に装
着して、 該ファンユニット（１０）の送出風が、該放熱板（１８
）に水平に吹きつけられた後、該電子装置架（１）の後
方に排出されるように構成したことを特徴とする電子ユ
ニットの冷却構造。[Claims] In an electronic device in which a plurality of electronic units (4) are stacked on an electronic device rack (1), the grooves of the heat radiation fins (19) run in the front-rear direction.
A heat sink (18) is attached to the electronic unit (4) so that it is parallel to the side of the electronic unit (4) when viewed from the front, and the air outlet of the fan is diagonally opposed to the heat sink (19) when viewed from above. , the fan unit (10) is mounted on the electronic device rack (1), and the air blown from the fan unit (10) is directed to the heat sink (18).
1. A cooling structure for an electronic unit, characterized in that the cooling structure is configured such that the air is sprayed horizontally onto the electronic device rack (1) and then the electronic device rack (1) is discharged to the rear of the electronic device rack (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15126289A JPH0732319B2 (en) | 1989-06-13 | 1989-06-13 | Electronic unit cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15126289A JPH0732319B2 (en) | 1989-06-13 | 1989-06-13 | Electronic unit cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0314298A true JPH0314298A (en) | 1991-01-22 |
| JPH0732319B2 JPH0732319B2 (en) | 1995-04-10 |
Family
ID=15514819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15126289A Expired - Fee Related JPH0732319B2 (en) | 1989-06-13 | 1989-06-13 | Electronic unit cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732319B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
| JP2008174938A (en) * | 2007-01-17 | 2008-07-31 | Seiki Juko Kk | Take-up screen device |
| US20120201001A1 (en) * | 2009-10-16 | 2012-08-09 | Fujitsu Limited | Electronic device and complex electronic device |
| US20120201003A1 (en) * | 2009-10-16 | 2012-08-09 | Fujitsu Limited | Electronic device and casing for electronic device |
-
1989
- 1989-06-13 JP JP15126289A patent/JPH0732319B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5810072A (en) * | 1995-09-08 | 1998-09-22 | Semipower Systems, Inc. | Forced air cooler system |
| JP2008174938A (en) * | 2007-01-17 | 2008-07-31 | Seiki Juko Kk | Take-up screen device |
| US20120201001A1 (en) * | 2009-10-16 | 2012-08-09 | Fujitsu Limited | Electronic device and complex electronic device |
| US20120201003A1 (en) * | 2009-10-16 | 2012-08-09 | Fujitsu Limited | Electronic device and casing for electronic device |
| US8817470B2 (en) * | 2009-10-16 | 2014-08-26 | Fujitsu Limited | Electronic device and complex electronic device |
| US8953312B2 (en) * | 2009-10-16 | 2015-02-10 | Fujitsu Limited | Electronic device and casing for electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0732319B2 (en) | 1995-04-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |