JPS5839096U - Heat dissipation mounting structure - Google Patents

Heat dissipation mounting structure

Info

Publication number
JPS5839096U
JPS5839096U JP13384581U JP13384581U JPS5839096U JP S5839096 U JPS5839096 U JP S5839096U JP 13384581 U JP13384581 U JP 13384581U JP 13384581 U JP13384581 U JP 13384581U JP S5839096 U JPS5839096 U JP S5839096U
Authority
JP
Japan
Prior art keywords
heat dissipation
mounting structure
dissipation mounting
printed wiring
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13384581U
Other languages
Japanese (ja)
Inventor
林　久夫
英樹 銭谷
照夫 菊池
坂井　茂
渡辺　正義
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP13384581U priority Critical patent/JPS5839096U/en
Publication of JPS5839096U publication Critical patent/JPS5839096U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の縦形の装置の第１の構造例の斜視図、第
２図は同じく第２の構造例の斜視図、第３図は本考案に
係るプリント配線板を搭載した筐体の斜視図、第４図は
放熱構造を用いた装置の比較説明図、第５図は本考案に
係る放熱実装構造において整流板を多列に設けた場合の
細面図、第６図は第３図に示す整流板を１８０°反転さ
せた斜視図、第７図は本考案に係る整流板を階段状に成
形した場合の斜視図である。Fig. 1 is a perspective view of a first structural example of a conventional vertical device, Fig. 2 is a perspective view of a second structural example, and Fig. 3 is a perspective view of a casing in which a printed wiring board according to the present invention is mounted. A perspective view, FIG. 4 is a comparative explanatory diagram of a device using a heat dissipation structure, FIG. 5 is a detailed view of the heat dissipation mounting structure according to the present invention in which rectifying plates are provided in multiple rows, and FIG. 6 is a diagram similar to that shown in FIG. FIG. 7 is a perspective view of the rectifier plate shown in FIG.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線板を垂直に複数個平行に配列し収容する筐
体構造において、該プリント配線板の面に垂直に、かつ
対角線方向に熱による上昇空気流を誘導排出するための
空気流整流板を設けてなることを特徴とする放熱実装構
造。In a housing structure in which a plurality of printed wiring boards are vertically arranged in parallel and accommodated, an air flow rectifying plate is provided for guiding and discharging rising airflow due to heat in a direction perpendicular to the surface of the printed wiring board and diagonally. A heat dissipation mounting structure characterized by
JP13384581U 1981-09-09 1981-09-09 Heat dissipation mounting structure Pending JPS5839096U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13384581U JPS5839096U (en) 1981-09-09 1981-09-09 Heat dissipation mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13384581U JPS5839096U (en) 1981-09-09 1981-09-09 Heat dissipation mounting structure

Publications (1)

Publication Number Publication Date
JPS5839096U true JPS5839096U (en) 1983-03-14

Family

ID=29927290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13384581U Pending JPS5839096U (en) 1981-09-09 1981-09-09 Heat dissipation mounting structure

Country Status (1)

Country Link
JP (1) JPS5839096U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361389U (en) * 1989-10-20 1991-06-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0361389U (en) * 1989-10-20 1991-06-17

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