JPS5988874U - lead frame - Google Patents

lead frame

Info

Publication number
JPS5988874U
JPS5988874U JP1982185784U JP18578482U JPS5988874U JP S5988874 U JPS5988874 U JP S5988874U JP 1982185784 U JP1982185784 U JP 1982185784U JP 18578482 U JP18578482 U JP 18578482U JP S5988874 U JPS5988874 U JP S5988874U
Authority
JP
Japan
Prior art keywords
lead frame
support plate
lead
leads
notches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982185784U
Other languages
Japanese (ja)
Inventor
大久保 英生
蛎原 栄一
藤岡 守
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1982185784U priority Critical patent/JPS5988874U/en
Publication of JPS5988874U publication Critical patent/JPS5988874U/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のリードフレームを説明するための斜視歯
、第2図は本考案に係るリードフレームの一実施例を説
明するためのリードフレームの斜視図である。 図において、1および3はリードフレーム、2は印刷配
線板、4は樹脂コーティング、11および31はリード
、12および32は、リード支持板、311は切込みを
それぞれ示す。
FIG. 1 is a perspective view for explaining a conventional lead frame, and FIG. 2 is a perspective view of a lead frame for explaining an embodiment of the lead frame according to the present invention. In the figure, 1 and 3 are lead frames, 2 is a printed wiring board, 4 is a resin coating, 11 and 31 are leads, 12 and 32 are lead support plates, and 311 is a notch, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板の端子部に接着する複数のリードを一体的に
リード支持板で支持したリードフレームにおいて、前記
複数のリードのリード支持板側からの所定位置に切込み
を形成するとともに、該切込み部または切込み部を含む
リード支持板側に樹脂コーティングしたことを特徴とす
るリードフレーム。
In a lead frame in which a plurality of leads to be adhered to terminal portions of a printed wiring board are integrally supported by a lead support plate, notches are formed at predetermined positions of the plurality of leads from the lead support plate side, and the notches or A lead frame characterized by resin coating on the lead support plate side including the notch.
JP1982185784U 1982-12-07 1982-12-07 lead frame Pending JPS5988874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982185784U JPS5988874U (en) 1982-12-07 1982-12-07 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982185784U JPS5988874U (en) 1982-12-07 1982-12-07 lead frame

Publications (1)

Publication Number Publication Date
JPS5988874U true JPS5988874U (en) 1984-06-15

Family

ID=30401466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982185784U Pending JPS5988874U (en) 1982-12-07 1982-12-07 lead frame

Country Status (1)

Country Link
JP (1) JPS5988874U (en)

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