JPS59143066U - Electronic component mounting device - Google Patents

Electronic component mounting device

Info

Publication number
JPS59143066U
JPS59143066U JP3767783U JP3767783U JPS59143066U JP S59143066 U JPS59143066 U JP S59143066U JP 3767783 U JP3767783 U JP 3767783U JP 3767783 U JP3767783 U JP 3767783U JP S59143066 U JPS59143066 U JP S59143066U
Authority
JP
Japan
Prior art keywords
electronic component
mounting device
component mounting
printed board
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3767783U
Other languages
Japanese (ja)
Inventor
克彰 鈴木
前田　嘉昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3767783U priority Critical patent/JPS59143066U/en
Publication of JPS59143066U publication Critical patent/JPS59143066U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来における電子部品取付装置の斜視図、第２
図は同装置におけるプリント板の裏面斜視図、第３図は
本考案の一実施例における取付スペーサの斜視図、第４
図は同取付スペーサを用い　゛た電子部品取付装置の斜
視図、第５図は同装置におけるプリント板の裏面斜視図
である。 ７・・・・・・取付スペーサ、１１・・・・・・透Ｌ１
２・・・・・・突出部。Figure 1 is a perspective view of a conventional electronic component mounting device;
The figure is a perspective view of the back side of the printed board in the same device, Figure 3 is a perspective view of a mounting spacer in an embodiment of the present invention, and Figure 4 is a perspective view of the mounting spacer in an embodiment of the present invention.
The figure is a perspective view of an electronic component mounting device using the same mounting spacer, and FIG. 5 is a rear perspective view of a printed board in the same device. 7...Mounting spacer, 11...Through L1
2...Protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード線が嵌入する透孔、ならびにこの透孔間に位置し
、かつプリント板に嵌入する突出部を有する取付スペー
サを介して電子部品をプリント板に取付けてなる電子部
品取付装置。An electronic component mounting device that mounts an electronic component to a printed board via a through hole into which a lead wire is fitted, and a mounting spacer that is located between the through holes and has a protrusion that fits into the printed board.
JP3767783U 1983-03-15 1983-03-15 Electronic component mounting device Pending JPS59143066U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3767783U JPS59143066U (en) 1983-03-15 1983-03-15 Electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3767783U JPS59143066U (en) 1983-03-15 1983-03-15 Electronic component mounting device

Publications (1)

Publication Number Publication Date
JPS59143066U true JPS59143066U (en) 1984-09-25

Family

ID=30168366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3767783U Pending JPS59143066U (en) 1983-03-15 1983-03-15 Electronic component mounting device

Country Status (1)

Country Link
JP (1) JPS59143066U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302422A (en) * 2008-06-17 2009-12-24 Fujitsu Telecom Networks Ltd Fitting structure of semiconductor device
JP2011199018A (en) * 2010-03-19 2011-10-06 Yaskawa Electric Corp Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302422A (en) * 2008-06-17 2009-12-24 Fujitsu Telecom Networks Ltd Fitting structure of semiconductor device
JP2011199018A (en) * 2010-03-19 2011-10-06 Yaskawa Electric Corp Mounting structure for electronic component, power converter using the mounting structure, and mounting method for electronic component

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