JPS5829891U - Cooler for printed board - Google Patents
Cooler for printed boardInfo
- Publication number
- JPS5829891U JPS5829891U JP12309981U JP12309981U JPS5829891U JP S5829891 U JPS5829891 U JP S5829891U JP 12309981 U JP12309981 U JP 12309981U JP 12309981 U JP12309981 U JP 12309981U JP S5829891 U JPS5829891 U JP S5829891U
- Authority
- JP
- Japan
- Prior art keywords
- cooler
- printed board
- gap
- printed
- printed boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はプリント板の装着状態を説明するための概略構
成図、第２図はプリント板間の通風路における流速及び
温度の分布図、第３図及び第４図は本考案に係るプリン
ト板用冷却器の一実施例を示す平面図及び正面図である
。
１・・・・・・プリント板、ＩＡ・・・・・・接触用パ
ターンコネクタ、２・・・・・・ＩＣ，３・・・・・・
ラック、４・・・・・・通風路、５・・・・・・平板（
冷却器）。Fig. 1 is a schematic configuration diagram for explaining the mounting state of printed boards, Fig. 2 is a distribution diagram of flow velocity and temperature in the ventilation passage between printed boards, and Figs. 3 and 4 are printed boards according to the present invention. FIG. 2 is a plan view and a front view showing an example of a cooler for use in the refrigerator. 1...Printed board, IA...contact pattern connector, 2...IC, 3...
Rack, 4...Ventilation path, 5...Flat plate (
Cooler).
Claims (1)
のＩＣ実装面が垂直となり、かつ隣接するプリント板と
の間隙に対流作用によって上昇気流が生じるように所要
の藺隙でラック内に収納し、これを複数段積み重ねた電
子機器において、個々のＩＣの上面にこれより大きく、
かつ良好な熱伝導性を有する平板を横長に取付けたこと
を特徴とするプリント板用冷却器。Printed boards mounted with a large number of ICs arranged in a row are stored in a rack with the required gap so that the IC mounting surface is vertical and an upward air current is generated by convection in the gap between adjacent printed boards. , in electronic devices stacked in multiple stages, a larger size is placed on the top surface of each IC.
A cooler for printed circuit boards, characterized in that a flat plate having good thermal conductivity is installed horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12309981U JPS5829891U (en) | 1981-08-19 | 1981-08-19 | Cooler for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12309981U JPS5829891U (en) | 1981-08-19 | 1981-08-19 | Cooler for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5829891U true JPS5829891U (en) | 1983-02-26 |
Family
ID=29917004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12309981U Pending JPS5829891U (en) | 1981-08-19 | 1981-08-19 | Cooler for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5829891U (en) |
-
1981
- 1981-08-19 JP JP12309981U patent/JPS5829891U/en active Pending
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