JPS5881997U - Cooling equipment for electronic equipment - Google Patents
Cooling equipment for electronic equipmentInfo
- Publication number
- JPS5881997U JPS5881997U JP17734181U JP17734181U JPS5881997U JP S5881997 U JPS5881997 U JP S5881997U JP 17734181 U JP17734181 U JP 17734181U JP 17734181 U JP17734181 U JP 17734181U JP S5881997 U JPS5881997 U JP S5881997U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- equipment
- printed circuit
- circuit boards
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は、この考案の１実施例を示すものであって、第１
図はこの考案に係る装置を装備した電子機器の断面説明
図、第２ＵｇＪはこの考案の要部を拡大した斜視図であ
る。
１．２・・・電子機器、５・・・プリント基板、５ａ。
５ｂ、 ５Ｃ，５ｄ・・・プリント基板、９・・・集熱
板、１１・・・ヒートパイプ、１２・・・放熱板、１７
・・・通風路。The drawing shows one embodiment of this invention, and shows the first embodiment of the invention.
The figure is an explanatory cross-sectional view of an electronic device equipped with the device according to this invention, and 2nd UgJ is an enlarged perspective view of the main part of this invention. 1.2...Electronic equipment, 5...Printed circuit board, 5a. 5b, 5C, 5d... Printed circuit board, 9... Heat collecting plate, 11... Heat pipe, 12... Heat sink, 17
...Ventilation duct.
Claims (1)
台並設し、前記各電子機器内のプリント基板のうち、高
発熱量のプリント基板の電気部品の表面に集熱板をそれ
ぞれ貼付けて設け、前記各集熱板をヒートパイプを介し
て、各電子機器間に形成される通風路内に配設された放
熱板を伝熱接続して設けたことを特徴とする電子機器の
冷却装置。A plurality of electronic devices each having a plurality of printed circuit boards housed and arranged are installed in parallel, and a heat collecting plate is attached to the surface of each of the electrical components of the printed circuit boards that generate a high amount of heat among the printed circuit boards in each of the electronic devices. . A cooling device for electronic equipment, characterized in that each of the heat collecting plates is heat-transfer-connected to a heat sink disposed in a ventilation path formed between each electronic equipment via a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17734181U JPS5881997U (en) | 1981-11-27 | 1981-11-27 | Cooling equipment for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17734181U JPS5881997U (en) | 1981-11-27 | 1981-11-27 | Cooling equipment for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5881997U true JPS5881997U (en) | 1983-06-03 |
Family
ID=29971136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17734181U Pending JPS5881997U (en) | 1981-11-27 | 1981-11-27 | Cooling equipment for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881997U (en) |
-
1981
- 1981-11-27 JP JP17734181U patent/JPS5881997U/en active Pending
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