JPS609230U - Cooling structure for semiconductor devices - Google Patents
Cooling structure for semiconductor devicesInfo
- Publication number
- JPS609230U JPS609230U JP10160583U JP10160583U JPS609230U JP S609230 U JPS609230 U JP S609230U JP 10160583 U JP10160583 U JP 10160583U JP 10160583 U JP10160583 U JP 10160583U JP S609230 U JPS609230 U JP S609230U
- Authority
- JP
- Japan
- Prior art keywords
- cooling structure
- air
- semiconductor devices
- semiconductor device
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体素子の冷却構造のａ図は構成を示
す斜視図、ｂ、 ｃ図は説明図、第２図は本考案によ
る半導体素子の冷却構造のａｌ、３２図は平面図、ｂ、
、 ｂ２図は側面図を示す。
図中において、１はプリント板、２は半導体素子、３．
５． ６． ７． ８はフィン、４はコールドプレー
ト、４Ａは供給口、４Ｂは排出口、４Ｃは循環路、を示
す。Fig. 1 shows a conventional cooling structure for a semiconductor device; Fig. a is a perspective view showing the configuration, Figs. b,
, b2 figure shows a side view. In the figure, 1 is a printed board, 2 is a semiconductor element, and 3.
5. 6. 7. 8 is a fin, 4 is a cold plate, 4A is a supply port, 4B is a discharge port, and 4C is a circulation path.
Claims (1)
板の実装面に所定間隔で対面して設けられたコールドプ
レートと、該コールドプレートに一辺が固着され、該半
導体素子の配列間に位置するよう複数の平板が櫛状に突
出されたフィンとを備え、該所定間隔には該プリント板
の一端面側より空気が送風される半導体素子の冷却構造
において、前記フィンにより前記空気の流れ方向が所定
方向に偏向されるよう前記平板の平面が該空気の送風方
向に対して傾斜されて設けられたことを特徴とする半導
体素子の冷却構造。A plurality of semiconductor elements (a substrate arranged on a mounting surface, a cold plate provided facing the mounting surface of the substrate at a predetermined interval, one side fixed to the cold plate, and a structure between the array of semiconductor elements) In a semiconductor device cooling structure, a plurality of flat plates are provided with fins protruding in a comb shape so that air is blown from one end surface of the printed board at predetermined intervals, and the fins control the flow of the air. 1. A cooling structure for a semiconductor device, characterized in that a plane of the flat plate is inclined with respect to a blowing direction of the air so that the direction is deflected in a predetermined direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10160583U JPS609230U (en) | 1983-06-30 | 1983-06-30 | Cooling structure for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10160583U JPS609230U (en) | 1983-06-30 | 1983-06-30 | Cooling structure for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS609230U true JPS609230U (en) | 1985-01-22 |
Family
ID=30239868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10160583U Pending JPS609230U (en) | 1983-06-30 | 1983-06-30 | Cooling structure for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609230U (en) |
-
1983
- 1983-06-30 JP JP10160583U patent/JPS609230U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS609230U (en) | Cooling structure for semiconductor devices | |
| JPS6057138U (en) | Cooling structure for semiconductor devices | |
| JPS6112246U (en) | cooling structure | |
| JPS60139182U (en) | heat exchange equipment | |
| JPH0533539U (en) | heatsink | |
| JPH02104642U (en) | ||
| JPS6022841U (en) | radiator | |
| JPS5925072U (en) | Heat exchanger | |
| JPS6018550U (en) | Heat dissipation structure | |
| JPS6039296U (en) | Air cooling structure | |
| JPS5829893U (en) | Cooler for printed board | |
| JPS5829891U (en) | Cooler for printed board | |
| JPS5965548U (en) | Semiconductor device forced cooling equipment | |
| JPS6076043U (en) | Cooling structure for semiconductor devices | |
| JPS59121892U (en) | heat dissipation device | |
| JPS60141194U (en) | package cooling system | |
| JPS6290812U (en) | ||
| JPS5965544U (en) | Heatsink for sealed electronic equipment | |
| JPS609229U (en) | Air cooling structure | |
| JPS5839096U (en) | Heat dissipation mounting structure | |
| JPS6130292U (en) | Heatsink for electrical elements | |
| JPS59186040U (en) | Threshing machine swing sorting device | |
| JPS6127392U (en) | Cooling structure for electronic equipment | |
| JPS58159795U (en) | Forced air cooling radiator | |
| JPS6021883U (en) | Cross fin heat exchanger |