JPS6076043U - Cooling structure for semiconductor devices - Google Patents
Cooling structure for semiconductor devicesInfo
- Publication number
- JPS6076043U JPS6076043U JP16629283U JP16629283U JPS6076043U JP S6076043 U JPS6076043 U JP S6076043U JP 16629283 U JP16629283 U JP 16629283U JP 16629283 U JP16629283 U JP 16629283U JP S6076043 U JPS6076043 U JP S6076043U
- Authority
- JP
- Japan
- Prior art keywords
- cooling structure
- semiconductor devices
- semiconductor device
- plane
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は空気流を説明した平面図、第２図は従来の半導
体素子の冷却構造を示すａ図は斜視図、ｂ図は説明図、
第３図は平面図、第４図および第５図は本考案による半
導体素子の冷却構造の一実施例を示す、第４図は平面図
、第５図のａ図は斜視図、第５図のｂｌ、ｂ２．ｂ３図
は断面図を示す。
図中において、１は基板、２は半導体素子、３．５，１
２．１４はフィン、４はコールドプレート、１０は仕切
板、１１，１５．１６はパイプ、１３はシャフト、を示
す。Figure 1 is a plan view explaining airflow, Figure 2 is a perspective view of a conventional semiconductor device cooling structure, Figure b is an explanatory view,
3 is a plan view, FIGS. 4 and 5 show an embodiment of a cooling structure for a semiconductor device according to the present invention, FIG. 4 is a plan view, and FIG. 5 a is a perspective view. bl, b2. Figure b3 shows a cross-sectional view. In the figure, 1 is a substrate, 2 is a semiconductor element, 3.5, 1
2.14 is a fin, 4 is a cold plate, 10 is a partition plate, 11, 15.16 is a pipe, and 13 is a shaft.
Claims (1)
れた基板と、該所定面に位置される熱交換フィンが設け
られた熱交換器とを備え、所定方向より空気が送風され
ることで該半導体素子の発熱が該熱交換器によって冷却
される半導体素子の冷却構造であって、前記熱交換フィ
ンの平面は前記所定面と平行に配設されたことを特徴と
する半導体素子の冷却構造。It is equipped with a substrate on which a plurality of semiconductor elements having cooling fins are arranged on a predetermined surface, and a heat exchanger provided with heat exchange fins located on the predetermined surface. 1. A cooling structure for a semiconductor device in which heat generated by the semiconductor device is cooled by the heat exchanger, wherein a plane of the heat exchange fin is arranged parallel to the predetermined plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16629283U JPS6076043U (en) | 1983-10-27 | 1983-10-27 | Cooling structure for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16629283U JPS6076043U (en) | 1983-10-27 | 1983-10-27 | Cooling structure for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6076043U true JPS6076043U (en) | 1985-05-28 |
Family
ID=30364094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16629283U Pending JPS6076043U (en) | 1983-10-27 | 1983-10-27 | Cooling structure for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6076043U (en) |
-
1983
- 1983-10-27 JP JP16629283U patent/JPS6076043U/en active Pending
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