JPS6039296U - Air cooling structure - Google Patents
Air cooling structureInfo
- Publication number
- JPS6039296U JPS6039296U JP13163583U JP13163583U JPS6039296U JP S6039296 U JPS6039296 U JP S6039296U JP 13163583 U JP13163583 U JP 13163583U JP 13163583 U JP13163583 U JP 13163583U JP S6039296 U JPS6039296 U JP S6039296U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling structure
- air cooling
- partition plate
- flow path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
゛第１図は従来の空冷構造の説明図、第２図のａ、 ｂ
図は本考案による空冷構造の一実施例を示す説明図、第
３図は空気の温度上昇と半導体素子の数量との関係グラ
フを示す。
図中において、１，１３は基板、２は半導体素子、３は
フィン、４はシャフト、５は送風機、６は仕切板、１０
．１１は中間仕切板を示す。゛Figure 1 is an explanatory diagram of the conventional air cooling structure, Figure 2 a and b
The figure is an explanatory diagram showing one embodiment of the air cooling structure according to the present invention, and FIG. 3 is a graph showing the relationship between the temperature rise of air and the number of semiconductor elements. In the figure, 1 and 13 are substrates, 2 is a semiconductor element, 3 is a fin, 4 is a shaft, 5 is a blower, 6 is a partition plate, and 10
．． 11 indicates an intermediate partition plate.
Claims (1)
該半導体素子を覆うように該基板に所定間隔で対向され
た仕切板とによって空気流路が形成され、該空気流路に
所定の送風が行なわれる空冷構造において、前記配列を
２分割する前記基板に対して垂直な第１の中間仕切板と
、前記空気流路を２層に分割する前記基板に対して平行
な第２の中間仕切板とが設けられたことを特徴とする空
冷構造。a substrate on which a plurality of semiconductor elements having fins are arranged;
In an air cooling structure in which an air flow path is formed by a partition plate facing the substrate at a predetermined interval so as to cover the semiconductor element, and a predetermined amount of air is blown into the air flow path, the substrate divides the array into two. An air cooling structure characterized in that a first intermediate partition plate is provided perpendicular to the substrate, and a second intermediate partition plate is parallel to the substrate and divides the air flow path into two layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13163583U JPS6039296U (en) | 1983-08-25 | 1983-08-25 | Air cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13163583U JPS6039296U (en) | 1983-08-25 | 1983-08-25 | Air cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6039296U true JPS6039296U (en) | 1985-03-19 |
Family
ID=30297532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13163583U Pending JPS6039296U (en) | 1983-08-25 | 1983-08-25 | Air cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039296U (en) |
-
1983
- 1983-08-25 JP JP13163583U patent/JPS6039296U/en active Pending
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