JPS6018552U - Cooling fins for semiconductor devices - Google Patents

Cooling fins for semiconductor devices

Info

Publication number
JPS6018552U
JPS6018552U JP11026583U JP11026583U JPS6018552U JP S6018552 U JPS6018552 U JP S6018552U JP 11026583 U JP11026583 U JP 11026583U JP 11026583 U JP11026583 U JP 11026583U JP S6018552 U JPS6018552 U JP S6018552U
Authority
JP
Japan
Prior art keywords
semiconductor devices
cooling fins
semiconductor device
heat sink
cooling fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11026583U
Other languages
Japanese (ja)
Inventor
正紀 中尾
Original Assignee
株式会社日立製作所
日立エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所, 日立エンジニアリング株式会社 filed Critical 株式会社日立製作所
Priority to JP11026583U priority Critical patent/JPS6018552U/en
Publication of JPS6018552U publication Critical patent/JPS6018552U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来形冷却フィンの一部切り欠き断面を示す斜
視図、第２図は従来の半導体装置を示す正面図、第３図
は従来形冷却フィンの薄板フィン内の強制風冷時の風の
状態を示す平面図、第４図は本考案の一実施例である半
導体装置の正面図、−第５図は本考案による冷却フィン
の薄板フィン内の強制風冷時の風の状態を示す平面図で
ある。 １・・・円柱形ヒートシンク、２・・・薄板フィン、３
・・・半導体素子、４・・・貫通穴、５・・・円孔、６
・・・フランジ。Figure 1 is a partially cutaway perspective view of a conventional cooling fin, Figure 2 is a front view of a conventional semiconductor device, and Figure 3 is a conventional cooling fin during forced air cooling inside the thin plate fin. FIG. 4 is a plan view showing the state of the wind; FIG. 4 is a front view of a semiconductor device which is an embodiment of the present invention; and FIG. FIG. 1... Cylindrical heat sink, 2... Thin plate fin, 3
... Semiconductor element, 4... Through hole, 5... Circular hole, 6
...Flange.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 円柱形ヒートシンクに薄板フィンを複数はめこんで形成
される半導体素子用冷却フィンに於いて、前記円柱形ヒ
ートシンクに貫通穴を設けたことを特徴とする半導体素
子用冷却フィン。A cooling fin for a semiconductor device formed by fitting a plurality of thin plate fins into a cylindrical heat sink, the cooling fin for a semiconductor device being characterized in that the cylindrical heat sink is provided with through holes.
JP11026583U 1983-07-18 1983-07-18 Cooling fins for semiconductor devices Pending JPS6018552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11026583U JPS6018552U (en) 1983-07-18 1983-07-18 Cooling fins for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11026583U JPS6018552U (en) 1983-07-18 1983-07-18 Cooling fins for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6018552U true JPS6018552U (en) 1985-02-07

Family

ID=30256516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11026583U Pending JPS6018552U (en) 1983-07-18 1983-07-18 Cooling fins for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6018552U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018026313A (en) * 2016-08-12 2018-02-15 ミネベアミツミ株式会社 Heat radiation member and luminaire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018026313A (en) * 2016-08-12 2018-02-15 ミネベアミツミ株式会社 Heat radiation member and luminaire

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