JPS6018552U - Cooling fins for semiconductor devices - Google Patents
Cooling fins for semiconductor devicesInfo
- Publication number
- JPS6018552U JPS6018552U JP11026583U JP11026583U JPS6018552U JP S6018552 U JPS6018552 U JP S6018552U JP 11026583 U JP11026583 U JP 11026583U JP 11026583 U JP11026583 U JP 11026583U JP S6018552 U JPS6018552 U JP S6018552U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- cooling fins
- semiconductor device
- heat sink
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来形冷却フィンの一部切り欠き断面を示す斜
視図、第2図は従来の半導体装置を示す正面図、第3図
は従来形冷却フィンの薄板フィン内の強制風冷時の風の
状態を示す平面図、第4図は本考案の一実施例である半
導体装置の正面図、−第5図は本考案による冷却フィン
の薄板フィン内の強制風冷時の風の状態を示す平面図で
ある。
1・・・円柱形ヒートシンク、2・・・薄板フィン、3
・・・半導体素子、4・・・貫通穴、5・・・円孔、6
・・・フランジ。Figure 1 is a partially cutaway perspective view of a conventional cooling fin, Figure 2 is a front view of a conventional semiconductor device, and Figure 3 is a conventional cooling fin during forced air cooling inside the thin plate fin. FIG. 4 is a plan view showing the state of the wind; FIG. 4 is a front view of a semiconductor device which is an embodiment of the present invention; and FIG. FIG. 1... Cylindrical heat sink, 2... Thin plate fin, 3
... Semiconductor element, 4... Through hole, 5... Circular hole, 6
...Flange.
Claims (1)
される半導体素子用冷却フィンに於いて、前記円柱形ヒ
ートシンクに貫通穴を設けたことを特徴とする半導体素
子用冷却フィン。A cooling fin for a semiconductor device formed by fitting a plurality of thin plate fins into a cylindrical heat sink, the cooling fin for a semiconductor device being characterized in that the cylindrical heat sink is provided with through holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11026583U JPS6018552U (en) | 1983-07-18 | 1983-07-18 | Cooling fins for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11026583U JPS6018552U (en) | 1983-07-18 | 1983-07-18 | Cooling fins for semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6018552U true JPS6018552U (en) | 1985-02-07 |
Family
ID=30256516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11026583U Pending JPS6018552U (en) | 1983-07-18 | 1983-07-18 | Cooling fins for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6018552U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018026313A (en) * | 2016-08-12 | 2018-02-15 | ミネベアミツミ株式会社 | Heat radiation member and luminaire |
-
1983
- 1983-07-18 JP JP11026583U patent/JPS6018552U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018026313A (en) * | 2016-08-12 | 2018-02-15 | ミネベアミツミ株式会社 | Heat radiation member and luminaire |
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