JPS59192838U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS59192838U JPS59192838U JP1983087831U JP8783183U JPS59192838U JP S59192838 U JPS59192838 U JP S59192838U JP 1983087831 U JP1983087831 U JP 1983087831U JP 8783183 U JP8783183 U JP 8783183U JP S59192838 U JPS59192838 U JP S59192838U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal
- semiconductor equipment
- semiconductor
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ないし第３図は本考案の一実施例の混成ＩＣのそ
れぞれ斜視図、系統図、断面図、第４図は本考案と従来
のヒートサイクル数と熱抵抗の関係を示すグラフ、第５
図は本考案の他の実施例の要部断面図、第６図ａ、
ｂは本考案に係る金属部材の変形例を示す斜視図である
。1 to 3 are respectively a perspective view, a system diagram, and a sectional view of a hybrid IC according to an embodiment of the present invention. FIG. 4 is a graph showing the relationship between the number of heat cycles and thermal resistance of the present invention and the conventional one. 5
The figures are sectional views of main parts of other embodiments of the present invention, Fig. 6a,
b is a perspective view showing a modification of the metal member according to the present invention;
Claims (1)
金属ろうを用いて接着された前記半導体基体とを含む半
導体装置において、 前記金属ろう中に埋設されるようにループ状金属部材を
介装させたことを特徴とする半導体装置。[Claims for Utility Model Registration] A semiconductor device including a metal supporting member for supporting a semiconductor substrate, and the semiconductor substrate bonded onto the metal member using a metal solder, wherein the semiconductor device is embedded in the metal solder. A semiconductor device characterized in that a loop-shaped metal member is interposed in the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983087831U JPS59192838U (en) | 1983-06-10 | 1983-06-10 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983087831U JPS59192838U (en) | 1983-06-10 | 1983-06-10 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59192838U true JPS59192838U (en) | 1984-12-21 |
Family
ID=30217744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983087831U Pending JPS59192838U (en) | 1983-06-10 | 1983-06-10 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59192838U (en) |
-
1983
- 1983-06-10 JP JP1983087831U patent/JPS59192838U/en active Pending
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