JPS594636U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS594636U JPS594636U JP10086982U JP10086982U JPS594636U JP S594636 U JPS594636 U JP S594636U JP 10086982 U JP10086982 U JP 10086982U JP 10086982 U JP10086982 U JP 10086982U JP S594636 U JPS594636 U JP S594636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- conductive layer
- semiconductor device
- bonding pads
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例を示す概略図、第２図は本考案実施例を
示す上面図である。
４・・・・パ・ポンディングパッド、７・・・・・・導
電層。FIG. 1 is a schematic diagram showing a conventional example, and FIG. 2 is a top view showing an embodiment of the present invention. 4... Pa-ponding pad, 7... Conductive layer.
Claims (1)
ッドを囲むように導電層を設けたことを特徴とする半導
体装置。 ２ 上記導電層の両端を各々任意のポンディングパッド
に接続したことを特徴とする実用新案登録請求の範囲第
１項記載の半導体装置。[Claims for Utility Model Registration] 1. A semiconductor device characterized in that a conductive layer is provided to surround a large number of bonding pads provided on the surface of a semiconductor substrate. 2. The semiconductor device according to claim 1, wherein both ends of the conductive layer are connected to arbitrary bonding pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10086982U JPS594636U (en) | 1982-07-02 | 1982-07-02 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10086982U JPS594636U (en) | 1982-07-02 | 1982-07-02 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS594636U true JPS594636U (en) | 1984-01-12 |
Family
ID=30238436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10086982U Pending JPS594636U (en) | 1982-07-02 | 1982-07-02 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS594636U (en) |
-
1982
- 1982-07-02 JP JP10086982U patent/JPS594636U/en active Pending
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