JPS58140644U - Heat dissipation device for semiconductor devices - Google Patents
Heat dissipation device for semiconductor devicesInfo
- Publication number
- JPS58140644U JPS58140644U JP3721482U JP3721482U JPS58140644U JP S58140644 U JPS58140644 U JP S58140644U JP 3721482 U JP3721482 U JP 3721482U JP 3721482 U JP3721482 U JP 3721482U JP S58140644 U JPS58140644 U JP S58140644U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation device
- semiconductor devices
- semiconductor device
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体素子の放熱装置の一例を示す斜
視図、第２図は、この考案の一実施例を示す平面図、第
３図は、同じくその裏面図、第４図は、同じくその一部
破断にした正面図、第５図は、第４図における冷却用熱
電素子の基本構成を示す説明図、第６図は、この考案の
他の実施例を示す平面図、第７図は、同じ（その断面図
である。
３．９・・・筐体、４・・・取付盤、６．１１・・・冷
却用熱電素子、７・・・パワートランジスタ（半導体素
子）、１４・・・パワーアンプの基板回路。FIG. 1 is a perspective view showing an example of a conventional heat dissipation device for a semiconductor element, FIG. 2 is a plan view showing an embodiment of this invention, FIG. 3 is a back view thereof, and FIG. 5 is an explanatory diagram showing the basic configuration of the cooling thermoelectric element in FIG. 4, and FIG. 6 is a plan view showing another embodiment of the invention, and FIG. The figures are the same (a sectional view thereof. 3.9... Housing, 4... Mounting board, 6.11... Cooling thermoelectric element, 7... Power transistor (semiconductor element), 14 ...Power amplifier board circuit.
Claims (1)
半導体素子によって構成した基板回路を収納する筐体に
、冷却用熱電素子を取り付けたことを特徴とする半導体
素子の放熱装置。1. A heat dissipation device for a semiconductor device, characterized in that a cooling thermoelectric element is attached to a casing that accommodates a semiconductor device such as a power transistor or a thyristor, or a board circuit made up of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3721482U JPS58140644U (en) | 1982-03-18 | 1982-03-18 | Heat dissipation device for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3721482U JPS58140644U (en) | 1982-03-18 | 1982-03-18 | Heat dissipation device for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58140644U true JPS58140644U (en) | 1983-09-21 |
Family
ID=30048612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3721482U Pending JPS58140644U (en) | 1982-03-18 | 1982-03-18 | Heat dissipation device for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58140644U (en) |
-
1982
- 1982-03-18 JP JP3721482U patent/JPS58140644U/en active Pending
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