JPS61156295U - - Google Patents
Info
- Publication number
- JPS61156295U JPS61156295U JP3844085U JP3844085U JPS61156295U JP S61156295 U JPS61156295 U JP S61156295U JP 3844085 U JP3844085 U JP 3844085U JP 3844085 U JP3844085 U JP 3844085U JP S61156295 U JPS61156295 U JP S61156295U
- Authority
- JP
- Japan
- Prior art keywords
- skin
- electronic circuit
- circuit component
- thin metal
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920006124 polyolefin elastomer Polymers 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来の電子回路モジユールを示す外観図、
第３図は第２図の断面ＡＡを示す図、第４図はデ
ユアルインタイプの電子回路部品をプリント基板
に実装した状態を示す断面図である。
図において、１は冷却フイン、２はスキン、３
はスペーサ、４はプリント基板、５はフラツトパ
ツクタイプの電子回路部品、６はコネクタプラグ
、７はダクト、８はデユアルインタイプの電子回
路部品、９はリードフレーム、１０はスルーホー
ル、１１は熱伝導ラバーである。なお、各図中同
一符号は同一または相当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is an external view showing a conventional electronic circuit module,
FIG. 3 is a cross-sectional view taken along section AA of FIG. 2, and FIG. 4 is a cross-sectional view showing a dual-in type electronic circuit component mounted on a printed circuit board. In the figure, 1 is a cooling fin, 2 is a skin, and 3 is a cooling fin.
is a spacer, 4 is a printed circuit board, 5 is a flat pack type electronic circuit component, 6 is a connector plug, 7 is a duct, 8 is a dual-in type electronic circuit component, 9 is a lead frame, 10 is a through hole, 11 is a It is a heat conductive rubber. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
上記冷却フインの両面にロウ付けまたは接着によ
つて接合された矩形金属薄板である２枚のスキン
と、電子回路部品が実装されておりかつ上記電子
回路部品の実装されている面が上記スキンと向い
合うように配せられた２枚のプリント基板と、上
記スキンと上記電子回路部品とで挾持されかつポ
リオレフイン系エラストマーとＡ１２Ｏ３系フイ
ラーを主成分とし矩形板状に成形された熱伝導性
ラバーと、上記プリント基板と上記スキンとの周
辺部分で挾持されたスペーサとで構成されている
事を特徴とする電子回路モジユール。 Cooling fins formed by forming a thin metal plate into a wave shape,
Two skins, which are rectangular thin metal plates, are bonded to both sides of the cooling fin by brazing or adhesion, and an electronic circuit component is mounted on the skin, and the surface on which the electronic circuit component is mounted is connected to the skin. A heat conductor formed into a rectangular plate shape, which is sandwiched between two printed circuit boards arranged to face each other, the skin and the electronic circuit component, and whose main components are a polyolefin elastomer and an A1 2 O 3 filler. An electronic circuit module comprising a flexible rubber and a spacer held between the printed circuit board and the skin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3844085U JPS61156295U (en) | 1985-03-18 | 1985-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3844085U JPS61156295U (en) | 1985-03-18 | 1985-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61156295U true JPS61156295U (en) | 1986-09-27 |
Family
ID=30545452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3844085U Pending JPS61156295U (en) | 1985-03-18 | 1985-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156295U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231757A (en) * | 2008-03-25 | 2009-10-08 | Fujitsu Ltd | Radiation member and circuit substrate device |
-
1985
- 1985-03-18 JP JP3844085U patent/JPS61156295U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009231757A (en) * | 2008-03-25 | 2009-10-08 | Fujitsu Ltd | Radiation member and circuit substrate device |
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