JPS63182549U - - Google Patents
Info
- Publication number
- JPS63182549U JPS63182549U JP1987074633U JP7463387U JPS63182549U JP S63182549 U JPS63182549 U JP S63182549U JP 1987074633 U JP1987074633 U JP 1987074633U JP 7463387 U JP7463387 U JP 7463387U JP S63182549 U JPS63182549 U JP S63182549U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor chip
- imaging device
- solid
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Color Television Image Signal Generators (AREA)
Description
第1図は一実施例を示す分解斜視図、第2図は
固体撮像装置を用いた電子スチールカメラやカラ
ービデオカメラなどを表わす概略ブロツク図であ
る。
3……固体撮像装置、6……ベースパツケージ
、7……半導体チツプ、8……前面シールプレー
ト、9……シール用接着剤。
FIG. 1 is an exploded perspective view showing one embodiment, and FIG. 2 is a schematic block diagram showing an electronic still camera, color video camera, etc. using a solid-state imaging device. 3... Solid-state imaging device, 6... Base package, 7... Semiconductor chip, 8... Front seal plate, 9... Seal adhesive.
Claims (1)
用半導体チツプがパツケージに固定され、前記パ
ツケージにはさらにフオトクロミズムを有する光
学部材にてなる前面シールプレートが前記半導体
チツプを前記パツケージとの間で封止するように
取りつけられている固体撮像装置。 A semiconductor chip for photoelectric conversion that converts an optical image of a subject into an electrical signal is fixed to a package, and a front seal plate made of an optical member having photochromism is further provided on the package to seal the semiconductor chip and the package. A solid-state imaging device that is mounted so that it stops.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987074633U JPS63182549U (en) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987074633U JPS63182549U (en) | 1987-05-18 | 1987-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63182549U true JPS63182549U (en) | 1988-11-24 |
Family
ID=30920024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987074633U Pending JPS63182549U (en) | 1987-05-18 | 1987-05-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63182549U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009302299A (en) * | 2008-06-13 | 2009-12-24 | Rohm Co Ltd | Solid-state imaging device |
-
1987
- 1987-05-18 JP JP1987074633U patent/JPS63182549U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009302299A (en) * | 2008-06-13 | 2009-12-24 | Rohm Co Ltd | Solid-state imaging device |
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