JPS63182549U - - Google Patents

Info

Publication number
JPS63182549U
JPS63182549U JP1987074633U JP7463387U JPS63182549U JP S63182549 U JPS63182549 U JP S63182549U JP 1987074633 U JP1987074633 U JP 1987074633U JP 7463387 U JP7463387 U JP 7463387U JP S63182549 U JPS63182549 U JP S63182549U
Authority
JP
Japan
Prior art keywords
package
semiconductor chip
imaging device
solid
state imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987074633U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987074633U priority Critical patent/JPS63182549U/ja
Publication of JPS63182549U publication Critical patent/JPS63182549U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は一実施例を示す分解斜視図、第2図は
固体撮像装置を用いた電子スチールカメラやカラ
ービデオカメラなどを表わす概略ブロツク図であ
る。 3……固体撮像装置、6……ベースパツケージ
、7……半導体チツプ、8……前面シールプレー
ト、9……シール用接着剤。
FIG. 1 is an exploded perspective view showing one embodiment, and FIG. 2 is a schematic block diagram showing an electronic still camera, color video camera, etc. using a solid-state imaging device. 3... Solid-state imaging device, 6... Base package, 7... Semiconductor chip, 8... Front seal plate, 9... Seal adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被写体の光学像を電気信号に変換する光電変換
用半導体チツプがパツケージに固定され、前記パ
ツケージにはさらにフオトクロミズムを有する光
学部材にてなる前面シールプレートが前記半導体
チツプを前記パツケージとの間で封止するように
取りつけられている固体撮像装置。
A semiconductor chip for photoelectric conversion that converts an optical image of a subject into an electrical signal is fixed to a package, and a front seal plate made of an optical member having photochromism is further provided on the package to seal the semiconductor chip and the package. A solid-state imaging device that is mounted so that it stops.
JP1987074633U 1987-05-18 1987-05-18 Pending JPS63182549U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987074633U JPS63182549U (en) 1987-05-18 1987-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987074633U JPS63182549U (en) 1987-05-18 1987-05-18

Publications (1)

Publication Number Publication Date
JPS63182549U true JPS63182549U (en) 1988-11-24

Family

ID=30920024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987074633U Pending JPS63182549U (en) 1987-05-18 1987-05-18

Country Status (1)

Country Link
JP (1) JPS63182549U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302299A (en) * 2008-06-13 2009-12-24 Rohm Co Ltd Solid-state imaging device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302299A (en) * 2008-06-13 2009-12-24 Rohm Co Ltd Solid-state imaging device

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