JPS61151471U - - Google Patents
Info
- Publication number
- JPS61151471U JPS61151471U JP3002885U JP3002885U JPS61151471U JP S61151471 U JPS61151471 U JP S61151471U JP 3002885 U JP3002885 U JP 3002885U JP 3002885 U JP3002885 U JP 3002885U JP S61151471 U JPS61151471 U JP S61151471U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- package
- imaging device
- conductive material
- transparent conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000005394 sealing glass Substances 0.000 claims 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は一実施例を示す分解斜視図、第２図は
同実施例をシールド用取付け部材に取りつけた状
態を示す断面図、第３図は従来の固体撮像装置を
備えたビデオカメラを示す断面図である。
３……半導体チツプ、４……前面シールガラス
、７……パツケージ、１３……透明導電性物質。
Fig. 1 is an exploded perspective view showing one embodiment, Fig. 2 is a sectional view showing the same embodiment attached to a shield mounting member, and Fig. 3 shows a video camera equipped with a conventional solid-state imaging device. FIG. 3...Semiconductor chip, 4...Front seal glass, 7...Package, 13...Transparent conductive material.
Claims (1)
手段としての半導体チツプと、前記半導体チツプ
を配置して固定するパツケージと、前記半導体チ
ツプを保護する前面シールガラスからなる固体撮
像装置において、 前記前面シールガラスに透明導電性物質をコー
テイングしたことを特徴とする固体撮像装置。[Claims for Utility Model Registration] Consists of a semiconductor chip as a photoelectric conversion means for converting an optical image of a subject into an electrical signal, a package for arranging and fixing the semiconductor chip, and a front sealing glass for protecting the semiconductor chip. A solid-state imaging device, characterized in that the front seal glass is coated with a transparent conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002885U JPS61151471U (en) | 1985-03-01 | 1985-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002885U JPS61151471U (en) | 1985-03-01 | 1985-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61151471U true JPS61151471U (en) | 1986-09-19 |
Family
ID=30529358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3002885U Pending JPS61151471U (en) | 1985-03-01 | 1985-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61151471U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01175376A (en) * | 1987-12-28 | 1989-07-11 | Echo:Kk | Video camera unit |
-
1985
- 1985-03-01 JP JP3002885U patent/JPS61151471U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01175376A (en) * | 1987-12-28 | 1989-07-11 | Echo:Kk | Video camera unit |
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