JPS6450453U - - Google Patents
Info
- Publication number
- JPS6450453U JPS6450453U JP1987145706U JP14570687U JPS6450453U JP S6450453 U JPS6450453 U JP S6450453U JP 1987145706 U JP1987145706 U JP 1987145706U JP 14570687 U JP14570687 U JP 14570687U JP S6450453 U JPS6450453 U JP S6450453U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- film
- silicone resin
- ccd chip
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Facsimile Heads (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は、この考案のイメージセンサの一実施
例の構造を概略的に示す断面図、第２図Ａ及びＢ
は、この考案のイメージセンサの説明に供する図
であり、シリコーン樹脂保護膜の有無と、光電変
換特性との関係を示す図、第３図は、この考案の
イメージセンサの説明に供する図であり、ヒート
サイクル試験条件を示す図、第４図は、従来のイ
メージセンサの構造を示す断面図である。
３０……ＣＣＤチツプ、３１……セラミツク基
板、３３……配線導体、３５……ワイヤ、３７…
…シリコーン樹脂皮膜の保護膜。
FIG. 1 is a sectional view schematically showing the structure of an embodiment of the image sensor of this invention, and FIGS. 2A and B
3 is a diagram used to explain the image sensor of this invention, and shows the relationship between the presence or absence of a silicone resin protective film and photoelectric conversion characteristics. FIG. 3 is a diagram used to explain the image sensor of this invention. , a diagram showing heat cycle test conditions, and FIG. 4 is a sectional view showing the structure of a conventional image sensor. 30...CCD chip, 31...ceramic substrate, 33...wiring conductor, 35...wire, 37...
...Protective film of silicone resin film.
Claims (1)
いて、 少なくともＣＣＤチツプを覆う、シリコーン樹
脂皮膜から成る保護膜を具えたことを特徴とする
イメージセンサ。 (2) 前記皮膜はシリコーン樹脂をスプレーコー
トして得た膜であることを特徴とする実用新案登
録請求の範囲第１項記載のイメージセンサ。[Claims for Utility Model Registration] (1) An image sensor equipped with a CCD chip, characterized in that it is provided with a protective film made of a silicone resin film that covers at least the CCD chip. (2) The image sensor according to claim 1, wherein the film is a film obtained by spray coating a silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145706U JPS6450453U (en) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145706U JPS6450453U (en) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450453U true JPS6450453U (en) | 1989-03-29 |
Family
ID=31414531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987145706U Pending JPS6450453U (en) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450453U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009171A (en) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | Semiconductor device |
-
1987
- 1987-09-24 JP JP1987145706U patent/JPS6450453U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009171A (en) * | 2017-06-21 | 2019-01-17 | スタンレー電気株式会社 | Semiconductor device |