JPS62167132U - - Google Patents
Info
- Publication number
- JPS62167132U JPS62167132U JP5580886U JP5580886U JPS62167132U JP S62167132 U JPS62167132 U JP S62167132U JP 5580886 U JP5580886 U JP 5580886U JP 5580886 U JP5580886 U JP 5580886U JP S62167132 U JPS62167132 U JP S62167132U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- ceramic element
- semiconductor ceramic
- temperature sensor
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図は本考案の一実施例による温度センサを
示す構成図、第２図は第１図に示す一実施例の平
面図、第３図は同じく第１図に示す一実施例の側
面図、第４図は従来の温度センサを示す構成図で
ある。
１１……半導体セラミツク素子、１２……リー
ド線（皮覆リード線）、１３……ハンダ、１４…
…コーテイング樹脂、１５……取付板、１６……
２層熱収縮チユーブ。
Fig. 1 is a configuration diagram showing a temperature sensor according to an embodiment of the present invention, Fig. 2 is a plan view of the embodiment shown in Fig. 1, and Fig. 3 is a side view of the embodiment also shown in Fig. 1. , FIG. 4 is a block diagram showing a conventional temperature sensor. 11... Semiconductor ceramic element, 12... Lead wire (covered lead wire), 13... Solder, 14...
...Coating resin, 15...Mounting plate, 16...
2 layer heat shrink tube.
Claims (1)
に引出した検出部と、上記半導体セラミツク素子
をコーテイング樹脂で覆つたものを覆う絶縁材と
、それを取付けるための取付板とからなり、上記
絶縁材として内面に糊を施した弾性に富む２層の
熱収縮チユーブを利用し、その上から上記取付板
を装着したことを特徴とする温度センサ。 It consists of a detection part connected to a lead wire to the semiconductor ceramic element and drawn out to the outside, an insulating material covering the semiconductor ceramic element covered with a coating resin, and a mounting plate for attaching it. A temperature sensor characterized by using a highly elastic two-layer heat-shrinkable tube coated with glue, and having the mounting plate attached thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580886U JPS62167132U (en) | 1986-04-14 | 1986-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580886U JPS62167132U (en) | 1986-04-14 | 1986-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62167132U true JPS62167132U (en) | 1987-10-23 |
Family
ID=30884052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5580886U Pending JPS62167132U (en) | 1986-04-14 | 1986-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62167132U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199128A (en) * | 1988-02-04 | 1989-08-10 | Yamatake Honeywell Co Ltd | Temperature detector |
| JP2019174135A (en) * | 2018-03-27 | 2019-10-10 | 三菱マテリアル株式会社 | Temperature sensor |
| JP6837623B1 (en) * | 2020-11-06 | 2021-03-03 | 株式会社芝浦電子 | Temperature sensor |
-
1986
- 1986-04-14 JP JP5580886U patent/JPS62167132U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199128A (en) * | 1988-02-04 | 1989-08-10 | Yamatake Honeywell Co Ltd | Temperature detector |
| JP2019174135A (en) * | 2018-03-27 | 2019-10-10 | 三菱マテリアル株式会社 | Temperature sensor |
| JP6837623B1 (en) * | 2020-11-06 | 2021-03-03 | 株式会社芝浦電子 | Temperature sensor |
| WO2022097272A1 (en) * | 2020-11-06 | 2022-05-12 | 株式会社芝浦電子 | Temperature sensor |