JPH0358076U

JPH0358076U -

Info

Publication number: JPH0358076U
Application number: JP1989118938U
Authority: JP
Priority date: 1989-10-11
Filing date: 1989-10-11
Publication date: 1991-06-05

Description

[Brief explanation of the drawing]

第１図乃至第３図は本考案の一実施例を示し、
第１図は固体撮像素子の冷却装置の断面図、第２
図は固体撮像素子の冷却装置の斜視図、第３図は
熱伝達パイプの断面図であり、第４図は本考案を
３板式カメラに適用した場合を示す断面図であり
、第５図及び第６図はそれぞれ従来の固体撮像素
子の冷却装置の側面図である。１……固体撮像素子、２……ペルチエ素子、２
ｂ……冷却部、２ｃ……放熱部、３……熱伝達バ
ツグ、３ｂ……流動体、５……熱伝達パイプ、６
……フロントブロツク（外部ケース）、８……フ
ロントパネル（外部ケース）。 1 to 3 show an embodiment of the present invention,
Figure 1 is a cross-sectional view of a cooling device for a solid-state image sensor;
The figure is a perspective view of a cooling device for a solid-state image sensor, FIG. 3 is a sectional view of a heat transfer pipe, FIG. 4 is a sectional view showing the case where the present invention is applied to a three-panel camera, and FIG. 6 is a side view of a conventional cooling device for a solid-state image sensor. 1... Solid-state image sensor, 2... Peltier device, 2
b...Cooling part, 2c...Heat radiation part, 3...Heat transfer bag, 3b...Fluid, 5...Heat transfer pipe, 6
...Front block (external case), 8...Front panel (external case).

Claims

[Scope of utility model registration request]

A Peltier device is placed behind the solid-state image sensor,
A heat transfer bag filled with a fluid having a high coefficient of thermal expansion is interposed between the solid-state image sensor and the Peltier device, and both sides of the heat transfer bag are connected to the rear surface of the solid-state image sensor and the cooling section of the Peltier device. A solid-state imaging device characterized in that a heat transfer pipe is bonded directly or indirectly to the heat dissipating portion of the Peltier element in surface contact, and the tip of the heat transfer pipe is connected to an external case. Element cooling device.