JPH025985U - - Google Patents
Info
- Publication number
- JPH025985U JPH025985U JP1988083541U JP8354188U JPH025985U JP H025985 U JPH025985 U JP H025985U JP 1988083541 U JP1988083541 U JP 1988083541U JP 8354188 U JP8354188 U JP 8354188U JP H025985 U JPH025985 U JP H025985U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- prism
- heat sink
- mounting bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Color Television Image Signal Generators (AREA)
Description
第1図は本考案の一実施例の正面図、第2図は
本実施例の固体撮像素子に設けた放熱板の詳細断
面図、第3図は固体撮像素子に設けた放熱板の他
の実施例の詳細断面図である。
1……固体撮像素子、2……色分解プリズム、
3……プリズム取付金具、4……周辺回路基板、
5……放熱部材、6……筐体、7……放熱板。
Fig. 1 is a front view of one embodiment of the present invention, Fig. 2 is a detailed cross-sectional view of a heat sink provided in the solid-state image sensor of this embodiment, and Fig. 3 is another example of the heat sink provided in the solid-state image sensor. FIG. 3 is a detailed cross-sectional view of the embodiment. 1... Solid-state image sensor, 2... Color separation prism,
3... Prism mounting bracket, 4... Peripheral circuit board,
5... Heat dissipation member, 6... Housing, 7... Heat dissipation plate.
Claims (1)
具と、前記色分解プリズムの光射出部に固定され
た固体撮像素子と、この固体撮像素子に取付られ
た放熱板と、この放熱板と前記プリズム取付金具
とを熱的に短絡させるように配した熱抵抗の小さ
な放熱部材とを備えること特徴とする固体撮像カ
メラ。 a prism mounting bracket to which a color separation prism is attached; a solid-state imaging device fixed to a light emitting portion of the color separation prism; a heat sink attached to the solid-state imaging device; the heat sink and the prism mounting bracket; and a heat dissipation member with low thermal resistance arranged to thermally short-circuit the solid-state imaging camera.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988083541U JPH025985U (en) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988083541U JPH025985U (en) | 1988-06-23 | 1988-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH025985U true JPH025985U (en) | 1990-01-16 |
Family
ID=31308254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988083541U Pending JPH025985U (en) | 1988-06-23 | 1988-06-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH025985U (en) |
-
1988
- 1988-06-23 JP JP1988083541U patent/JPH025985U/ja active Pending