JPH02132994U - - Google Patents

Info

Publication number
JPH02132994U
JPH02132994U JP4275289U JP4275289U JPH02132994U JP H02132994 U JPH02132994 U JP H02132994U JP 4275289 U JP4275289 U JP 4275289U JP 4275289 U JP4275289 U JP 4275289U JP H02132994 U JPH02132994 U JP H02132994U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
heat
dissipation device
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4275289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4275289U priority Critical patent/JPH02132994U/ja
Publication of JPH02132994U publication Critical patent/JPH02132994U/ja
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す放熱装置の
外観図である。第２図は動作前の状態を示す又第
３図は動作中の状態を示す放熱装置の側面図であ
る。第４図は従来の放熱装置の外観図である。 １……プリント基板、２……発熱体、３……形
状記憶合金、４……放熱器、５……放熱器の支持
機構。なお、図中同一符号は同一、又は相当部分
を示す。 FIG. 1 is an external view of a heat dissipation device showing an embodiment of this invention. FIG. 2 is a side view of the heat dissipation device showing the state before operation, and FIG. 3 is a side view of the heat dissipation device showing the state during operation. FIG. 4 is an external view of a conventional heat dissipation device. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Heating element, 3... Shape memory alloy, 4... Heatsink, 5... Support mechanism for heatsink. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板の外に取り付けた放熱器と熱によ
つて形状を変形させて前述の放熱器に接触するよ
うにプリント基板に実装された発熱体に取り付け
られた形状記憶合金より構成されたことを特徴と
する放熱装置。 It is characterized by being composed of a heat radiator attached to the outside of the printed circuit board and a shape memory alloy attached to a heating element mounted on the printed circuit board so that its shape is deformed by heat and comes into contact with the aforementioned heat radiator. Heat dissipation device.
JP4275289U 1989-04-12 1989-04-12 Pending JPH02132994U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4275289U JPH02132994U (en) 1989-04-12 1989-04-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4275289U JPH02132994U (en) 1989-04-12 1989-04-12

Publications (1)

Publication Number Publication Date
JPH02132994U true JPH02132994U (en) 1990-11-05

Family

ID=31554573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4275289U Pending JPH02132994U (en) 1989-04-12 1989-04-12

Country Status (1)

Country Link
JP (1) JPH02132994U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007111828A (en) * 2005-10-20 2007-05-10 Kawada Kogyo Kk Structure for radiating heat of mobile robot
JP2008177232A (en) * 2007-01-16 2008-07-31 Casio Comput Co Ltd Reactor and electronic apparatus
JP2010055939A (en) * 2008-08-28 2010-03-11 Toshiba Lighting & Technology Corp Light source unit and lighting fixture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007111828A (en) * 2005-10-20 2007-05-10 Kawada Kogyo Kk Structure for radiating heat of mobile robot
JP2008177232A (en) * 2007-01-16 2008-07-31 Casio Comput Co Ltd Reactor and electronic apparatus
JP2010055939A (en) * 2008-08-28 2010-03-11 Toshiba Lighting & Technology Corp Light source unit and lighting fixture

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