JPH0326105U - - Google Patents
Info
- Publication number
- JPH0326105U JPH0326105U JP8718789U JP8718789U JPH0326105U JP H0326105 U JPH0326105 U JP H0326105U JP 8718789 U JP8718789 U JP 8718789U JP 8718789 U JP8718789 U JP 8718789U JP H0326105 U JPH0326105 U JP H0326105U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- casing
- laser module
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第１図は本考案の一実施例に係わる光通信装置
の構成を示す斜視図、第２図は第１図のＡ−Ａ′
断面図、第３図は従来技術に係わる光通信装置の
構成を示す断面図である。
１……半導体レーザモジユールのレーザ素子を
収容するパツケージ、１ａ……パツケージ１の底
面、２……半導体レーザ素子、３……金属製のブ
ロツク、４……ヒートプレート、４ａ……ウイツ
ク、７……電子回路が形成されたプリント基板、
７……半導体レーザモジユールとプリント基板と
を収納する筐体、９……放熱フイン、１０……電
子冷却素子。
FIG. 1 is a perspective view showing the configuration of an optical communication device according to an embodiment of the present invention, and FIG. 2 is a line AA' in FIG. 1.
FIG. 3 is a cross-sectional view showing the configuration of an optical communication device according to the prior art. DESCRIPTION OF SYMBOLS 1...Package housing a laser element of a semiconductor laser module, 1a...Bottom surface of package 1, 2...Semiconductor laser element, 3...Metal block, 4...Heat plate, 4a...Wick, 7 ...Printed circuit board with electronic circuit formed on it,
7...A casing for housing a semiconductor laser module and a printed circuit board, 9...A heat dissipation fin, 10...An electronic cooling element.
Claims (1)
光学素子を収納するパツケージから成る半導体レ
ーザモジユールと、 電子回路が形成されたプリント基板と、 前記半導体レーザモジユール及びプリント基板
を収納しかつ外部に放熱フインが取付けられた筐
体と、 この筐体内部の一端側において前記半導体レー
ザモジユールが結合されると共に筐体外部の他端
側において前記放熱フインに電子冷却素子を介し
て結合されるヒートプレート又はヒートパイプと
を備えたことを特徴とする光通信装置。[Claims for Utility Model Registration] A semiconductor laser module consisting of an optical element including a semiconductor laser element and a package that houses these optical elements; A printed circuit board on which an electronic circuit is formed; The semiconductor laser module and the printed circuit board. a casing that houses the casing and has a heat dissipation fin attached to the outside; the semiconductor laser module is coupled to the semiconductor laser module at one end inside the casing, and an electronic cooling element is attached to the heat dissipation fin at the other end outside the casing. 1. An optical communication device comprising: a heat plate or a heat pipe coupled via a heat plate or a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989087187U JP2522805Y2 (en) | 1989-07-24 | 1989-07-24 | Optical communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989087187U JP2522805Y2 (en) | 1989-07-24 | 1989-07-24 | Optical communication device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0326105U true JPH0326105U (en) | 1991-03-18 |
| JP2522805Y2 JP2522805Y2 (en) | 1997-01-16 |
Family
ID=31636838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989087187U Expired - Lifetime JP2522805Y2 (en) | 1989-07-24 | 1989-07-24 | Optical communication device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522805Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004017626A (en) * | 2002-06-20 | 2004-01-22 | Ricoh Co Ltd | Image formation device |
| JP2006041355A (en) * | 2004-07-29 | 2006-02-09 | Furukawa Electric Co Ltd:The | Cooling device |
| JP4965781B2 (en) * | 1999-09-02 | 2012-07-04 | インテル・コーポレーション | Double enclosure optoelectronic package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7229221B2 (en) * | 2005-06-20 | 2007-06-12 | Intel Corporation | Optical transponder with passive heat transfer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60191212A (en) * | 1984-03-12 | 1985-09-28 | Matsushita Electric Ind Co Ltd | Optical circuit device |
-
1989
- 1989-07-24 JP JP1989087187U patent/JP2522805Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60191212A (en) * | 1984-03-12 | 1985-09-28 | Matsushita Electric Ind Co Ltd | Optical circuit device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4965781B2 (en) * | 1999-09-02 | 2012-07-04 | インテル・コーポレーション | Double enclosure optoelectronic package |
| JP2004017626A (en) * | 2002-06-20 | 2004-01-22 | Ricoh Co Ltd | Image formation device |
| JP2006041355A (en) * | 2004-07-29 | 2006-02-09 | Furukawa Electric Co Ltd:The | Cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2522805Y2 (en) | 1997-01-16 |
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