JPH0279093U - - Google Patents
Info
- Publication number
- JPH0279093U JPH0279093U JP15957288U JP15957288U JPH0279093U JP H0279093 U JPH0279093 U JP H0279093U JP 15957288 U JP15957288 U JP 15957288U JP 15957288 U JP15957288 U JP 15957288U JP H0279093 U JPH0279093 U JP H0279093U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- shelf
- heat pipe
- printed board
- generating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
第１図は本考案の実施例の斜視図、第２図は本
考案の実施例の要部平面図、第３図は本考案の実
施例の断面図、第４図は従来例の構成図で、ａは
一部破断斜視図、ｂは側断面図である。
図において、１はシエルフ、１Ａはシエルフ下
板、１Ｂはシエルフ上板、２はバツクボード、３
はバツクボードコネクタ、６はコネクタ、５はプ
リント板、９は遮蔽板、１０は発熱部品、１１は
半導体部品、１５は金属ケース、２０はヒートパ
イプ、２０Ａは吸熱端、２０Ｂは放熱端、２１は
放熱フイン、２５はサーマルカプラ、２５Ａは開
口、２５Ｂは固着板部、２６はばねバンドをそれ
ぞれ示す。
Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a plan view of essential parts of an embodiment of the present invention, Fig. 3 is a sectional view of an embodiment of the present invention, and Fig. 4 is a configuration diagram of a conventional example. In this figure, a is a partially cutaway perspective view, and b is a side sectional view. In the figure, 1 is a shelf, 1A is a shelf lower plate, 1B is a shelf upper plate, 2 is a back board, 3
is a backboard connector, 6 is a connector, 5 is a printed board, 9 is a shielding plate, 10 is a heat generating component, 11 is a semiconductor component, 15 is a metal case, 20 is a heat pipe, 20A is a heat absorption end, 20B is a heat radiation end, 21 25 is a heat radiation fin, 25 is a thermal coupler, 25A is an opening, 25B is a fixing plate portion, and 26 is a spring band.
Claims (1)
ルフ１に挿着される電子機器において、 吸熱端２０Ａ側がプリント板５の挿入方向に直
交するよう該シエルフ１内に固着され、放熱端２
０Ｂは該シエルフ１外に位置するよう装着された
ヒートパイプ２０と、 該ヒートパイプ２０の筒部が挿抜自在に挿入す
る開口を有するばねバンド２６を備え、該開口が
該ヒートパイプ２０に対向する如く、該発熱部品
１０の金属ブロツクに固着されたサーマルカプラ
２５とよりなり、 該プリント板５が該シエルフ１にプラグインさ
れた状態で、該ヒートパイプ２０に該サーマルカ
プラ２５が握着するよう、構成されたことを特徴
とするヒートパイプの取着構造。[Claims for Utility Model Registration] In an electronic device in which a printed board 5 on which a heat-generating component 10 is mounted is inserted into a shelf 1, the heat-absorbing end 20A side is fixed in the shelf 1 such that the heat-absorbing end 20A side is perpendicular to the insertion direction of the printed board 5. and heat dissipation end 2
0B includes a heat pipe 20 mounted outside the shelf 1, and a spring band 26 having an opening into which the cylindrical portion of the heat pipe 20 is inserted and removed, and the opening faces the heat pipe 20. The thermal coupler 25 is fixed to the metal block of the heat generating component 10 as shown in FIG. A heat pipe mounting structure characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15957288U JPH0279093U (en) | 1988-12-08 | 1988-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15957288U JPH0279093U (en) | 1988-12-08 | 1988-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279093U true JPH0279093U (en) | 1990-06-18 |
Family
ID=31440904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15957288U Pending JPH0279093U (en) | 1988-12-08 | 1988-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279093U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020241497A1 (en) * | 2019-05-28 | 2020-12-03 | 株式会社デンソー | Heat-transfer device |
-
1988
- 1988-12-08 JP JP15957288U patent/JPH0279093U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020241497A1 (en) * | 2019-05-28 | 2020-12-03 | 株式会社デンソー | Heat-transfer device |
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