JPH0245694U - - Google Patents

Info

Publication number
JPH0245694U
JPH0245694U JP12458488U JP12458488U JPH0245694U JP H0245694 U JPH0245694 U JP H0245694U JP 12458488 U JP12458488 U JP 12458488U JP 12458488 U JP12458488 U JP 12458488U JP H0245694 U JPH0245694 U JP H0245694U
Authority
JP
Japan
Prior art keywords
heat
insertion groove
shelf
heat pipe
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12458488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12458488U priority Critical patent/JPH0245694U/ja
Publication of JPH0245694U publication Critical patent/JPH0245694U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例の構成図で、aは一部
破断斜視図、bは放熱体部分の側断面、cは要部
断面図、第2図は従来例の構成図で、aは一部破
断斜視図、bは側断面図である。 図において、1はシエルフ、2はバツクボード
、4は孔、5はプリント板、10は発熱部品、1
1はリード端子、15は放熱体、15Aは放熱体
基板部、15Bは放熱体頭部、20はヒートパイ
プ、20Aは吸熱端、20Bは放熱端、21は放
熱フイン、17,30は押え板、40は挿通溝を
それぞれ示す。
Fig. 1 is a block diagram of an embodiment of the present invention, a is a partially cutaway perspective view, b is a side cross section of a heat sink, c is a sectional view of a main part, and Fig. 2 is a block diagram of a conventional example; is a partially cutaway perspective view, and b is a side sectional view. In the figure, 1 is a shelf, 2 is a backboard, 4 is a hole, 5 is a printed board, 10 is a heat generating component, 1
1 is a lead terminal, 15 is a heat sink, 15A is a heat sink board, 15B is a heat sink head, 20 is a heat pipe, 20A is a heat absorption end, 20B is a heat radiation end, 21 is a heat radiation fin, 17 and 30 are a holding plate , 40 indicate insertion grooves, respectively.

Claims (1)

【実用新案登録請求の範囲】 発熱部品10を搭載したプリント板5を、シエ
ルフ1に装着した電子機器において、 該発熱部品10は、放熱体15を介して該プリ
ント板5に固着されてなり、 放熱体頭部15Bに、ヒートパイプ20の吸熱
端20Aがほぼ埋入する挿通溝40を設け、 ばね手段により該挿通溝40に挿入した該吸熱
端20Aの露出部に弾接する如くに、該挿通溝4
0の上部開口部を覆う押え板30を装着して、 該ヒートパイプ20の吸熱端20Aが、シエル
フ側板部分に設けた孔4から該シエルフ1内に挿
入され、該吸熱端20Aが該挿入溝40に嵌入し
、 該ヒートパイプ20の放熱端20Bが、該シエ
ルフ1の外に位置するよう、構成されたことを特
徴とするヒートパイプの取着構造。
[Claims for Utility Model Registration] In an electronic device in which a printed board 5 on which a heat generating component 10 is mounted is attached to a shelf 1, the heat generating component 10 is fixed to the printed board 5 via a heat sink 15, The heat sink head 15B is provided with an insertion groove 40 in which the heat absorption end 20A of the heat pipe 20 is almost embedded, and the insertion groove 40 is inserted into the insertion groove 40 so as to come into elastic contact with the exposed portion of the heat absorption end 20A inserted into the insertion groove 40. Groove 4
0, the heat absorbing end 20A of the heat pipe 20 is inserted into the shelf 1 through the hole 4 provided in the side plate of the shelf, and the heat absorbing end 20A is inserted into the insertion groove. A heat pipe mounting structure characterized in that the heat pipe 20 is fitted into the shell 1, and the heat dissipation end 20B of the heat pipe 20 is located outside the shelf 1.
JP12458488U 1988-09-22 1988-09-22 Pending JPH0245694U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12458488U JPH0245694U (en) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12458488U JPH0245694U (en) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245694U true JPH0245694U (en) 1990-03-29

Family

ID=31374447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12458488U Pending JPH0245694U (en) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245694U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992021927A1 (en) * 1991-06-05 1992-12-10 Fujitsu Limited Heat pipe connector, electronic device and heat radiating fan having said pipe
JP2000356484A (en) * 1999-04-08 2000-12-26 Furukawa Electric Co Ltd:The Thermal connector for heat pipe
JP2003031746A (en) * 2001-07-12 2003-01-31 Meidensha Corp Heat sink
KR100535891B1 (en) * 2002-11-28 2005-12-12 신한시스템산업 주식회사 Method for cooling freezer of electronic machineries and its decice
JP2011243734A (en) * 2010-05-18 2011-12-01 Toshiba Corp Electronic device
JP2018096613A (en) * 2016-12-13 2018-06-21 日本電気株式会社 Heat radiation structure and electronic apparatus
WO2020217893A1 (en) * 2019-04-26 2020-10-29 Necプラットフォームズ株式会社 Heat dissipation structure

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992021927A1 (en) * 1991-06-05 1992-12-10 Fujitsu Limited Heat pipe connector, electronic device and heat radiating fan having said pipe
JP2000356484A (en) * 1999-04-08 2000-12-26 Furukawa Electric Co Ltd:The Thermal connector for heat pipe
JP2003031746A (en) * 2001-07-12 2003-01-31 Meidensha Corp Heat sink
KR100535891B1 (en) * 2002-11-28 2005-12-12 신한시스템산업 주식회사 Method for cooling freezer of electronic machineries and its decice
JP2011243734A (en) * 2010-05-18 2011-12-01 Toshiba Corp Electronic device
JP2018096613A (en) * 2016-12-13 2018-06-21 日本電気株式会社 Heat radiation structure and electronic apparatus
WO2020217893A1 (en) * 2019-04-26 2020-10-29 Necプラットフォームズ株式会社 Heat dissipation structure
EP3962254A4 (en) * 2019-04-26 2023-01-11 NEC Platforms, Ltd. Heat dissipation structure

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