JP2003031746A - Heat sink - Google Patents

Heat sink

Info

Publication number
JP2003031746A
JP2003031746A JP2001211548A JP2001211548A JP2003031746A JP 2003031746 A JP2003031746 A JP 2003031746A JP 2001211548 A JP2001211548 A JP 2001211548A JP 2001211548 A JP2001211548 A JP 2001211548A JP 2003031746 A JP2003031746 A JP 2003031746A
Authority
JP
Japan
Prior art keywords
heat sink
cooling block
pipe
refrigerant
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001211548A
Other languages
Japanese (ja)
Other versions
JP4323116B2 (en
Inventor
Masatake Yoshihara
正猛 吉原
Tomoyasu Hachiro
友康 鉢呂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Original Assignee
Meidensha Corp
Meidensha Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp, Meidensha Electric Manufacturing Co Ltd filed Critical Meidensha Corp
Priority to JP2001211548A priority Critical patent/JP4323116B2/en
Publication of JP2003031746A publication Critical patent/JP2003031746A/en
Application granted granted Critical
Publication of JP4323116B2 publication Critical patent/JP4323116B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink which can solve the problem that its flow passage for circulating a refrigerant is expensive, because the passage is formed through time-consuming cutting, etc., and must be welded with great care for preventing the leakage of the refrigerant. SOLUTION: Recessed sections are provided on one surface of a cooling block and pipes are passed through the recessed sections for circulating the refrigerant. The pipes are integrated with the cooling block by bending leaf springs, retaining plates, or click sections preformed on the block.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、半導体素子を冷却
するためのヒートシンクに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for cooling a semiconductor device.

【0002】[0002]

【従来の技術】図6,図7は半導体装置における素子冷
却用のヒートシンクを示したもので、冷却ブロック1
(1a,1b)の表面側1aには半導体素子2が固着さ
れている。この冷却ブロック1は、例えばアルミニウム
や銅等の熱伝導性の良い材料によって製作され、その内
部には水等の冷媒を循環させるための流路3が形成され
ている。1aと共にヒートシンクを構成するブロック1
bは、流路3が形成された後に被せられ、1a,1bの
接合面は溶接やロー付け等によって一体化されている。
4は冷媒を通すための配管の継ぎ手で、これら冷却ブロ
ック1a,1b、流路3および継ぎ手4によってヒート
シンクが構成される。
2. Description of the Related Art FIGS. 6 and 7 show a heat sink for cooling an element in a semiconductor device.
The semiconductor element 2 is fixed to the front surface side 1a of (1a, 1b). The cooling block 1 is made of, for example, a material having good thermal conductivity such as aluminum or copper, and has therein a flow path 3 for circulating a coolant such as water. Block 1 forming a heat sink with 1a
b is covered after the flow path 3 is formed, and the joint surfaces of 1a and 1b are integrated by welding, brazing, or the like.
Reference numeral 4 denotes a pipe joint for passing a refrigerant, and the cooling blocks 1a and 1b, the flow path 3 and the joint 4 constitute a heat sink.

【0003】[0003]

【発明が解決しようとする課題】従来のヒートシンクに
おいては、冷却ブロックに流路3を形成する手段として
切削加工を行っているため、その切削加工には多大な時
間を要し、また、ブロック1aと1bとの固着は溶接等
で行っているため、その溶接においても冷媒が漏れない
よう細心な管理のもとに製作しなければならず、大変な
手間がかかっている。このため高価なヒートシンクとな
り、納期も長くなっている。また、ヒートシンクの材料
は、循環させる冷媒の種類に合ったものを選択しなけれ
ばならず、例えば水の場合には腐食の関係から銅を使用
する。この場合のヒートシンクは重いものとなり、更に
高価となる問題を有している。
In the conventional heat sink, since a cutting process is performed as a means for forming the flow path 3 in the cooling block, the cutting process requires a great deal of time, and the block 1a is also used. Since the fixing of the adhesives 1b and 1b is performed by welding or the like, the welding must be performed under meticulous control so that the refrigerant does not leak even in the welding, which takes a lot of trouble. Therefore, it becomes an expensive heat sink and the delivery time is long. Further, the material of the heat sink must be selected according to the kind of the circulating refrigerant, and for example, in the case of water, copper is used because of its corrosion. In this case, the heat sink becomes heavy and there is a problem that it becomes more expensive.

【0004】本発明はかかる問題点の解決を目的として
なされたもので、簡単な加工による安価なヒートシンク
を提供することにある。
The present invention has been made for the purpose of solving the above problems, and an object thereof is to provide an inexpensive heat sink by simple processing.

【0005】[0005]

【課題を解決するための手段】本発明の第1は、熱伝導
性の良い材料よりなる冷却ブロックに半導体素子を冷却
するための冷媒循環用の流路を形成したヒートシンクに
おいて、前記冷却ブロックに凹部を形成し、この凹部に
冷媒循環用のパイプを嵌合し、嵌合されたパイプを固定
部材を介して前記冷却ブロックと一体化して構成したこ
とを特徴としたものである。
A first aspect of the present invention is a heat sink having a cooling block made of a material having good thermal conductivity, in which a flow path for circulating a coolant for cooling a semiconductor element is formed. It is characterized in that a concave portion is formed, a pipe for circulating a refrigerant is fitted in the concave portion, and the fitted pipe is integrated with the cooling block through a fixing member.

【0006】本発明の第2は、前記固定部材は、前記冷
却ブロックの凹部に取り付けられる板ばねであることを
特徴としたものである。
A second aspect of the present invention is characterized in that the fixing member is a leaf spring attached to the recess of the cooling block.

【0007】本発明の第3は、前記固定部材は、凹部に
嵌合されたパイプを側面より押さえ込んで冷却ブロック
に固着した押さえ板であることを特徴としたものであ
る。
A third aspect of the present invention is characterized in that the fixing member is a pressing plate which presses the pipe fitted in the recess from the side surface and is fixed to the cooling block.

【0008】本発明の第4は、前記冷却ブロックにおけ
る凹部近傍に爪部を形成し、この爪部を屈曲させること
で前記凹部に嵌合されたパイプを固定することを特徴と
したものである。
A fourth aspect of the present invention is characterized in that a claw portion is formed in the vicinity of the concave portion in the cooling block, and the pipe fitted in the concave portion is fixed by bending the claw portion. .

【0009】[0009]

【発明の実施の形態】図1は、本発明の実施形態を示す
もので、10は熱伝導性に優れた材料によって形成され
た放熱ブロック、11は半導体素子で、1個又は複数個
(ここでは複数個)冷却ブロック10の表面に固着され
る。12は冷媒を循環させるためのパイプで、このパイ
プ12は図2のようにU字状か若しくは螺旋状に形成さ
れて冷却ブロックの反半導体素子取付側に埋設の形で固
着される。13は継ぎ手で、この継ぎ手13は配管を介
して冷媒元に接続され、冷媒により冷却ブロック10を
冷却することによって半導体素子11が発生した熱を吸
収する。なお、冷却ブロック10、パイプ12および継
ぎ手13によってヒートシンクが構成される。上記のよ
うなヒートシンクの製造方法について説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of the present invention, in which 10 is a heat dissipation block formed of a material having excellent thermal conductivity, 11 is a semiconductor element, and one or more (here Then, a plurality of them are fixed to the surface of the cooling block 10. Reference numeral 12 is a pipe for circulating a coolant, and this pipe 12 is formed in a U shape or a spiral shape as shown in FIG. 2 and is fixed to the cooling block in an embedded form on the side opposite to the semiconductor element mounting side. Reference numeral 13 denotes a joint, which is connected to the refrigerant source through a pipe and cools the cooling block 10 with the refrigerant to absorb the heat generated by the semiconductor element 11. The cooling block 10, the pipe 12 and the joint 13 form a heat sink. A method of manufacturing the above heat sink will be described.

【0010】実施形態1 図3は第1の実施形態を示したもので、図1におけるヒ
ートシンクのA−A断面図である。冷却ブロック10の
一面においてパイプ12が配置される位置には、押し出
し加工等によって予め凹部10aが形成される。この凹
部10aに図2のように形成されたパイプ12を嵌合
し、嵌め込んだパイプ12が脱落しないよう外部側より
板ばね14を矢印で示すような過程で押し込み凹部10
aの端面に食い込ませて固定する。板ばね14は、パイ
プ12と接触する部分にはパイプ12の曲率と略同等の
曲率が形成されていることによって両者はより密着し、
パイプ12と放熱ブロック10との一体化を強固として
熱吸収効率を上げている。
Embodiment 1 FIG. 3 shows a first embodiment and is a sectional view of the heat sink in FIG. At the position where the pipe 12 is arranged on one surface of the cooling block 10, a recess 10a is formed in advance by extrusion processing or the like. The pipe 12 formed as shown in FIG. 2 is fitted into the recess 10a, and the leaf spring 14 is pushed in from the outside by a process as shown by an arrow so that the fitted pipe 12 does not fall off.
Fix it by cutting it into the end face of a. Since the leaf spring 14 is formed with a curvature substantially equal to the curvature of the pipe 12 at the portion in contact with the pipe 12, the two are in close contact with each other,
The pipe 12 and the heat radiation block 10 are firmly integrated with each other to improve heat absorption efficiency.

【0011】実施形態2 図4は第2の実施形態を示したもので、冷却ブロックの
凹部10aにパイプ12を装着した後に押さえ板15を
被せ、ねじ又はリベット等の固定手段16を用いてこの
押さえ板15を固定する。これによって冷却ブロック1
0からのパイプ12の脱落を防止すると共に、両者を密
着して一体化することにより熱吸収効率を上げている。
Embodiment 2 FIG. 4 shows a second embodiment, in which a pipe 12 is mounted in a recess 10a of a cooling block, a pressing plate 15 is put over the fixing member 16, and fixing means 16 such as a screw or a rivet is used. The pressing plate 15 is fixed. This makes the cooling block 1
The pipe 12 is prevented from dropping from 0, and the heat absorption efficiency is improved by closely adhering the two together.

【0012】実施形態3 図5は第3の実施形態を示したもので、冷却ブロック1
0には、凹部10aと共に連設して突状の爪部10bが
形成される。このように形成された冷却ブロックの凹部
10aにパイプ12を嵌合し、金型20によって外部よ
り押圧することにより爪部10bを変形させてパイプ1
2を固定する。金型20は、凹部10aに嵌挿されたパ
イプ12の位置と対応する位置に湾曲した型部21を有
しており、この型部21には湾曲部と連設された突部2
2が形成されている。金型20が放熱ブロック10側に
押圧されたとき、突部22が爪部10bと放熱ブロック
本体間に形成された溝10cの中に入り込む。これによ
って爪部10bは、型部21に形成された湾曲の曲面に
沿って互いに内側に巻き込まれるように変形してパイプ
12を密着固定する。図5で示す製造方法の場合、図
3,図4の方法と比較して伝熱面積を大きくとることが
でき、より多くの熱を冷媒に伝えることができる。
Embodiment 3 FIG. 5 shows a third embodiment, which is a cooling block 1.
At 0, a protruding claw portion 10b is formed continuously with the recess 10a. The pipe 12 is fitted into the recess 10a of the cooling block formed in this way, and is pressed from the outside by the mold 20 to deform the claw portion 10b so that the pipe 1
Fix 2 The mold 20 has a curved mold portion 21 at a position corresponding to the position of the pipe 12 fitted in the recess 10a, and the mold portion 21 has a protrusion 2 continuous with the curved portion.
2 is formed. When the die 20 is pressed toward the heat dissipation block 10, the protrusion 22 enters into the groove 10c formed between the claw 10b and the heat dissipation block body. As a result, the claw portions 10b are deformed so as to be rolled inward along the curved curved surface formed on the mold portion 21, and the pipe 12 is closely fixed. In the case of the manufacturing method shown in FIG. 5, the heat transfer area can be made larger than in the methods of FIGS. 3 and 4, and more heat can be transferred to the refrigerant.

【0013】[0013]

【発明の効果】以上のとおり本発明は、冷却ブロック一
面に凹部を設け、この凹部に冷媒循環用のパイプを嵌挿
埋設し、その外側より固定部材によって固定するように
してヒートシンクを構成したものである。このため、冷
媒の流通路は冷媒に適した材質のパイプで簡単,安価に
製作でき、また、冷却ブロックも押し出し加工等で製作
が容易に可能なため、製作が簡単で安価となり、しか
も、冷却ブロックには冷媒が直接接触しないため、冷却
ブロックの材質を用途に応じて自由に変更するこができ
る。更に、ヒートシンクを構成するためのパイプ固定手
段は、板ばねや押さえ板、或いは冷却ブロックの一部を
金型で変形させることで固定が可能であるため、組み立
てが簡単である等の利点を有するものである。
As described above, according to the present invention, a heat sink is formed by providing a concave portion on one surface of a cooling block, inserting and burying a pipe for circulating a refrigerant in the concave portion, and fixing the pipe from the outside by a fixing member. Is. For this reason, the flow passage of the refrigerant can be easily and inexpensively manufactured with a pipe made of a material suitable for the refrigerant, and the cooling block can be easily manufactured by extrusion processing or the like, so that the manufacturing is simple and inexpensive, and the cooling Since the refrigerant does not come into direct contact with the block, the material of the cooling block can be freely changed according to the application. Further, the pipe fixing means for constituting the heat sink can be fixed by deforming a part of the leaf spring, the pressing plate, or the cooling block with a mold, and therefore has an advantage that the assembly is easy. It is a thing.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施形態を示すもので、(a)は正面
図、(b)は上面図、(c)は側面図。
FIG. 1 shows an embodiment of the present invention, in which (a) is a front view, (b) is a top view, and (c) is a side view.

【図2】冷媒循環用のパイプ外形図。FIG. 2 is an external view of a pipe for circulating a refrigerant.

【図3】本発明の実施形態を示す図1(a)におけるA
−A断面図。
FIG. 3A in FIG. 1A showing an embodiment of the present invention
-A sectional view.

【図4】本発明の他の実施形態を示す図1(a)におけ
るA−A断面図。
FIG. 4 is a cross-sectional view taken along the line AA in FIG. 1A showing another embodiment of the present invention.

【図5】本発明の他の実施形態を示す図1(a)におけ
るA−A断面図。
FIG. 5 is a cross-sectional view taken along the line AA in FIG. 1A showing another embodiment of the present invention.

【図6】従来のヒートシンク構成図で、(a)は正面
図、(b)は上面図、(c)は側面図。
FIG. 6 is a conventional heat sink configuration diagram, in which (a) is a front view, (b) is a top view, and (c) is a side view.

【図7】従来のヒートシンクの分割斜視図。FIG. 7 is a divided perspective view of a conventional heat sink.

【符号の説明】[Explanation of symbols]

10…冷却ブロック 10a…凹部 10b…爪部 10c…溝 11…半導体素子 12…冷媒循環用パイプ 13…継ぎ手 14…板ばね 15…押さえ板 16…固定部材 20…金型 21…型部 22…突部 10 ... Cooling block 10a ... Recess 10b ... claw 10c ... groove 11 ... Semiconductor element 12 ... Refrigerant circulation pipe 13 ... Fitting 14 ... Leaf spring 15 ... Press plate 16 ... Fixing member 20 ... Mold 21 ... Mold part 22 ... Projection

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 熱伝導性の良い材料よりなる冷却ブロッ
クに半導体素子を冷却するための冷媒循環用の流路を形
成したヒートシンクにおいて、前記冷却ブロックに凹部
を形成し、この凹部に冷媒循環用のパイプを嵌合し、嵌
合されたパイプを固定部材を介して前記冷却ブロックと
一体化して構成したことを特徴としたヒートシンク。
1. A heat sink in which a cooling block made of a material having good thermal conductivity is provided with a flow path for circulating a cooling medium for cooling a semiconductor element, wherein a recess is formed in the cooling block and the cooling block is circulated. 2. A heat sink characterized in that the pipe is fitted and the fitted pipe is integrated with the cooling block through a fixing member.
【請求項2】 前記固定部材は、前記冷却ブロックの凹
部に取り付けられる板ばねであることを特徴とした請求
項1記載のヒートシンク。
2. The heat sink according to claim 1, wherein the fixing member is a leaf spring attached to the recess of the cooling block.
【請求項3】 前記固定部材は、凹部に嵌合されたパイ
プを側面より押さえ込んで冷却ブロックに固着した押さ
え板であることを特徴とした請求項1記載のヒートシン
ク。
3. The heat sink according to claim 1, wherein the fixing member is a pressing plate that presses the pipe fitted in the recess from the side surface and is fixed to the cooling block.
【請求項4】 前記冷却ブロックにおける凹部近傍に爪
部を形成し、この爪部を屈曲させることで前記凹部に嵌
合されたパイプを固定することを特徴とした請求項1記
載のヒートシンク。
4. The heat sink according to claim 1, wherein a claw portion is formed in the vicinity of the concave portion of the cooling block, and the pipe fitted in the concave portion is fixed by bending the claw portion.
JP2001211548A 2001-07-12 2001-07-12 heatsink Expired - Fee Related JP4323116B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001211548A JP4323116B2 (en) 2001-07-12 2001-07-12 heatsink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001211548A JP4323116B2 (en) 2001-07-12 2001-07-12 heatsink

Publications (2)

Publication Number Publication Date
JP2003031746A true JP2003031746A (en) 2003-01-31
JP4323116B2 JP4323116B2 (en) 2009-09-02

Family

ID=19046840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001211548A Expired - Fee Related JP4323116B2 (en) 2001-07-12 2001-07-12 heatsink

Country Status (1)

Country Link
JP (1) JP4323116B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307553A (en) * 2007-06-12 2008-12-25 Nippon Light Metal Co Ltd Method of manufacturing heat exchanger, and heat exchanger
JP2011002079A (en) * 2009-06-22 2011-01-06 Daikin Industries Ltd Refrigerant pipe installation structure
WO2013157218A1 (en) * 2012-04-20 2013-10-24 ダイキン工業株式会社 Refrigeration device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448047U (en) * 1987-09-18 1989-03-24
JPH0245694U (en) * 1988-09-22 1990-03-29
JPH0279094U (en) * 1988-12-08 1990-06-18
JPH0697337A (en) * 1992-09-09 1994-04-08 Showa Alum Corp Radiator
JPH11510962A (en) * 1995-10-24 1999-09-21 アービッド・サーマル・プロダクツ、インコーポレイテッド Liquid-cooled heat sink for cooling electronic components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448047U (en) * 1987-09-18 1989-03-24
JPH0245694U (en) * 1988-09-22 1990-03-29
JPH0279094U (en) * 1988-12-08 1990-06-18
JPH0697337A (en) * 1992-09-09 1994-04-08 Showa Alum Corp Radiator
JPH11510962A (en) * 1995-10-24 1999-09-21 アービッド・サーマル・プロダクツ、インコーポレイテッド Liquid-cooled heat sink for cooling electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
特許庁編「技術動向シリーズ 特許からみた機械要素便覧〔固着〕」(昭和55年9月25日)、社団法人発明, JPNX007030020, ISSN: 0000860415 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307553A (en) * 2007-06-12 2008-12-25 Nippon Light Metal Co Ltd Method of manufacturing heat exchanger, and heat exchanger
JP2011002079A (en) * 2009-06-22 2011-01-06 Daikin Industries Ltd Refrigerant pipe installation structure
WO2013157218A1 (en) * 2012-04-20 2013-10-24 ダイキン工業株式会社 Refrigeration device
JP2013225582A (en) * 2012-04-20 2013-10-31 Daikin Ind Ltd Freezer
US9377237B2 (en) 2012-04-20 2016-06-28 Daikin Industries, Ltd. Refrigeration apparatus

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Publication number Publication date
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