JPH0279094U - - Google Patents
Info
- Publication number
- JPH0279094U JPH0279094U JP15957388U JP15957388U JPH0279094U JP H0279094 U JPH0279094 U JP H0279094U JP 15957388 U JP15957388 U JP 15957388U JP 15957388 U JP15957388 U JP 15957388U JP H0279094 U JPH0279094 U JP H0279094U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- shelf
- semicircular groove
- metal body
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
第１図は本考案の実施例の一部破断斜視図、第
２図は本考案の実施例の要部正面図、第３図は従
来例の構成図で、ａは一部破断斜視図、ｂは側断
面図である。
図において、１はシエルフ、１Ａはシエルフ下
板、１Ｂはシエルフ上板、２はバツクボード、３
はバツクボードコネクタ、４は挿着孔、５はプリ
ント板、１０は発熱部品、１１は半導体部品、１
５は金属ケース、２０はヒートパイプ、２０Ａは
吸熱端、２０Ｂは放熱端、２１は放熱フイン、２
５は金属体、２６は半円形溝、２７は湾曲ばね板
、３０はサーマルカプラを示す。
Fig. 1 is a partially cutaway perspective view of an embodiment of the present invention, Fig. 2 is a front view of main parts of the embodiment of the present invention, Fig. 3 is a configuration diagram of a conventional example, and a is a partially cutaway perspective view; b is a side sectional view. In the figure, 1 is a shelf, 1A is a shelf lower board, 1B is a shelf upper board, 2 is a back board, and 3
is a backboard connector, 4 is an insertion hole, 5 is a printed board, 10 is a heat generating component, 11 is a semiconductor component, 1
5 is a metal case, 20 is a heat pipe, 20A is a heat absorption end, 20B is a heat radiation end, 21 is a heat radiation fin, 2
5 is a metal body, 26 is a semicircular groove, 27 is a curved spring plate, and 30 is a thermal coupler.
Claims (1)
ルフ１に挿着される電子機器において、 該プリント板５の挿入方向に平行し、ヒートパ
イプ２０が挿入可能の半径の半円形溝２６が、表
面に形成された金属体２５と、 該半円形溝２６の開口側を覆う如くに、該金属
体２５に固着した湾曲ばね板２７とよりなるサー
マルカプラ３０が、 該発熱部品１０の金属ブロツクに、該金属体２
５の底面が密着して固着されてなり、 該プリント板５が該シエルフ１にプラグインし
た状態で、バツクボード２を貫通して該シエルフ
１内に挿入された該ヒートパイプ２０の吸熱端２
０Ａ側が、該半円形溝２６に挿入されて、該サー
マルカプラ３０に着脱自在に嵌着されたことを特
徴とするヒートパイプの取着構造。[Scope of Claim for Utility Model Registration] In an electronic device in which a printed board 5 on which a heat generating component 10 is mounted is inserted into a shelf 1, the printed board 5 is parallel to the insertion direction of the printed board 5 and has a radius within which the heat pipe 20 can be inserted. A thermal coupler 30 includes a metal body 25 with a semicircular groove 26 formed on its surface, and a curved spring plate 27 fixed to the metal body 25 so as to cover the opening side of the semicircular groove 26. The metal body 2 is attached to the metal block of the component 10.
The heat absorption end 2 of the heat pipe 20 is inserted into the shelf 1 through the backboard 2 with the printed board 5 plugged into the shelf 1.
A heat pipe mounting structure characterized in that the 0A side is inserted into the semicircular groove 26 and detachably fitted to the thermal coupler 30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15957388U JPH0279094U (en) | 1988-12-08 | 1988-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15957388U JPH0279094U (en) | 1988-12-08 | 1988-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279094U true JPH0279094U (en) | 1990-06-18 |
Family
ID=31440906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15957388U Pending JPH0279094U (en) | 1988-12-08 | 1988-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279094U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349481A (en) * | 1999-03-31 | 2000-12-15 | Internatl Business Mach Corp <Ibm> | Computer, cooling device therefor and computer assembly |
| JP2003031746A (en) * | 2001-07-12 | 2003-01-31 | Meidensha Corp | Heat sink |
-
1988
- 1988-12-08 JP JP15957388U patent/JPH0279094U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349481A (en) * | 1999-03-31 | 2000-12-15 | Internatl Business Mach Corp <Ibm> | Computer, cooling device therefor and computer assembly |
| JP2003031746A (en) * | 2001-07-12 | 2003-01-31 | Meidensha Corp | Heat sink |