JPH0310547U - - Google Patents
Info
- Publication number
- JPH0310547U JPH0310547U JP1989072219U JP7221989U JPH0310547U JP H0310547 U JPH0310547 U JP H0310547U JP 1989072219 U JP1989072219 U JP 1989072219U JP 7221989 U JP7221989 U JP 7221989U JP H0310547 U JPH0310547 U JP H0310547U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor
- sink member
- contact
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Description
第１図ａ，ｂ，ｃは本考案による半導体放熱用
ヒートシンク部材の実施例を示す斜視図、第２図
は本考案のヒートシンク部材を用いた半導体組立
工程を示す正面図、第３図は半導体組立状態の同
上図、第４図は従来の半導体組立工程を示す正面
図である。
１……基板、２……ヒートシンク部材、３……
半導体素子、４，５……鑞材、Ｊ……加熱治具。
Figures 1a, b, and c are perspective views showing an embodiment of the heat sink member for semiconductor heat dissipation according to the present invention, Figure 2 is a front view showing a semiconductor assembly process using the heat sink member of the present invention, and Figure 3 is a semiconductor The same figure in the assembled state and FIG. 4 are front views showing the conventional semiconductor assembly process. 1... Board, 2... Heat sink member, 3...
Semiconductor element, 4, 5... Brazing material, J... Heating jig.
Claims (1)
ヒートシンク部材が半導体と接する面、及び、該
ヒートシンク部材が基板と接する面のうち、片面
又は両面に予じめ鑞材が一体化されていることを
特徴とする半導体放熱用ヒートシンク部材。 A heat sink member for heat dissipation from a semiconductor, characterized in that a solder material is integrated in advance on one or both of the surfaces of the heat sink member in contact with the semiconductor and the surface of the heat sink member in contact with the substrate. Heat sink components for semiconductor heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989072219U JPH0310547U (en) | 1989-06-20 | 1989-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989072219U JPH0310547U (en) | 1989-06-20 | 1989-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310547U true JPH0310547U (en) | 1991-01-31 |
Family
ID=31609964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989072219U Pending JPH0310547U (en) | 1989-06-20 | 1989-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310547U (en) |
-
1989
- 1989-06-20 JP JP1989072219U patent/JPH0310547U/ja active Pending