JP2017011192A - Resin sealing device and resin sealing method of electronic element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device and a resin sealing method which allows for resin sealing while exposing the surface of a laminate component, without affecting an electronic element, a laminate component, an electronic substrate, and the like to be sealed.SOLUTION: A resin sealing device includes a first formwork attached from one side of a sealing object, a second formwork attached from the other side of a sealing object, and combined in pair with the first formwork, a resin injection port for injecting resin into an internal space formed by combination of the first and second formworks, a through hole provided in the bottom face of the second formwork, and a pressure imparting member inserted into the through hole and imparting a pressure to the sealing object in the internal space from the bottom face. The sealing object is housed in the internal space, and when the first and second formworks are combined, the inner surface of the first formwork abuts against the first exposure surface of the first formwork. When the first and second formworks are combined, the pressure imparting surface of the pressure imparting member imparts a pressure to the second exposure surface of the sealing object.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin sealing device that seals an electronic element mounted on a substrate, and relates to a resin sealing device and a resin sealing method for an electronic element that are sealed with resin while exposing both upper and lower surfaces of the electronic element. .

  Many electronic devices, measuring devices, electrical devices, and transportation devices include an electronic board that processes electrical signals. Many electronic elements such as semiconductor elements and integrated circuits are mounted on these electronic substrates. A single semiconductor element, a semiconductor integrated element such as a microprocessor, or a power element utilizing a high voltage is mounted on an electronic substrate as an electronic element.

  An electronic board on which an electronic element is mounted operates by being stored in an electronic device or a measuring device. At this time, some of the mounted electronic elements are not preferable when exposed on the electronic substrate. In some cases, it is necessary to seal the electronic element with a resin in order to improve durability and compatibility with impact and the like.

  As described above, a resin sealing device that seals an electronic element (single or plural) mounted on an electronic substrate with a resin is used in various situations. A normal resin sealing device completely seals an electronic element mounted on an electronic substrate with a resin.

  On the other hand, a heat radiating element (a heat sink, a heat radiating plate, a heat pipe, etc.) or a sensor element may be laminated on the surface of the electronic element. In such a case, a heat dissipation element and a sensor element are attached on an electronic element such as a semiconductor integrated circuit. As an example, a heat sink is stacked on a microprocessor.

  Such a heat dissipation element or sensor element needs to expose the surface of the electronic substrate due to its functional characteristics. That is, the electronic element on which the heat dissipation element and the sensor element are stacked needs to be sealed with resin, but it is not preferable that the heat dissipation element or the sensor element itself is completely covered with resin. This is because the functional characteristics cannot be exhibited.

  For this reason, in an electronic element in which a heat dissipation element, a sensor element, or the like is stacked, it is necessary to seal the resin so that the surface of the stacked heat dissipation element or sensor element is exposed. If it is not necessary to expose the surface, the entire electronic element may be covered with resin. However, if the surface needs to be exposed, it is necessary to cover only the surface with resin. In the resin sealing device, a mold corresponding to the shape of the resin to be sealed is applied to the electronic element, and the resin is poured there. At this time, if the mold covers the surface of the electronic element, the resin can be reliably poured and covered.

  However, when it is necessary to expose the surface, it is necessary that the surface portion of the mold has a mode in which the surface of the heat dissipation element or the sensor element is just exposed. That is, the portion corresponding to the upper surface of the object to be sealed in the mold has the same height as the object to be sealed, and there is no gap for the resin to enter between the inner surface of the mold and the upper surface of the object to be sealed. It is necessary to do so.

  On the other hand, in sealing of an object to be sealed such as an electronic element in which a heat radiating element or the like is laminated, an upper upper mold and a lower lower mold are fitted from above and below, and pressure is applied. The resin is completely filled in the internal space formed by the mold and the lower mold. The filled resin is cured when a predetermined time elapses. By curing, sealing with resin is completed.

  At this time, as described above, it may be necessary to expose the surface of the heat dissipating element and seal with resin. That is, the surface that must be exposed and the inner surface of the upper mold must match exactly when the upper mold and the lower mold are fitted together. If they do not match, a gap is created between the inner surface of the upper mold and the surface of the heat dissipation element, etc., and the surface covers the resin. Alternatively, the inner surface of the upper mold may apply excessive pressure to the surface of the heat radiating element or the like, and the electronic element or the heat radiating element may be worn during resin sealing.

  In particular, the object to be sealed is composed of an electronic element mounted on an electronic substrate and a heat dissipation element stacked on the electronic element. These electronic elements, heat dissipation elements, etc. have individual differences at the stage of mounting or stacking, and the height from the electronic substrate to the surface of the heat dissipation element (surface that needs to be exposed) can vary. For example, when there are a plurality of objects to be sealed having the same structure on one electronic substrate, the height may be different depending on the objects to be sealed at different positions. Or in different electronic substrates provided with the sealing object of the same structure, the height of the sealing object may differ for every electronic substrate.

  The resin sealing device has a surface corresponding to different heights of the same type of sealing object at different positions on the same electronic substrate and the same type of sealing object on different electronic substrates. It is necessary to seal with a resin so as to expose.

  As described above, a technique for dealing with the height variation in the sealing in which the surface needs to be exposed has been proposed (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3).

JP 2001-267469 A JP 2002-324816 A JP 2007-320102 A

  In Patent Document 1, a groove 44 as a deformable portion that is more easily deformed than other portions of the heat sink is formed continuously around the entire periphery of the upper heat sink. Disclosed is a resin-encapsulated semiconductor device in which, when a plate is pressed from the other side, a portion of the heat radiating plate 40 on the outer peripheral side from the groove 44 is bent in the pressing direction so as to be in close contact with the inner surface of the mold. .

  Patent Document 1 discloses a resin-encapsulated semiconductor device in which a semiconductor device in which a heat radiating plate as a heat radiating element is stacked on an electronic component is sealed with a resin as described in the above-described prior art. At this time, the surface of the heat radiating plate must be exposed even if it is resin-sealed due to the functional characteristics of heat radiation. In order to perform resin sealing, the molding die is formed by fitting the upper die 81 and the lower die 82 to form a space for injecting resin with an electronic element as a sealing object and a heat sink interposed therebetween. At this time, the height of the upper mold and the lower mold of the mold is not limited to the height of the heat sink, even if the height of the heat sink is surely exposed (height in the direction perpendicular to the substrate in the internal space). Cannot handle all height variations.

  For this reason, when the technique of patent document 1 fits an upper mold | type and a lower mold | type, and applies a pressure to a sealing target object, it can deform | transform the peripheral part of the heat sink which provides a pressure. When the pressure is applied, if the height of the object to be sealed due to the laminated structure of the electronic element and the heat sink is higher than the height determined by the upper mold and the lower mold, this peripheral part is deformed, Resin can be injected so that the mold and the lower mold can be fitted to expose the surface of the heat sink. Conversely, when the height of the object to be sealed is equal to the height determined by the upper mold and the lower mold, the peripheral portion can be fitted without being deformed and the resin can be injected.

  As described above, Patent Document 1 discloses that the upper die and the lower die are reliably fitted by deforming the peripheral portion of the heat sink, and the resin does not enter the surface of the heat sink by the reliable fitting, so that the exposed state is obtained. With resin sealing.

  However, in the technique of Patent Document 1, the peripheral portion of the heat sink must be deformable. In order to be deformable, there is a problem that the shape and structure of the heat sink are limited. The electronic device that is the object to be sealed and the heat dissipation plate laminated thereon have various shapes and structures, and the technique of Patent Document 1 cannot cope with this diversity. Furthermore, when the component laminated on the electronic element is not a heat sink but a sensor or the like, it is extremely difficult to make it deformable.

  Of course, it is not preferable for the electronic substrate manufacturing process that the heat sink mounted on the electronic substrate manufactured in all stages may be deformed in the manufacturing process for resin sealing. This is because the deformation causes wear on the electronic substrate or the electronic element or performance degradation.

  Patent Document 2 is configured such that resin molding is performed with an insulating sheet made of a material that can be compressed and deformed on each outer surface of a pair of heat sinks. The resin can be prevented from wrapping around each outer surface of the heat sink. For this reason, since the pressing force of the mold can be relaxed by the insulating sheet, the heating element can be prevented from being damaged. In addition, a semiconductor device is disclosed that can eliminate the need for an insulating structure because an insulating sheet is attached to each outer surface of the heat sink.

  Patent Document 2 also discloses a technique for sealing an object to be sealed in which a heat radiating plate such as a heat radiating plate whose surface needs to be exposed is laminated on an electronic element. In the technique of Patent Document 2, an insulating sheet is mounted on the surface of a heat sink in advance, and an upper mold and a lower mold are fitted from the outside of the insulating sheet to apply pressure. The flexibility of the insulating sheet absorbs pressure, and the difference in pressure application during fitting due to the difference in height of the objects to be sealed is absorbed. As a result, even if there is a variation in height, the upper mold and the lower mold are securely fitted, resin sealing can be performed, and the surface can be exposed.

  However, the technique of Patent Document 2 requires time and effort to attach an insulating sheet to the surface of the heat sink of the object to be sealed. There is also a problem that the manufacturing process increases and the cost increases. In addition, it may be necessary to remove the insulation sheet after sealing with resin, but the insulation sheet is pressed with a strong pressure and is partially integrated with the heat sink by resin. It becomes difficult to remove. If it is forcibly removed, wear such as deformation of the sealed resin occurs, which is not preferable.

  Patent Document 3 has a lower mold and an upper mold that constitutes a mold chamber together with the lower mold, and a plunger that supplies resin to a mold chamber constituted by upper and lower molds. Disclosed is a molding apparatus having a slide member that is a contact surface that moves in the mold clamping direction of the mold and a surface that contacts the object, and a moving member 22 that adjusts the pressing force of the slide member to the object.

  Patent Document 3 is intended to expose both surfaces without attaching other members or the like to the laminated component to be sealed, unlike Patent Documents 1 and 2.

  However, Patent Document 3 has a structure in which a laminated part is pushed in from above to perform resin sealing. For this reason, although the surface of the laminated component is exposed, there is a problem that the height of the resin is higher than the height of the laminated component. Further, since a plurality of parts such as wedges are combined as members to be pressed, there is also a problem that when pressing is applied to the laminated part from above, the pressure is not easily uniform on the surface of the laminated part. That is, there arises a problem that the laminated component is pressed obliquely, and there is a problem that an electronic element mounted on the substrate or a laminated component is distorted during resin sealing.

  As described above, in the prior art, when the surface, particularly the upper and lower surfaces are both exposed and sealed with resin, the resin sealing is performed without adversely affecting the electronic substrate or the like corresponding to the height variation of the object to be sealed. There was a problem that it was difficult to stop.

  SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a resin sealing device and a resin seal capable of resin sealing with the surface of the laminated component exposed without affecting the electronic element, the laminated component, the electronic substrate, and the like to be sealed. The purpose is to provide a stopping method.

In view of the above problems, the electronic device resin sealing device of the present invention includes a first mold frame attached from one of the objects to be sealed,
A second formwork attached from the other of the objects to be sealed and paired with the first formwork;
A resin injection port for injecting resin into the internal space formed by the combination of the first mold and the second mold;
A through hole provided in the bottom surface of the second mold,
A pressure applying member that is inserted into the through hole and applies pressure to the object to be sealed in the internal space from the bottom surface, and
In the internal space, the object to be sealed is accommodated,
When the first mold and the second mold are combined, the inner surface of the first mold contacts the first exposed surface of the object to be sealed,
When the first mold frame and the second mold frame are combined, the pressure applying surface of the pressure applying member applies pressure to the second exposed surface of the object to be sealed.

  In the resin sealing device of the present invention, when electronic elements are mounted on both sides of the electronic substrate, and the laminated parts are laminated on each of the electronic elements on both sides, the surfaces of the laminated parts on both sides are exposed. Resin can be sealed in the state.

  In particular, even when the heights of electronic elements and laminated parts (sealing objects) that are sealed with resin vary in the manufacturing process, the upper mold and the lower mold are sealed by absorbing this variation in height. The object can be fitted to the surface. This fitting can prevent the resin from entering the surface to be exposed.

  It is also possible to simultaneously seal a plurality of objects to be sealed with resin. Even at this time, even if there are variations in the height of a plurality of objects to be sealed with resin at the same time, resin sealing can be performed while correspondingly exposing the surface.

It is a side view of the resin sealing apparatus of the prior art which resin-seals a general sealing target object. It is a side view of the resin sealing apparatus of the prior art which carries out resin sealing of the sealing target object which needs double-sided exposure. It is a side view of the sealing target object which exposed both surfaces and was sealed. It is a side view of the resin sealing apparatus in Embodiment 1 of this invention. It is a bottom view of the 2nd formwork in Embodiment 1 of the present invention. It is a side view which shows the pressure provision member before insertion of the resin sealing apparatus in Embodiment 1 of this invention. It is a side view of the resin sealing device which shows the resin injection | pouring state in Embodiment 1 of this invention. It is a partial side view of the resin sealing device containing the pressure line in Embodiment 1 of this invention. It is a schematic diagram of the resin sealing system in Embodiment 3 of this invention.

The resin sealing device according to the first invention of the present invention is a first mold frame attached from one of the objects to be sealed;
A second formwork attached from the other of the objects to be sealed and paired with the first formwork;
A resin injection port for injecting resin into the internal space formed by the combination of the first mold and the second mold;
A through hole provided in the bottom surface of the second mold,
A pressure applying member that is inserted into the through hole and applies pressure to the object to be sealed in the internal space from the bottom surface, and
In the internal space, the object to be sealed is accommodated,
When the first mold and the second mold are combined, the inner surface of the first mold contacts the first exposed surface of the object to be sealed,
When the first mold frame and the second mold frame are combined, the pressure applying surface of the pressure applying member applies pressure to the second exposed surface of the object to be sealed.

  With this configuration, the resin sealing device can seal the resin to the sealing object in a state where the first exposed surface and the second exposed surface, which are both surfaces to which the sealing object must be exposed, are reliably exposed. .

In the resin sealing device according to the second invention of the present invention, in addition to the first invention, the object to be sealed is an electronic component mounted on the front surface and the back surface of the electronic substrate, and a laminate laminated on the electronic component. Including parts,
The first exposed surface corresponds to the surface of the multilayer component mounted on the surface of the electronic substrate, and the second exposed surface corresponds to the surface of the multilayer component mounted on the back surface of the electronic substrate.

  With this configuration, the resin sealing device can perform resin sealing by reliably exposing the front and back surfaces of the object to be sealed that must be exposed.

  In the resin sealing device according to the third aspect of the present invention, in addition to the first aspect, the pressure applying member applies pressure to the laminated component from the second exposed surface, so that the internal space is the first mold. No gap for resin is formed between the frame and the first exposed surface and between the second mold frame and the second exposed surface.

  With this configuration, the resin sealing device can prevent the resin injected into the first exposed surface and the second exposed surface to be exposed from flowing around due to the pressure application by the pressure application member.

  In the resin sealing device according to the fourth aspect of the present invention, in addition to any one of the first to third aspects, the cross-sectional shape of the through hole is substantially the same as the cross-sectional shape of the pressure applying member.

  With this configuration, the accuracy of the moving operation for applying pressure by the pressure applying member is increased.

  In the resin sealing device according to the fifth aspect of the present invention, in addition to any one of the first to fourth aspects, the pressure applying surface of the pressure applying member is a second corresponding to the laminated component on the back surface of the electronic substrate. It is larger than the exposed surface.

  With this configuration, the entire second exposed surface can be reliably exposed. Furthermore, the flatness of the resin formation state after sealing can also be improved.

  In the resin sealing device according to the sixth invention of the present invention, in addition to any of the first to fourth inventions, the pressure application surface of the pressure application member is a second corresponding to the laminated component on the back surface of the electronic substrate. Smaller than the exposed surface.

  With this configuration, only the outer edge of the second exposed surface can be covered with the resin.

  In addition to any one of the first to sixth inventions, the resin sealing device according to the seventh invention of the present invention further includes a pressure line for moving the pressure applying member.

  With this configuration, the pressure applying operation of the pressure applying member can be reliably performed.

  In the resin sealing device according to the eighth aspect of the present invention, in addition to the seventh aspect, the pressure pipe moves the pressure applying member by hydraulic pressure.

  With this configuration, the accuracy of the movement operation of the pressure applying member can be increased.

  In the resin sealing device according to the ninth aspect of the present invention, in addition to the eighth aspect, when there are a plurality of pressure lines, the same hydraulic pressure is applied to the plurality of pressure lines.

  With this configuration, each of the plurality of pressure applying members can apply the same pressure.

  In the resin sealing device according to the tenth invention of the present invention, in addition to any of the seventh to ninth inventions, the pressure pipe can change the pressure applied to the pressure applying member.

  With this configuration, pressure application by the pressure application member can be adjusted.

  In the resin sealing device according to the eleventh invention of the present invention, in addition to any one of the first to tenth inventions, in the internal space, between the second exposed surface and the pressure applying surface of the pressure applying member. And a laying sheet that can be installed on the inner surface of the second formwork.

  With this configuration, resin leakage from the through hole can be reliably prevented.

  In the resin sealing device according to the twelfth invention of the present invention, in addition to the eleventh invention, the laying sheet closes the through hole, and the pressure application surface applies pressure to the second exposed surface from the outside of the laying sheet. To do.

  With this configuration, it is possible to apply pressure to the second exposed surface while securing the resin formation space with the laying sheet.

  In the resin sealing device according to the thirteenth invention of the present invention, in addition to any of the first to twelfth inventions, the resin injection port is formed by combining the first mold frame and the second mold frame. The resin is injected into the internal space in a state where the frame contacts the first exposed surface and the pressure applying member applies pressure to the second exposed surface.

  With this configuration, the resin is injected in a state in which a space for resin sealing is reliably formed. As a result, the shape of the resin after sealing matches the assumed shape.

  In the resin sealing device according to the fourteenth aspect of the present invention, in addition to any of the first to fourteenth aspects, an increase in the resin pressure, which is the pressure applied to the object to be sealed by the resin filled in the internal space. In accordance with the above, the pressure of the pressure applying member is increased.

  With this configuration, even if the resin pressure increases, the pressure applying member does not cause a gap on the first exposed surface or the second exposed surface.

A resin sealing system according to a fifteenth aspect of the present invention includes a plurality of resin sealing devices according to any one of claims 1 to 14,
A concentration line that bundles the pressure lines of a plurality of resin sealing devices;
A pressure generating unit that applies pressure to the central conduit,
The pressure generated by the pressure generator is commonly applied to the plurality of pressure pipes.

  With this configuration, a plurality of objects to be sealed can be simultaneously resin-sealed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Necessity of double-sided exposure and problem analysis)
First, the case where double-sided exposure is necessary and the problem analysis of resin sealing of such a sealing object will be described. FIG. 1 is a side view of a conventional resin sealing apparatus for resin-sealing a general object to be sealed. FIG. 2 is a side view of a prior art resin sealing device that seals a sealing object that requires double-sided exposure.

  The resin sealing device 100 forms an internal space 110 by a combination of the upper mold 101 and the lower mold 102. By injecting the resin into the internal space 110, the object to be sealed is sealed with the resin. The objects to be sealed are electronic components 51 and 53 mounted on both surfaces of the substrate 50. Each of the electronic components 51 and 53 only needs to be entirely covered with resin, including the surface thereof, so that all the upper and lower sides of the electronic components 51 and 53 are covered with resin. For this reason, the inner surfaces of the upper mold 101 and the lower mold 102 in the vertical direction are higher than the heights of the electronic components 51 and 53. Even if there is manufacturing variation in the height of the electronic components 51 and 53, the upper mold 101 and the lower mold 102 only need to have a sufficiently high height. The lower mold 102 is not required to have high accuracy.

  On the other hand, FIG. 2 shows the resin sealing device 100 when the surfaces of the sealing objects on both sides of the electronic substrate 50 must be exposed and sealed.

  The sealing objects are the electronic components 51 and 53 mounted on both surfaces of the electronic substrate 50, the laminated component 52 laminated on the electronic component 51, and the laminated component 54 laminated on the electronic component 53. Each of the surfaces of the laminated parts 52 and 54 needs to be exposed.

  For this reason, the inner space 110 formed by the upper mold 101 and the lower mold 102 needs to have the inner surface exactly aligned with the height of the laminated parts 52 and 54. FIG. 2 shows a state in which this height is exactly the same. If the height is exactly, the surfaces of the laminated component 52 and the laminated component 54 are exactly aligned with the upper mold 101 and the lower mold 102 as shown in FIG. 2, and the resin may enter these surfaces. No. Even if the resin is injected into the internal space 110, the resin sealing is performed with the surfaces of the laminated component 52 and the laminated component 54 exposed as shown in FIG. FIG. 3 is a side view of an object to be sealed with both surfaces exposed and sealed.

  The laminated parts 52 and 54 are heat radiating elements and sensor elements, and need to be exposed without covering the surface with a resin because of their functional characteristics.

  In FIG. 2, the internal space 110 does not create a gap on the surface of the laminated parts 52 and 54 so that the surface can be exposed. That is, it is assumed that the combination of the upper mold 101 and the lower mold 102 exactly matches the height of the object to be sealed from the electronic component to the laminated component.

  However, as for the sealing object, laminated parts are laminated on the electronic parts, and these are mounted on both sides of the electronic substrate 50. For this reason, the height of the object to be sealed is the height of the object to be sealed, which is the height of the object to be sealed, which is the distance from the surface of the laminated part 54 to the surface of the laminated part 52. . This height may vary depending on the mounting of electronic parts and laminated parts. Since the upper mold 101 and the lower mold 102 have a predetermined shape and size, the thickness of the internal space 110 formed by the upper mold 101 to the lower mold 102 is larger than the height of the object to be sealed. In this case, the resin enters the surfaces of the laminated parts 52 and 54. On the contrary, when the thickness of the internal space 110 is smaller than the height of the object to be sealed, the upper mold 101 and the lower mold 102 are not combined and the internal space 110 into which the resin is injected cannot be formed. If they are forcibly combined, the object to be sealed may be damaged.

  That is, in an object to be sealed in which electronic parts or laminated parts are mounted on both surfaces of the electronic substrate 50 and the surfaces on both sides are exposed and resin sealing is required, the internal space 110 for injecting the resin is matched to the variation. It was extremely difficult to form.

(Overview)
An overall outline of the resin sealing device in the first embodiment will be described.

  FIG. 4 is a side view of the resin sealing device according to Embodiment 1 of the present invention. FIG. 4 shows the resin sealing device 1 as viewed from the side, with the inside visible. In the resin sealing device 1 of FIG. 4, the sealing object 60 for performing resin sealing is the same as that described with reference to FIGS.

  That is, the electronic component 51 is mounted on the surface of the electronic substrate 50, and the laminated component 52 is mounted on the surface of the electronic component 51. In addition, an electronic component 53 is mounted on the back surface of the electronic substrate 50, and a laminated component 54 is mounted on the front surface of the electronic component 53. Note that there is no electronic component 53 on the back surface of the electronic substrate 50, and only the laminated component 54 may be mounted.

  The electronic components 51 and 52 and the laminated components 53 and 54 that are mounted on both surfaces of the electronic substrate 50 are the sealing object 60 that is sealed with resin. The resin sealing device 1 according to the first embodiment seals the sealing object 60 mounted on both surfaces of the electronic substrate 50 in this way with resin. At this time, each of the first exposed surface 61 that is one surface of the sealing object 60 and the second exposed surface 62 that is the other surface needs to be exposed after sealing with resin. is there.

  The resin sealing device 1 includes a first mold 2, a second mold 3, a resin injection port 5, and a through hole 6 pressure application member 7. Furthermore, a laying sheet 8 is provided.

  The first mold 2 is one frame member that is attached from one of the objects to be sealed 60 and forms the internal space 4 that is sealed with resin. The second mold 3 is paired and combined with the first mold 2 to form an internal space 4 in combination with the first mold 2. The internal space 4 is formed by combining the first mold frame 2 and the second mold frame 3 with the sealing object 60 interposed therebetween.

  The resin injection port 5 injects resin into the internal space 4 and fills the internal space 4 with resin. Since the filled resin is cured after a lapse of a predetermined time, the internal space 4 is sealed with the resin. That is, as is apparent from FIG. 4, the sealing object 60 can be sealed with resin on both the upper and lower surfaces.

  The through hole 6 is provided on the bottom surface of the second mold 3. FIG. 5 is a bottom view of the second mold in Embodiment 1 of the present invention. As shown in FIG. 5, the through hole 6 is a hole penetrating from the bottom surface of the second mold 2 to the internal space 4.

  A pressure applying member 7 is inserted into the through hole 6. The pressure applying member 7 operates inside the penetrating term 6 of the second mold 3 to apply pressure to the second exposed surface 62 of the sealing object 60. Here, the pressure applying member 7 can move up and down inside the through hole 6. Further, the through hole 6 completely penetrates the second mold 3. For this reason, the pressure imparting member 7 can reach a position that protrudes from the surface of the second formwork on the sealing object 60 side.

  That is, even when the surface of the second mold 3 does not reach the second exposed surface 62 of the object 60 to be sealed, the pressure applying member 7 can come into contact with the second exposed surface 62.

  The inner surface of the first mold 2 abuts on the first exposed surface 61 of the sealing object 60. When the first mold 2 and the second mold 3 are combined, the pressure applying member 7 can indirectly contact the second exposed surface 62 of the sealing object 60. By this contact, pressure can be applied to the second exposed surface 62. At the time of this contact, even if the inner surface of the second mold 3 is not aligned with the second exposed surface 62 of the object 60 to be sealed, the surface of the pressure applying member 7 is the first of the object 60 to be sealed. (2) The contact can be made in alignment with the position of the exposed surface 62 (the contact may be via the laying sheet 8). In the contact, a pressure necessary for maintaining the internal space 4 necessary for resin sealing is also applied.

  The height from the first exposed surface 61 to the second exposed surface 62 of the sealing object 60 may have a variation due to manufacturing variations. Compared to the case where the internal space 4 is formed only by the first mold 2 and the second mold 3, the resin sealing device 1 can form the internal space 4 including the pressure applying member 7. By this formation, the internal space 4 aligned with the first exposed surface 61 and the second exposed surface 62 can be formed corresponding to the variation in the height of the sealing object 60. For example, when the height of the inner space formed by the combination of the first mold 2 and the second mold 3 is higher than the height of the sealing object 60, the height of the sealing object 60 is This difference can be filled by the pressure applying member 7.

  By eliminating such a difference, even if resin is injected into the internal space 4, the first exposed surface 61 and the second exposed surface 62 of the sealed object 60 after being sealed with the resin are reliably Can be exposed.

  The first exposed surface 61 corresponds to the surface of the multilayer component 52 mounted on the surface of the electronic substrate 50, and the second exposed surface 62 corresponds to the surface of the multilayer component 54 mounted on the back surface of the electronic substrate 50. To do.

(Description of resin sealing operation)
The operation of resin sealing of the object to be sealed 60 by the resin sealing device 1 will be described.

(Combination of formwork)
As described above, the resin sealing device 60 is the electronic component 51 or the laminated component 53 mounted on the electronic substrate 50. The first mold 2 and the second mold 3 are combined from above and below the sealing object 60. The first mold frame 2 and the second mold frame 3 are formed in accordance with the size and type of the object to be sealed 60, and form a basic internal space 4 for performing resin sealing.

(Installation of laying sheet)
A laying sheet 8 is installed on the inner surface of the second mold 3. The laying sheet 8 prevents resin leakage from the through hole 6. Furthermore, the surface of the resin that is injected into the internal space 4 and hardened can be formed.

  The pressure applying member 7 rises at the penetrating term 6 and contacts the second exposed surface 62 via the laying sheet 8 to apply pressure.

  In addition, by installing the laying sheet 8, resin leakage from the internal space 4 through the through hole 6 can be reliably prevented. On the other hand, due to the shape relationship with the through hole 6 of the pressure application member 7 inserted into the through hole 6, the resin leakage from the through hole 6 may be prevented even without the laying sheet 8.

(Installation of pressure application member and application of pressure)
The pressure applying member 7 is inserted into the through hole 6 of the second mold 3 in a state where the first mold 2 and the second mold 3 are combined. FIG. 6 shows a state before this insertion. FIG. 6 is a side view of the resin sealing device according to Embodiment 1 of the present invention before the pressure applying member is inserted.

  The pressure applying member 7 is inserted from the bottom surface of the through hole 6. The arrows in FIG. 6 indicate the insertion direction of the pressure applying member 7 into the through hole 6. Furthermore, the upward direction when the pressure applying member 7 applies pressure to the second exposed surface 62 is shown.

  As shown in FIG. 6, the surface of the pressure applying member 7 reaches the laying sheet 8 by inserting the pressure applying member 7 into the through-hole 6 and rising. The surface of the pressure applying member 7 is in contact with the second exposed surface 62 through the laying sheet 8. After contact, the surface of the pressure applying member 7 applies pressure to the second exposed surface 62.

  The state where the pressure is applied is the state shown in FIG. That is, the state of FIG. 6 changes to the state of FIG.

  By being in the state of FIG. 4, the internal space 4 formed by the first mold frame 2, the second mold frame 3, the pressure applying member 7 and the laying sheet 8 includes the sealing object 60 and the first exposed surface. Align with the height of 61 and the second exposed surface 62. Due to this alignment, the internal space 4 has a gap between the first exposed surface 61 and the inner surface of the first mold 2 and between the second exposed surface 62 and the inner surface of the second mold 3 (laying sheet 8). Does not cause.

  The first mold 2 and the second mold 3 may be combined with the pressure applying member 7 inserted into the through-hole 6 from the beginning.

(Resin injection)
When the state shown in FIG. 4 is reached, resin is injected from the resin injection port 5. FIG. 7 is a side view of the resin sealing device showing the resin injection state in the first embodiment of the present invention. Resin 51 is injected from the resin injection port 5.

  The resin injection port 5 injects the resin 51 into the internal space 4. When the injection is performed, the resin 51 is gradually filled in the internal space 4. In the situation where it is filled, the resin 51 also accumulates on the surface of the laying sheet 8 in the internal space 4. As the accumulation proceeds, the interior space 4 is filled with the resin 51.

  At this time, the pressure applying member 7 applies pressure to the second exposed surface 62 via the laying sheet 8. By applying this pressure, there is no gap between the second exposed surface 62 and the laying sheet 8 even if there is a filling pressure with the resin 51. Of course, there is no gap between the inner surface of the first mold 2 and the first exposed surface 61 as well.

  In addition, the laying sheet 8 prevents the resin 51 from leaking from the through hole 6.

  As described above, when the pressure applying member 7 applies pressure from the inside of the through hole 6 of the second mold 3, the resin 51 adheres to the surfaces of the first exposed surface 61 and the second exposed surface 62 or is laminated. Can be prevented.

(Removing the formwork)
A predetermined time is set after the resin 51 is filled in the internal space 4. After the predetermined time has elapsed, the resin 51 is cured.

  After the curing, the first mold 2 and the second mold 3 are removed. Furthermore, the laying sheet 8 is also removed. Since the laying sheet 8 is in the form of a film, it can be easily removed if the resin 51 is cured.

  When these are removed, the sealing object 60 is in a state where a predetermined shape (corresponding to the shape of the internal space 4) is resin-sealed. The electronic substrate 50 on which the resin-sealed sealing object 60 is mounted proceeds to the next step as necessary.

  As described above, the resin sealing device 1 according to the first embodiment corresponds to the variation in the height of the object to be sealed 60, and the first exposed surface 61 and the second exposed surface 62 are reliably exposed, Resin sealing is possible.

  Next, the detail of each part is demonstrated.

(First formwork)
The first mold 2 is fitted from one side of the sealing object 60. The first mold 2 forms a part of the resin sealing region in the sealing object 60. It is also preferable that the first mold 2 has a fitting portion so that the second mold 3 can be fitted.

  The first mold 2 may be provided with a resin injection port 5. When the resin injection port 5 is provided, the first mold 2 is provided with a hole communicating with the internal space 4.

  The first mold 2 may be made of metal, alloy, hard resin, or the like. Moreover, the inner surface should just have the shape corresponding to the area | region to which resin sealing is carried out. By having this shape, the inner surface of the first mold 2 comes into contact with the first exposed surface 61 of the object 60 to be sealed. The shape and size of the first mold 2 are determined so as to come into contact with each other, and the resin is reliably sealed with the first exposed surface 61 of the sealing object 60 exposed.

(Second formwork)
The second mold 3 is paired with the first mold. By combining the second mold 3 with the first mold 2, an internal space 4 that is a sealed space made of resin is formed. It is preferable that the shape and size of the second mold 3 are basically determined so that the inner surface of the second mold 3 basically contacts the second exposed surface 62 of the object 60 to be sealed.

  However, the height of the sealing object 60 may vary even with the same standard or product number due to manufacturing variations of the electronic parts 51 and 52 and the laminated parts 53 and 54 constituting the sealing object 60. is there.

  For this reason, the second mold 3 includes a through hole 6, and the pressure applying member 7 inserted into the through hole 6 comes into contact with the second exposed surface 62 through the laying sheet 8. For this reason, it is also preferable that the height of the second mold 3 is matched to the highest height in the variation in the height of the sealing object 60.

  The second mold 3 is provided with a through hole 6. A pressure applying member 7 is inserted into the through hole 6. For this reason, it is also preferable that the cross-sectional shape of the through hole 6 is substantially the same as the cross-sectional shape of the pressure applying member 7.

  For example, if the cross-sectional shape of the pressure applying member 7 is substantially circular, the through hole 6 is also substantially circular. At this time, in addition to substantially the same shape, it is also preferable that the cross-sectional areas are substantially the same. Since the shape and the cross-sectional area are substantially the same, there is an advantage that the pressure applying member 7 fits in the through hole 6 exactly.

  It is also preferable that the second mold 3 is provided with a fitting member so as to be fitted with the first mold 2. Moreover, what is necessary is just to form with the raw material similar to the 1st mold 2.

(Pressure imparting member)
The pressure applying member 7 moves up the through hole 6 and applies pressure to the second exposed surface 62 via the laying sheet 8. By applying this pressure, it is possible to prevent a gap from being generated between the inner surface of the first mold 2 and the first exposed surface 61. Similarly, it is possible to prevent a gap from being generated between the inner surface of the second mold 3 and the second exposed surface 62 (in other words, to prevent a gap from being generated between the laying sheet 8 and the second exposed surface 62). it can).

  In FIG. 4 and the like, the through-hole 6 is provided in the lower second mold 3, but may be provided in the upper first mold 2. For this reason, although the pressure provision member 7 inserted in the through-hole 6 may be on the second mold 3 side, it may be on the first mold 2 side. That is, first and second such as the first mold 2 and the second mold 3 are words for convenience, and the distinction from the upper side and the lower side is not limited to that shown in FIG.

  For this reason, if the pressure application member 7 is provided on the lower side of the sealing object 60, the pressure application member 7 rises to apply pressure to the second exposed surface 62. Conversely, if the pressure applying member 7 is provided on the upper side of the sealing object 60, the pressure is applied to the second exposed surface 62 by lowering. In short, the pressure applying member 7 applies pressure by raising or lowering according to the state on the side where the through hole 6 is provided.

  The surface of the pressure applying member 7 is a pressure applying surface. The pressure application surface is preferably larger than the second exposed surface 62 corresponding to the laminated component 54 of the sealing object 60. That is, the area of the pressure applying surface is larger than the area of the second exposed surface 62.

  By having such a relationship, the pressure applying member 7 can apply pressure in a state in which the entire second exposed surface 62 is covered. As a result, the injected resin does not enter the second exposed surface 62. That is, the resin does not adhere to the surface of the second exposed surface 62.

  Conversely, it is also preferable that the pressure applying surface of the pressure applying member 7 is smaller than the second exposed surface 62. That is, the area of the pressure applying surface is smaller than the area of the second exposed surface 62.

  By having such a relationship, the resin enters the outer edge of the second exposed surface 62. In some cases, it may be preferable that the sealing is performed in a state where the resin adheres to the outer edge of the second exposed surface 62. For example, it is a case where it is desired to further increase the sealing strength.

  As described above, the relationship between the size of the pressure applying surface that is the surface of the pressure applying member 7 and that applies pressure and the size of the second exposed surface 62 that receives the pressure varies, and thus the second exposed surface. The shape of the resin sealing at 62 can be adjusted.

  FIG. 8 is a side view of a part of the resin sealing device including the pressure line in the first embodiment of the present invention. In consideration of the ease of illustration, FIG. 8 shows the lower part of the resin sealing device 1.

  The resin sealing device 1 in FIG. 8 further includes a pressure line 9 for moving the pressure applying member 7. The pressure line 9 accommodates the pressure applying member 7 and performs a moving operation such as raising the pressure applying member 7. By being accommodated in the pressure line 9, there is an advantage that the movement of the pressure applying member 7 is smooth and accurate.

  Here, the pressure line 9 may move the pressure applying member 7 by hydraulic pressure. For example, the inside of the pressure line 9 is sealed by the pressure applying member 7. Oil for hydraulic pressure is accommodated in the sealed space. By this movement of the oil component, the pressure line 9 performs a moving operation such as raising the pressure applying member 7.

  By causing the pressure pipe 9 to move the pressure applying member 7 by hydraulic pressure, the pressure applying member 7 can apply pressure to the second exposed surface 62 while receiving necessary pressure adjustment.

  The pressure applying member 7 can apply an appropriate pressure to the second exposed surface 62 based on the control of the pressure line 9 and the like. In particular, in the time from when the resin is injected from the resin injection port 5 until the resin is cured, it is possible to maintain the appropriate pressure necessary for exposing the first exposed surface 61 and the second exposed surface 62.

(Resin inlet)
The resin injection port 5 injects resin into the internal space 4. The resin injection port 5 is formed in at least one of the first mold 2 and the second mold 3. That is, the resin injection port 5 may be provided in the first mold 2, may be provided in the second mold 3, or may be provided in both. Moreover, you may provide in the fitting part of the 1st mold 2 and the 2nd mold 3.

  Further, a plurality of resin inlets 5 may be provided instead of a single one. This is because the resin injection into the internal space 4 is more efficiently performed by providing the plurality of resin injection ports 5.

  The resin injection port 5 is a portion communicating with the internal space 4 and can be connected to an external resin supply unit. By being connectable, the resin can be continuously and efficiently supplied to the internal space 4 by connection from the resin supply unit.

  At this time, the resin supply unit controls the resin supply speed based on the relation with the internal space 4 and the like. By this control, the resin injection port 5 injects the resin into the internal space 4 at an appropriate amount or at an appropriate speed.

  Here, in the resin injection port 5, the first mold 2 and the second mold 3 are combined, the first mold 2 contacts the first exposed surface 61, and the pressure applying member 7 is the second exposed surface 62. After the pressure can be applied, the resin is injected into the internal space 4. As described above, the resin injection port 5 is in a state in which the internal space 4 is formed and no gap is formed between the first exposed surface 61 and the first mold frame 2, and the second exposed surface 62 and the laying sheet 8 Resin is poured into the internal space 4 after no gap is formed.

  By the injection at this timing, resin sealing can be performed so that the resin does not adhere to the surfaces of the first exposed surface 61 and the second exposed surface 62.

  As described above, the resin sealing device 1 according to the first embodiment deforms the sealing object 60 in the sealing object 60 that needs to be resin-sealed by exposing both surfaces of the electronic substrate 50, or redundantly. The resin sealing can be performed in a shape in which the outer shape is difficult to be deformed while the respective exposed surfaces are surely exposed without requiring an additional process.

  (Embodiment 2)

  Next, a second embodiment will be described.

(Pressure control of pressure applying member according to resin pressure)
It is also preferable for the pressure applying member 7 to increase the pressure applied to the second exposed surface 62 in accordance with an increase in the resin pressure of the resin injected into the internal space 4.

  As the resin is injected from the resin injection port 5, the resin injected into the internal space 4 applies pressure to the sealing object 60. When the injected resin comes into contact with the sealing object 60, the resin applies pressure to the sealing object 60. Similarly, the injected resin applies pressure to the internal space 4 and also applies pressure to the first mold 2 and the second mold 3 (laying sheet 8). This pressure is the resin pressure.

  The resin pressure increases as the amount of injected resin increases. Since the resin pressure applies pressure to the first mold 2 and the second mold 3, as the resin pressure increases, the internal space 4 receives pressure spreading outward. Due to this pressure, the pressure applied from the second exposed surface 62 is also applied to the pressure applying member 7. This pressure increases as the resin pressure increases.

  When the pressure to push back the pressure applying member 7 increases, the pressure on the second exposed surface 62 of the pressure applying member 7 may become insufficient. If it becomes insufficient, a gap may be generated between the second exposed surface 62 and the laying sheet 8.

  For this reason, it is preferable that the pressure application member 7 increases the pressure according to the increase in the resin pressure. This is because the above-described problems can be prevented by increasing the pressure in accordance with the increase in the resin pressure.

  (Embodiment 3)

  Next, a third embodiment will be described. In the third embodiment, a case where there are a plurality of pressure lines will be described. That is, a resin sealing system in which a plurality of the resin sealing devices 1 described in the first and second embodiments are provided will be described.

  FIG. 9 is a schematic diagram of a resin sealing system according to Embodiment 3 of the present invention. A resin sealing system 200 shown in FIG. 9 includes a plurality of resin sealing devices 1. The resin sealing device 1 is the resin sealing device 1 described in the first and second embodiments. The resin sealing system 200 of FIG. 9 shows a state in which two resin sealing devices 1A and 1B are provided. Of course, three or more resin sealing devices 1 may be provided.

  For example, when a plurality of objects to be sealed 60 are provided on the same electronic substrate 50, a resin sealing system 200 including a plurality of resin sealing devices 1A and 1B as shown in FIG. 9 is used. Alternatively, when a plurality of sealing objects 60 having the same specifications are to be resin-sealed at the same time, a resin sealing system 200 including a plurality of resin sealing devices 1A and 1B is used.

  The resin sealing system 200 is advantageous in that a plurality of objects to be sealed 60 can be simultaneously resin-sealed.

  In FIG. 9, the reference numerals of the first mold 2 and the like described in FIG. 4 and the like are omitted for easy viewing.

  Moreover, the resin sealing system 200 may use the laying sheet 8 or the like in common in the plurality of resin sealing devices 1A and 1B. Further, the first mold frame 2 and the second mold frame 3 may be separate from each of the sealing objects 60A and 60B, or may be connected members.

  Since the resin sealing system 200 includes a plurality of resin sealing devices 1A and 1B, pressure pipes 9A and 9B corresponding to the pressure applying members 7A and 7B are provided. Each of the pressure lines 9A and 9B moves the pressure applying members 7A and 7B by the oil pressure by the oil component 91, respectively. By this movement, each of the pressure applying members 7A and 7B can apply pressure to the second exposed surfaces 62 of the sealing objects 60A and 60B.

  Here, the resin sealing system 200 includes the concentrated conduit 201 that bundles the plurality of pressure conduits 9A and 9B because of the plurality of pressure conduits 9A and 9B. The concentrated conduit 201 fills and moves the oil component 91 that generates hydraulic pressure. A pressure generating unit 210 that generates pressure due to the oil component 91 is connected to the concentrated conduit 201.

  The pressure generator 210 supplies, for example, the oil component 91 to the concentrated conduit 201. With this supply, the concentrated conduit 201 receives pressure and can transmit pressure to each of the plurality of pressure conduits 9A and 9B to be connected.

  That is, in the resin sealing system 200, the pressure generated by the pressure generator 210 is transmitted to the plurality of pressure lines 9 </ b> A and 9 </ b> B through the concentrated line 201. The pressure line 9A applies pressure to the second exposed surface 62 in the resin sealing device 1A. Similarly, the pressure line 9B applies pressure to the second exposed surface 62 in the resin sealing device 1B. By applying pressure in each, as described in the first and second embodiments, the sealing of the sealing objects 60A and 60B in the resin sealing devices 1A and 1B can be performed.

  Here, the pressure based on the pressure generation unit 210 is commonly applied to each of the plurality of pressure pipes 9A and 9B. That is, the same pressure is applied to each of the plurality of pressure lines 9A and 9B. This is the same whether the pressure is the oil pressure by the oil component 91 or the air pressure.

  By applying the same pressure to each of the plurality of pressure pipes 9A and 9B, there is an advantage that the finish of resin sealing in each of the sealing objects 60A and 60B having the same specification is made uniform. By being made uniform, the resin sealing system 200 can simultaneously perform resin sealing on the sealing object 60 having the same specification.

  As described above, the resin sealing system 200 according to Embodiment 3 can simultaneously seal a plurality of objects to be sealed 60.

  The resin sealing device and the resin sealing system described in the first to third embodiments are examples for explaining the gist of the present invention, and include modifications and modifications without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Resin sealing apparatus 2 1st mold frame 3 2nd mold frame 4 Internal space 5 Resin injection port 6 Through-hole 7 Pressure application member 8 Laying sheet 9 Pressure pipe 91 Oil content 50 Electronic substrate 51, 53 Electronic components 52, 54 Lamination Component 60 Object to be sealed 200 Resin sealing system 201 Concentrated pipeline 210 Pressure generator

Claims (16)

A first formwork attached from one of the objects to be sealed;
A second formwork attached from the other of the objects to be sealed and paired with the first formwork;
A resin injection port for injecting resin into an internal space formed by a combination of the first mold and the second mold;
A through hole provided in a bottom surface of the second mold,
A pressure applying member that is inserted into the through-hole and applies pressure to the object to be sealed in the internal space from the bottom surface,
The internal space contains the object to be sealed,
When the first mold and the second mold are combined, the inner surface of the first mold is in contact with the first exposed surface of the object to be sealed,
When the first mold and the second mold are combined, the pressure applying surface of the pressure applying member applies pressure to the second exposed surface of the object to be sealed. . The sealing object includes an electronic component mounted on a front surface and a back surface of an electronic substrate and a laminated component laminated on the electronic component,
The first exposed surface corresponds to the surface of the multilayer component mounted on the surface of the electronic substrate, and the second exposed surface corresponds to the surface of the multilayer component mounted on the back surface of the electronic substrate. The resin sealing device for an electronic element according to claim 1.   The pressure applying member applies pressure to the laminated component from the second exposed surface, so that the internal space is between the first mold frame and the first exposed surface, and the second mold frame. The resin sealing device for an electronic element according to claim 1, wherein no gap for the resin to enter is formed between the second exposed surface and the second exposed surface.   The resin sealing device for an electronic element according to claim 1, wherein a cross-sectional shape of the through hole is substantially the same as a cross-sectional shape of the pressure applying member.   5. The resin sealing device for an electronic element according to claim 1, wherein the pressure applying surface of the pressure applying member is larger than the second exposed surface corresponding to the laminated component on the back surface of the electronic substrate.   5. The resin sealing device for an electronic element according to claim 1, wherein the pressure applying surface of the pressure applying member is smaller than the second exposed surface corresponding to the laminated component on the back surface of the electronic substrate.   The resin sealing device for an electronic element according to claim 1, further comprising a pressure pipe for moving the pressure applying member.   The resin sealing device for an electronic element according to claim 7, wherein the pressure pipe moves the pressure applying member by hydraulic pressure.   The resin sealing device for an electronic element according to claim 8, wherein when there are a plurality of pressure lines, the same hydraulic pressure is applied to the plurality of pressure lines.   The resin sealing device for an electronic element according to claim 7, wherein the pressure line is variable in pressure applied to the pressure applying member.   The said internal space WHEREIN: It is between the said 2nd exposed surface and the said pressure application surface of the said pressure application member, Comprising: The installation sheet | seat which can be installed in the inner surface of the said 2nd formwork is further provided. The resin sealing apparatus of the electronic element in any one of these.   The resin sealing device for an electronic element according to claim 11, wherein the laying sheet closes the through hole, and the pressure applying surface applies pressure to the second exposed surface from the outside of the laying sheet.   The resin injection port is a combination of the first mold and the second mold, the first mold contacts the first exposed surface, and the pressure applying member applies pressure to the second exposed surface. The resin sealing device for an electronic element according to claim 1, wherein a resin is injected into the internal space in a state of being performed.   15. The electronic device according to claim 1, wherein the pressure of the pressure applying member is increased in accordance with an increase in a resin pressure that is a pressure applied to the object to be sealed by a resin filled in the internal space. Resin sealing device. A plurality of resin sealing devices according to any one of claims 1 to 14;
A concentration line that bundles the pressure lines of each of the plurality of resin sealing devices;
A pressure generating unit that applies pressure to the concentrated conduit,
A resin sealing system for an electronic device, in which a pressure generated by the pressure generating unit is commonly applied to the plurality of pressure pipes. A first formwork attached from one of the objects to be sealed;
A second formwork attached from the other of the objects to be sealed and paired with the first formwork;
A resin injection port for injecting resin into an internal space formed by a combination of the first mold and the second mold;
A through hole provided in a bottom surface of the second mold,
A pressure applying member that is inserted into the through hole and applies pressure to the object to be sealed in the internal space from the bottom surface, and a resin sealing method for an electronic device using a resin sealing device,
A housing step for covering the object to be sealed in the internal space;
When the first mold and the second mold are combined, the inner surface of the first mold is in contact with the first exposed surface of the object to be sealed; and
When the first mold and the second mold are combined, the pressure applying surface of the pressure applying member applies a pressure to the second exposed surface of the object to be sealed; and
A resin injection step of injecting resin into the internal space from the resin injection port;
And a curing step for curing the resin.