JPH0211336U - - Google Patents

Info

Publication number
JPH0211336U
JPH0211336U JP9027088U JP9027088U JPH0211336U JP H0211336 U JPH0211336 U JP H0211336U JP 9027088 U JP9027088 U JP 9027088U JP 9027088 U JP9027088 U JP 9027088U JP H0211336 U JPH0211336 U JP H0211336U
Authority
JP
Japan
Prior art keywords
diode
chip
carrier type
bump
bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9027088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9027088U priority Critical patent/JPH0211336U/ja
Publication of JPH0211336U publication Critical patent/JPH0211336U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、この考案の一実施例によるチツプキ
ヤリア形ダイオードを示す上面図、第2図は第1
図におけるA−A線断面図、第3図は第1図にお
けるB−B線断面図、第4図は従来のチツプキヤ
リア形ダイオードを示す上面図、第5図は第4図
におけるA−A線断面図、第6図は第4図におけ
るB−B線断面図である。 図において、1はセラミツク基板、2はダイオ
ードチツプ、4,5は導体、6はブリツジ、7は
バンプである。なお、図中、同一符号は同一、又
は相当部分を示す。
FIG. 1 is a top view showing a chip carrier type diode according to an embodiment of this invention, and FIG.
3 is a sectional view taken along line BB in FIG. 1, FIG. 4 is a top view showing a conventional chip carrier type diode, and FIG. 5 is taken along line AA in FIG. 4. The sectional view, FIG. 6, is a sectional view taken along the line B--B in FIG. 4. In the figure, 1 is a ceramic substrate, 2 is a diode chip, 4 and 5 are conductors, 6 is a bridge, and 7 is a bump. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミツク基板を用いるチツプキヤリア形ダイ
オードにおいて、ダイオードチツプ上にバンプを
有し、ブリツジを用いて組立・構成したことを特
徴とするチツプキヤリア形ダイオード。
A chip carrier type diode using a ceramic substrate, characterized in that it has a bump on the diode chip and is assembled and constructed using a bridge.
JP9027088U 1988-07-07 1988-07-07 Pending JPH0211336U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9027088U JPH0211336U (en) 1988-07-07 1988-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9027088U JPH0211336U (en) 1988-07-07 1988-07-07

Publications (1)

Publication Number Publication Date
JPH0211336U true JPH0211336U (en) 1990-01-24

Family

ID=31314797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9027088U Pending JPH0211336U (en) 1988-07-07 1988-07-07

Country Status (1)

Country Link
JP (1) JPH0211336U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333670A (en) * 1976-09-10 1978-03-29 Churitsu Denki Voltage detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333670A (en) * 1976-09-10 1978-03-29 Churitsu Denki Voltage detector

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