JPH02106856U - - Google Patents
Info
- Publication number
- JPH02106856U JPH02106856U JP1363089U JP1363089U JPH02106856U JP H02106856 U JPH02106856 U JP H02106856U JP 1363089 U JP1363089 U JP 1363089U JP 1363089 U JP1363089 U JP 1363089U JP H02106856 U JPH02106856 U JP H02106856U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- heat dissipating
- dissipating material
- good thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は、本考案の実施態様を示すＩＣチツプ
搭載多層配線基板の断面図である。
１，１′，１″，１……基板、２……貫通孔
、３……ＩＣチツプ、４……放熱材、５……熱良
導体、６……配線。
FIG. 1 is a sectional view of an IC chip-mounted multilayer wiring board showing an embodiment of the present invention. 1, 1', 1'', 1... Board, 2... Through hole, 3... IC chip, 4... Heat dissipation material, 5... Good thermal conductor, 6... Wiring.
Claims (1)
には放熱材を被覆した配線基板において、該基板
を貫通した熱良導体を介して、ＩＣチツプと放熱
材とが連結されてなるＩＣチツプ搭載配線基板。 IC chip-mounted wiring in which an IC chip is mounted on the top surface of the board and the back surface of the board is coated with a heat dissipating material, and the IC chip and the heat dissipating material are connected through a good thermal conductor that penetrates the board. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1363089U JPH02106856U (en) | 1989-02-09 | 1989-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1363089U JPH02106856U (en) | 1989-02-09 | 1989-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106856U true JPH02106856U (en) | 1990-08-24 |
Family
ID=31224101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1363089U Pending JPH02106856U (en) | 1989-02-09 | 1989-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106856U (en) |
-
1989
- 1989-02-09 JP JP1363089U patent/JPH02106856U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02106856U (en) | ||
| JPH0279044U (en) | ||
| JPH0270447U (en) | ||
| JPH0353853U (en) | ||
| JPH03120052U (en) | ||
| JPS6444641U (en) | ||
| JPH0396064U (en) | ||
| JPH0247055U (en) | ||
| JPH0338653U (en) | ||
| JPH02110361U (en) | ||
| JPS61205145U (en) | ||
| JPS63149544U (en) | ||
| JPS6310550U (en) | ||
| JPS6252942U (en) | ||
| JPS59158336U (en) | semiconductor equipment | |
| JPH0330440U (en) | ||
| JPH0350340U (en) | ||
| JPS63174460U (en) | ||
| JPH0165142U (en) | ||
| JPS60124094U (en) | printed wiring board | |
| JPH0399443U (en) | ||
| JPH0231190U (en) | ||
| JPS6127270U (en) | printed wiring device | |
| JPS63180970U (en) | ||
| JPH0479473U (en) |