JPH0396064U - - Google Patents
Info
- Publication number
- JPH0396064U JPH0396064U JP1990004742U JP474290U JPH0396064U JP H0396064 U JPH0396064 U JP H0396064U JP 1990004742 U JP1990004742 U JP 1990004742U JP 474290 U JP474290 U JP 474290U JP H0396064 U JPH0396064 U JP H0396064U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- recess
- heat generating
- metal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係る金属ベース基板の一実施
例を示す断面図である。第２図は従来の金属ベー
ス基板を示す断面図である。
１……金属ベース、２……絶縁層、３，３ａ…
…回路導体、５……凹所、６……パワートランジ
スタ、７……ヒートスプレツダ、８……ワイヤ、
９……接着剤。
FIG. 1 is a sectional view showing an embodiment of a metal base substrate according to the present invention. FIG. 2 is a sectional view showing a conventional metal base substrate. 1... Metal base, 2... Insulating layer, 3, 3a...
... circuit conductor, 5 ... recess, 6 ... power transistor, 7 ... heat spreader, 8 ... wire,
9...Adhesive.
Claims (1)
した金属ベース基板において、 前記金属ベースに凹所を形成し、該凹所に発熱
性の機能素子を搭載したヒートスプレツダを取り
付けたこと、 を特徴とする金属ベース基板。[Claims for Utility Model Registration] A metal-based substrate in which a circuit conductor is formed on a metal base via an insulating layer, a heat generating device in which a recess is formed in the metal base and a heat generating functional element is mounted in the recess. A metal base substrate, characterized in that a spretsuda is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004742U JPH0396064U (en) | 1990-01-22 | 1990-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990004742U JPH0396064U (en) | 1990-01-22 | 1990-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0396064U true JPH0396064U (en) | 1991-10-01 |
Family
ID=31508476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990004742U Pending JPH0396064U (en) | 1990-01-22 | 1990-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0396064U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042738A (en) * | 2005-08-01 | 2007-02-15 | Fuji Electric Holdings Co Ltd | Semiconductor device |
| WO2020188806A1 (en) * | 2019-03-20 | 2020-09-24 | 三菱電機株式会社 | Semiconductor device |
-
1990
- 1990-01-22 JP JP1990004742U patent/JPH0396064U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042738A (en) * | 2005-08-01 | 2007-02-15 | Fuji Electric Holdings Co Ltd | Semiconductor device |
| WO2020188806A1 (en) * | 2019-03-20 | 2020-09-24 | 三菱電機株式会社 | Semiconductor device |
| US12027438B2 (en) | 2019-03-20 | 2024-07-02 | Mitsubishi Electric Corporation | Semiconductor device |