JPH0187547U - - Google Patents

Info

Publication number
JPH0187547U
JPH0187547U JP1987182909U JP18290987U JPH0187547U JP H0187547 U JPH0187547 U JP H0187547U JP 1987182909 U JP1987182909 U JP 1987182909U JP 18290987 U JP18290987 U JP 18290987U JP H0187547 U JPH0187547 U JP H0187547U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting structure
metal base
semiconductor
shaped groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987182909U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987182909U priority Critical patent/JPH0187547U/ja
Publication of JPH0187547U publication Critical patent/JPH0187547U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体素子の実装構造の
一例を示す断面図、第２図は本考案に係るＶ字溝
の溝角度を説明する図、第３図は従来の半導体素
子の実装構造の一例を示す部分断面図である。 １１……半導体素子、１２……金属ベース基板
、１３……金属ベース、１４……絶縁層、１５…
…配線金属膜、１７……溝。 FIG. 1 is a cross-sectional view showing an example of a semiconductor device mounting structure according to the present invention, FIG. 2 is a diagram illustrating the groove angle of a V-shaped groove according to the present invention, and FIG. 3 is a conventional semiconductor device mounting structure. It is a partial sectional view showing an example. 11...Semiconductor element, 12...Metal base substrate, 13...Metal base, 14...Insulating layer, 15...
...Wiring metal film, 17...groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属ベース基板の配線金属膜上に半導体素子を
接合してなる半導体素子の実装構造において、熱
発生源となる半導体素子の周辺に、金属ベースに
達するＶ字状の溝を形成したことを特徴とする半
導体素子の実装構造。 In a semiconductor element mounting structure in which a semiconductor element is bonded to a wiring metal film of a metal base substrate, a V-shaped groove reaching the metal base is formed around the semiconductor element, which is a heat generation source. Mounting structure of semiconductor elements.
JP1987182909U 1987-12-02 1987-12-02 Pending JPH0187547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987182909U JPH0187547U (en) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987182909U JPH0187547U (en) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187547U true JPH0187547U (en) 1989-06-09

Family

ID=31474349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987182909U Pending JPH0187547U (en) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187547U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03145748A (en) * 1989-10-31 1991-06-20 Narumi China Corp Ceramic circuit board
JPH0472638U (en) * 1990-10-31 1992-06-26
JP2010251457A (en) * 2009-04-14 2010-11-04 Nissan Motor Co Ltd Semiconductor device and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03145748A (en) * 1989-10-31 1991-06-20 Narumi China Corp Ceramic circuit board
JPH0472638U (en) * 1990-10-31 1992-06-26
JP2010251457A (en) * 2009-04-14 2010-11-04 Nissan Motor Co Ltd Semiconductor device and method of manufacturing the same

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