JPH0476044U - - Google Patents
Info
- Publication number
- JPH0476044U JPH0476044U JP1990119805U JP11980590U JPH0476044U JP H0476044 U JPH0476044 U JP H0476044U JP 1990119805 U JP1990119805 U JP 1990119805U JP 11980590 U JP11980590 U JP 11980590U JP H0476044 U JPH0476044 U JP H0476044U
- Authority
- JP
- Japan
- Prior art keywords
- base
- wiring electrode
- component mounting
- electrical component
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例装置の構成を概略的
に示す斜視図、第２図は従来装置の構成を概略的
に示す斜視図である。
１６……電気部品例えば半導体素子、２８……
下地、３０……配線電極、３２……中間絶縁層、
３４……グラント電極、３８，４０……配設面。
FIG. 1 is a perspective view schematically showing the structure of an embodiment of the present invention, and FIG. 2 is a perspective view schematically showing the structure of a conventional device. 16... Electrical components such as semiconductor elements, 28...
Base, 30... Wiring electrode, 32... Intermediate insulating layer,
34...Grant electrode, 38, 40...Arrangement surface.
Claims (1)
電極及びグランド電極とを備えて成る電気部品の
実装装置において、 前記下地に配線電極を設け、 該配線電極上に中間絶縁層を介しグランド電極
を設けたことを特徴とする電気部品の実装装置。[Scope of Claim for Utility Model Registration] An electrical component mounting device comprising an insulating base, and a wiring electrode and a ground electrode provided on the base, comprising: a wiring electrode provided on the base, and a wiring electrode provided on the base; An electrical component mounting device characterized in that a ground electrode is provided through an intermediate insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119805U JPH0476044U (en) | 1990-11-15 | 1990-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119805U JPH0476044U (en) | 1990-11-15 | 1990-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476044U true JPH0476044U (en) | 1992-07-02 |
Family
ID=31867740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119805U Pending JPH0476044U (en) | 1990-11-15 | 1990-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476044U (en) |
-
1990
- 1990-11-15 JP JP1990119805U patent/JPH0476044U/ja active Pending