JPH0375564U - - Google Patents

Info

Publication number
JPH0375564U
JPH0375564U JP13540389U JP13540389U JPH0375564U JP H0375564 U JPH0375564 U JP H0375564U JP 13540389 U JP13540389 U JP 13540389U JP 13540389 U JP13540389 U JP 13540389U JP H0375564 U JPH0375564 U JP H0375564U
Authority
JP
Japan
Prior art keywords
mount device
surface mount
substrate
thermally conductive
conductive filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13540389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13540389U priority Critical patent/JPH0375564U/ja
Publication of JPH0375564U publication Critical patent/JPH0375564U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示す図、第２図は他
の実施例を示す図である。 図において、１……表面実装素子、２……基板
、３……熱伝導性充填材、７……基板対応面であ
る。 FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing another embodiment. In the figure, 1... surface mount element, 2... substrate, 3... thermally conductive filler, 7... substrate corresponding surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面実装素子１の基板対応面７と基板２との間
に熱伝導性充填材３を充填してなる表面実装素子
の実装構造。 A mounting structure for a surface mount device in which a thermally conductive filler 3 is filled between a substrate corresponding surface 7 of a surface mount device 1 and a substrate 2.
JP13540389U 1989-11-24 1989-11-24 Pending JPH0375564U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13540389U JPH0375564U (en) 1989-11-24 1989-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13540389U JPH0375564U (en) 1989-11-24 1989-11-24

Publications (1)

Publication Number Publication Date
JPH0375564U true JPH0375564U (en) 1991-07-29

Family

ID=31682673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13540389U Pending JPH0375564U (en) 1989-11-24 1989-11-24

Country Status (1)

Country Link
JP (1) JPH0375564U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003098967A (en) * 2001-09-26 2003-04-04 Srl Inc Specimen container discrimination label considering privacy protection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415172A (en) * 1977-07-07 1979-02-03 Fujitsu Ltd Way of fixing electronic parts
JPS5921093A (en) * 1982-07-27 1984-02-02 富士ゼロックス株式会社 Method of mounting leadless chip carrier
JPS6476799A (en) * 1987-09-17 1989-03-22 Fujitsu Ltd Method of controlling packaging thickness of heat conductive adhesive

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415172A (en) * 1977-07-07 1979-02-03 Fujitsu Ltd Way of fixing electronic parts
JPS5921093A (en) * 1982-07-27 1984-02-02 富士ゼロックス株式会社 Method of mounting leadless chip carrier
JPS6476799A (en) * 1987-09-17 1989-03-22 Fujitsu Ltd Method of controlling packaging thickness of heat conductive adhesive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003098967A (en) * 2001-09-26 2003-04-04 Srl Inc Specimen container discrimination label considering privacy protection

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