JPH01107148U - - Google Patents
Info
- Publication number
- JPH01107148U JPH01107148U JP1988000883U JP88388U JPH01107148U JP H01107148 U JPH01107148 U JP H01107148U JP 1988000883 U JP1988000883 U JP 1988000883U JP 88388 U JP88388 U JP 88388U JP H01107148 U JPH01107148 U JP H01107148U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- conductive plate
- cooling pipe
- heat conductive
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Description
第１図は本考案の一実施例に係る集積回路の冷
却構造を示す断面図、第２図は他の実施例に係る
集積回路の冷却構造を示す断面図である。また第
３図は従来の集積回路の冷却構造を示す断面図で
ある。
１：プリント配線板、２：集積回路ケース、３
：熱放出面、４，１４：熱伝導板、４ａ，１４ａ
：保持部、４ｂ，１４ｂ：押圧部、５：冷却パイ
プ、７：半田。
FIG. 1 is a cross-sectional view showing an integrated circuit cooling structure according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an integrated circuit cooling structure according to another embodiment. Further, FIG. 3 is a sectional view showing a conventional cooling structure for an integrated circuit. 1: Printed wiring board, 2: Integrated circuit case, 3
: Heat release surface, 4, 14: Heat conduction plate, 4a, 14a
: Holding part, 4b, 14b: Pressing part, 5: Cooling pipe, 7: Solder.
Claims (1)
と、内部に冷媒通路を有する冷却パイプと、該冷
却パイプを挿入保持する保持部を有しかつその片
側又は両側が上記集積回路ケースの熱放出面と接
触するスプリング形状の良熱伝導性熱伝導板と、
上記集積回路及び熱伝導板を実装固定するプリン
ト配線板とを備えてなることを特徴とする集積回
路の冷却構造。 An integrated circuit case having an integrated circuit chip inside, a cooling pipe having a refrigerant passage inside, and a holding part for inserting and holding the cooling pipe, one or both sides of which are in contact with the heat emitting surface of the integrated circuit case. A spring-shaped heat conductive plate with good thermal conductivity,
A cooling structure for an integrated circuit, comprising the integrated circuit and a printed wiring board on which a heat conductive plate is mounted and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000883U JPH0543482Y2 (en) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988000883U JPH0543482Y2 (en) | 1988-01-08 | 1988-01-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01107148U true JPH01107148U (en) | 1989-07-19 |
| JPH0543482Y2 JPH0543482Y2 (en) | 1993-11-02 |
Family
ID=31200286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988000883U Expired - Lifetime JPH0543482Y2 (en) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543482Y2 (en) |
-
1988
- 1988-01-08 JP JP1988000883U patent/JPH0543482Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543482Y2 (en) | 1993-11-02 |