JPH0258385U - - Google Patents
Info
- Publication number
- JPH0258385U JPH0258385U JP13678488U JP13678488U JPH0258385U JP H0258385 U JPH0258385 U JP H0258385U JP 13678488 U JP13678488 U JP 13678488U JP 13678488 U JP13678488 U JP 13678488U JP H0258385 U JPH0258385 U JP H0258385U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply device
- board
- housing
- metal board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Rectifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案による電源装置の一実施例を示
す断面図、第２図は該実施例の分解斜視図、第３
図は従来の電源装置を示す断面図である。
FIG. 1 is a sectional view showing an embodiment of the power supply device according to the present invention, FIG. 2 is an exploded perspective view of the embodiment, and FIG.
The figure is a sectional view showing a conventional power supply device.
Claims (1)
面が内面となるように組合わせて筐体を構成する
と共に、該筐体の前記金属基板の反対側の面を電
源装置取付け基板への取付け面としたことを特徴
とする電源装置。 A housing is constructed by assembling a metal board on the opening side of the resin case so that its component mounting surface is the inner surface, and a surface of the housing opposite to the metal board is a mounting surface for the power supply device mounting board. A power supply device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136784U JPH0729670Y2 (en) | 1988-10-19 | 1988-10-19 | Power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136784U JPH0729670Y2 (en) | 1988-10-19 | 1988-10-19 | Power supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258385U true JPH0258385U (en) | 1990-04-26 |
| JPH0729670Y2 JPH0729670Y2 (en) | 1995-07-05 |
Family
ID=31397614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988136784U Expired - Lifetime JPH0729670Y2 (en) | 1988-10-19 | 1988-10-19 | Power supply |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729670Y2 (en) |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717156A (en) * | 1980-03-26 | 1982-01-28 | Thomson Csf | Sealing box for power module of hybrid circuit |
| JPS58133985U (en) * | 1982-03-03 | 1983-09-09 | 株式会社日立製作所 | Integrated circuit mounting structure |
| JPS59146949U (en) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | Hybrid integrated circuit module |
| JPS59224192A (en) * | 1983-06-03 | 1984-12-17 | 松下電器産業株式会社 | High heat conductive metal base printed circuit board |
| JPS60167399A (en) * | 1984-02-09 | 1985-08-30 | 松下電器産業株式会社 | High thermal conductive metal base circuit board |
| JPS61156754A (en) * | 1984-12-27 | 1986-07-16 | Matsushita Electric Ind Co Ltd | High thermal conductive metal base printed substrate |
| JPS61166148A (en) * | 1985-01-18 | 1986-07-26 | Sanyo Electric Co Ltd | Multilayer hybrid integrated circuit device |
| JPS61207072U (en) * | 1985-06-18 | 1986-12-27 | ||
| JPS627145A (en) * | 1985-07-02 | 1987-01-14 | Sharp Corp | Power semiconductor device |
| JPS62208653A (en) * | 1986-03-07 | 1987-09-12 | Matsushita Electric Ind Co Ltd | Hybrid ic |
| JPS62214696A (en) * | 1986-03-15 | 1987-09-21 | 松下電工株式会社 | Printed wiring board |
| JPS62237750A (en) * | 1986-04-09 | 1987-10-17 | Hitachi Ltd | Semiconductor module element |
| JPS6346853U (en) * | 1986-09-12 | 1988-03-30 | ||
| JPS6359386U (en) * | 1986-10-06 | 1988-04-20 | ||
| JPS6395296U (en) * | 1986-12-11 | 1988-06-20 | ||
| JPS63250900A (en) * | 1987-04-08 | 1988-10-18 | 株式会社日立製作所 | Mounting structure of power module |
| JPS6477153A (en) * | 1987-09-18 | 1989-03-23 | Mitsubishi Electric Corp | Power module |
| JPH01129885U (en) * | 1988-02-26 | 1989-09-04 |
-
1988
- 1988-10-19 JP JP1988136784U patent/JPH0729670Y2/en not_active Expired - Lifetime
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717156A (en) * | 1980-03-26 | 1982-01-28 | Thomson Csf | Sealing box for power module of hybrid circuit |
| JPS58133985U (en) * | 1982-03-03 | 1983-09-09 | 株式会社日立製作所 | Integrated circuit mounting structure |
| JPS59146949U (en) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | Hybrid integrated circuit module |
| JPS59224192A (en) * | 1983-06-03 | 1984-12-17 | 松下電器産業株式会社 | High heat conductive metal base printed circuit board |
| JPS60167399A (en) * | 1984-02-09 | 1985-08-30 | 松下電器産業株式会社 | High thermal conductive metal base circuit board |
| JPS61156754A (en) * | 1984-12-27 | 1986-07-16 | Matsushita Electric Ind Co Ltd | High thermal conductive metal base printed substrate |
| JPS61166148A (en) * | 1985-01-18 | 1986-07-26 | Sanyo Electric Co Ltd | Multilayer hybrid integrated circuit device |
| JPS61207072U (en) * | 1985-06-18 | 1986-12-27 | ||
| JPS627145A (en) * | 1985-07-02 | 1987-01-14 | Sharp Corp | Power semiconductor device |
| JPS62208653A (en) * | 1986-03-07 | 1987-09-12 | Matsushita Electric Ind Co Ltd | Hybrid ic |
| JPS62214696A (en) * | 1986-03-15 | 1987-09-21 | 松下電工株式会社 | Printed wiring board |
| JPS62237750A (en) * | 1986-04-09 | 1987-10-17 | Hitachi Ltd | Semiconductor module element |
| JPS6346853U (en) * | 1986-09-12 | 1988-03-30 | ||
| JPS6359386U (en) * | 1986-10-06 | 1988-04-20 | ||
| JPS6395296U (en) * | 1986-12-11 | 1988-06-20 | ||
| JPS63250900A (en) * | 1987-04-08 | 1988-10-18 | 株式会社日立製作所 | Mounting structure of power module |
| JPS6477153A (en) * | 1987-09-18 | 1989-03-23 | Mitsubishi Electric Corp | Power module |
| JPH01129885U (en) * | 1988-02-26 | 1989-09-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729670Y2 (en) | 1995-07-05 |