JPS58133985U - Integrated circuit mounting structure - Google Patents
Integrated circuit mounting structureInfo
- Publication number
- JPS58133985U JPS58133985U JP2890382U JP2890382U JPS58133985U JP S58133985 U JPS58133985 U JP S58133985U JP 2890382 U JP2890382 U JP 2890382U JP 2890382 U JP2890382 U JP 2890382U JP S58133985 U JPS58133985 U JP S58133985U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- mounting structure
- integrated circuit
- insulating substrate
- circuit mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の取付構造を示す側面図、第２図は第１
図の平面図である。第３図は、本考案の一実施例を示す
正面図、第４図は、第３図の右側面図である。
１・・・絶縁基板、２五放熱フイン、３・・・フェノ−
／Ｌ’基板、４−ＩＣ，５−・・トランジスタ、６・・
・コンデンサ、７・・・リード端子、８・・・放熱フィ
ン固定ねじ、９・・・横形放熱フィン、１０ａ、 １
０ｂ−＝・下側−フィン、−１１ａ、１１ｂ・・・デュ
アルリード端子。Figure 1 is a side view showing a conventional mounting structure, and Figure 2 is a side view showing the conventional mounting structure.
FIG. FIG. 3 is a front view showing an embodiment of the present invention, and FIG. 4 is a right side view of FIG. 3. 1... Insulating board, 25 Heat dissipation fin, 3... Phenol
/L' board, 4-IC, 5-...transistor, 6...
・Capacitor, 7... Lead terminal, 8... Radiation fin fixing screw, 9... Horizontal radiation fin, 10a, 1
0b-=・Lower side-fin, -11a, 11b...Dual lead terminal.
Claims (1)
ーン配線とともに回路網を形成するため取付けられた電
気部品と；上方に伸長する放熱フィンと下方に伸長する
下側放熱フィンと下側放熱フィンによってはさまれるよ
うに絶縁基板の上面が取付けられる取付面とを有する放
熱部材と；下側放熱フィンの先端が当接されるとともに
電気部品が接続されるパターンを有する配線基板とから
なることを特徴とする集積回路の取付構造。An insulating substrate with good thermal conductivity; electrical components attached to the bottom surface of this insulating substrate together with pattern wiring to form a circuit network; heat dissipation fins extending upward, lower heat dissipation fins extending downward, and lower heat dissipation. consisting of a heat dissipation member having a mounting surface to which the upper surface of the insulating substrate is attached so as to be sandwiched between the fins; and a wiring board having a pattern to which the tips of the lower heat dissipation fins are abutted and electrical components are connected. An integrated circuit mounting structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2890382U JPS58133985U (en) | 1982-03-03 | 1982-03-03 | Integrated circuit mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2890382U JPS58133985U (en) | 1982-03-03 | 1982-03-03 | Integrated circuit mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58133985U true JPS58133985U (en) | 1983-09-09 |
Family
ID=30040719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2890382U Pending JPS58133985U (en) | 1982-03-03 | 1982-03-03 | Integrated circuit mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58133985U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JPH0375594U (en) * | 1989-11-24 | 1991-07-29 |
-
1982
- 1982-03-03 JP JP2890382U patent/JPS58133985U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JPH0375594U (en) * | 1989-11-24 | 1991-07-29 |
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