JPS6359386U - - Google Patents
Info
- Publication number
- JPS6359386U JPS6359386U JP15333486U JP15333486U JPS6359386U JP S6359386 U JPS6359386 U JP S6359386U JP 15333486 U JP15333486 U JP 15333486U JP 15333486 U JP15333486 U JP 15333486U JP S6359386 U JPS6359386 U JP S6359386U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- insulating film
- metal base
- circuit components
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の基本実施例の構成図、第２
図はこの考案の応用実施例の組立構成図、第３図
は従来における半導体装置の組立構成図である。
各図において、
１：絶縁金属基板、２：金属ベース、３：絶縁
膜体、５：導体パターン、６：パワー回路部品、
７：制御回路部品、９：金属ベース領域、１０：
延長領域、１１：パツケージ。
Figure 1 is a configuration diagram of the basic embodiment of this invention, Figure 2
The figure is an assembled configuration diagram of an applied example of this invention, and FIG. 3 is an assembled configuration diagram of a conventional semiconductor device.
In each figure, 1: insulated metal substrate, 2: metal base, 3: insulating film body, 5: conductor pattern, 6: power circuit component,
7: Control circuit component, 9: Metal base region, 10:
Extension area, 11: Package.
Claims (1)
基板に対し、絶縁膜体上に導体パターンを形成し
てここに回路部品を実装した半導体装置において
、前記絶縁膜体を金属ベースの面域よりもさらに
拡大延長してその全面域に連続して導体パターン
を形成し、かつ絶縁膜体における金属ベース領域
には発熱量が大なパワー回路部品を、延長領域に
は制御回路部品を実装して構成したことを特徴と
する半導体装置。 (2) 実用新案登録請求の範囲第１項記載の半導
体装置において、絶縁膜体を可撓性材とし、かつ
該絶縁膜体の延長領域を金属ベース領域と向かい
合わせに折り返して外部パツケージ内に収容した
ことを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] (1) In a semiconductor device in which a conductive pattern is formed on the insulating film and circuit components are mounted on an insulating metal substrate having an insulating film layered on a metal base, The membrane body is further expanded and extended beyond the surface area of the metal base to form a continuous conductor pattern over the entire area, and power circuit components that generate a large amount of heat are placed in the metal base area of the insulating membrane body in the extended area. A semiconductor device characterized in that it is configured by mounting control circuit components. (2) In the semiconductor device according to claim 1 of the utility model registration claim, the insulating film body is made of a flexible material, and the extended region of the insulating film body is folded back to face the metal base region and placed in an external package. A semiconductor device characterized by being housed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15333486U JPS6359386U (en) | 1986-10-06 | 1986-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15333486U JPS6359386U (en) | 1986-10-06 | 1986-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359386U true JPS6359386U (en) | 1988-04-20 |
Family
ID=31072122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15333486U Pending JPS6359386U (en) | 1986-10-06 | 1986-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359386U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JPH05299876A (en) * | 1992-04-24 | 1993-11-12 | Mitsubishi Electric Corp | Semiconductor device |
-
1986
- 1986-10-06 JP JP15333486U patent/JPS6359386U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JPH05299876A (en) * | 1992-04-24 | 1993-11-12 | Mitsubishi Electric Corp | Semiconductor device |