JPS61206302U - - Google Patents
Info
- Publication number
- JPS61206302U JPS61206302U JP8977885U JP8977885U JPS61206302U JP S61206302 U JPS61206302 U JP S61206302U JP 8977885 U JP8977885 U JP 8977885U JP 8977885 U JP8977885 U JP 8977885U JP S61206302 U JPS61206302 U JP S61206302U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- integrated circuit
- microwave integrated
- conductor piece
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の一実施例の断面図、第２図は
本考案の第二実施例の断面図、第３図は従来構造
の断面図、第４図は従来構造の不具合を説明する
ための断面図である。
１０…マイクロ波集積回路、１，１１…誘電体
基板、２，１２…導体パターン、３，１３，１３
Ａ…導体片、４，１４…接着材、１５，１６…絶
縁膜。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view of a second embodiment of the invention, Fig. 3 is a sectional view of a conventional structure, and Fig. 4 explains defects in the conventional structure. FIG. 10... Microwave integrated circuit, 1, 11... Dielectric substrate, 2, 12... Conductor pattern, 3, 13, 13
A... Conductor piece, 4, 14... Adhesive material, 15, 16... Insulating film.
Claims (1)
上に導体片を接着してなるマイクロ波集積回路に
おいて、この導体片の少なくとも前記導体パター
ンに対向する側の面に絶縁膜を形成し、前記導体
片と導体パターンとを絶縁状態を保つて接着した
ことを特徴とするマイクロ波集積回路。 ２ 導体片の全部の面を被覆するように絶縁膜を
形成してなる実用新案登録請求の範囲第 項記載
のマイクロ波集積回路。[Claims for Utility Model Registration] 1. In a microwave integrated circuit formed by bonding a conductor piece onto a conductor pattern in order to finely adjust the electrical characteristics, at least the surface of the conductor piece facing the conductor pattern A microwave integrated circuit characterized in that an insulating film is formed, and the conductor piece and the conductor pattern are bonded to each other while maintaining an insulated state. 2. The microwave integrated circuit according to claim 1, wherein an insulating film is formed to cover the entire surface of a conductor piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8977885U JPS61206302U (en) | 1985-06-14 | 1985-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8977885U JPS61206302U (en) | 1985-06-14 | 1985-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61206302U true JPS61206302U (en) | 1986-12-26 |
Family
ID=30644177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8977885U Pending JPS61206302U (en) | 1985-06-14 | 1985-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61206302U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63238701A (en) * | 1987-03-26 | 1988-10-04 | A T R Koudenpa Tsushin Kenkyusho:Kk | Microwave line |
-
1985
- 1985-06-14 JP JP8977885U patent/JPS61206302U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63238701A (en) * | 1987-03-26 | 1988-10-04 | A T R Koudenpa Tsushin Kenkyusho:Kk | Microwave line |