JPH0284313U - - Google Patents
Info
- Publication number
- JPH0284313U JPH0284313U JP16541488U JP16541488U JPH0284313U JP H0284313 U JPH0284313 U JP H0284313U JP 16541488 U JP16541488 U JP 16541488U JP 16541488 U JP16541488 U JP 16541488U JP H0284313 U JPH0284313 U JP H0284313U
- Authority
- JP
- Japan
- Prior art keywords
- electrode part
- mounting surface
- electrode
- area
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例のスケツチ図（立体
図）である。第２図は第１図の一実施例を絶縁基
板上に形成された電極半導体部４に半田３で実装
した時の半田３の付き方を示した断面図である。
第３図は、本考案の他の実施例の立体図である。
第４図は第３図の面実装電子部品を絶縁基板上に
形成された電極部４に半田３実装した時の半田３
の付き方を示した断面図である。第５図は従来の
面実装電子部品の立体図であり、第６図は同じく
他の絶縁基板上の電極導体部４に半田３で実装し
た時の半田３の付き方を示した断面図である。
１…面実装電子部品の電極部、２…面実装電子
部品の素子部、３…半田、４…回路導体部、５…
絶縁基板。
FIG. 1 is a sketch (3D view) of one embodiment of the present invention. FIG. 2 is a sectional view showing how the solder 3 is applied when the embodiment shown in FIG. 1 is mounted with the solder 3 on the electrode semiconductor portion 4 formed on an insulating substrate.
FIG. 3 is a three-dimensional view of another embodiment of the present invention.
Figure 4 shows the solder 3 when the surface-mounted electronic component shown in Figure 3 is mounted on the electrode part 4 formed on the insulating substrate.
FIG. FIG. 5 is a three-dimensional view of a conventional surface-mounted electronic component, and FIG. 6 is a cross-sectional view showing how solder 3 is applied when it is mounted on an electrode conductor portion 4 on another insulating substrate. be. DESCRIPTION OF SYMBOLS 1... Electrode part of a surface-mounted electronic component, 2... Element part of a surface-mounted electronic component, 3... Solder, 4... Circuit conductor part, 5...
Insulated substrate.
Claims (1)
と反対面の面積が同じか又は広く、かつ、電極部
の実装面と隣接する電極側面の形状が湾曲又は逆
台形である電極部を有することを特徴とする面実
装電子部品。 An electrode part in which the area of the opposite side to the mounting surface of the electrode part is equal to or larger than the area of the mounting surface of the electrode part, and the shape of the side surface of the electrode adjacent to the mounting surface of the electrode part is curved or inverted trapezoid. A surface-mounted electronic component characterized by having:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165414U JPH0751787Y2 (en) | 1988-12-20 | 1988-12-20 | Surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165414U JPH0751787Y2 (en) | 1988-12-20 | 1988-12-20 | Surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0284313U true JPH0284313U (en) | 1990-06-29 |
| JPH0751787Y2 JPH0751787Y2 (en) | 1995-11-22 |
Family
ID=31451877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165414U Expired - Lifetime JPH0751787Y2 (en) | 1988-12-20 | 1988-12-20 | Surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751787Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015133340A1 (en) * | 2014-03-03 | 2015-09-11 | 太陽誘電株式会社 | Electrochemical device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665626U (en) * | 1979-10-23 | 1981-06-01 | ||
| JPS602801U (en) * | 1983-06-20 | 1985-01-10 | 三洋電機株式会社 | Chip-shaped circuit components |
-
1988
- 1988-12-20 JP JP1988165414U patent/JPH0751787Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665626U (en) * | 1979-10-23 | 1981-06-01 | ||
| JPS602801U (en) * | 1983-06-20 | 1985-01-10 | 三洋電機株式会社 | Chip-shaped circuit components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015133340A1 (en) * | 2014-03-03 | 2015-09-11 | 太陽誘電株式会社 | Electrochemical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751787Y2 (en) | 1995-11-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |