JPS63250900A - Mounting structure of power module - Google Patents
Mounting structure of power moduleInfo
- Publication number
- JPS63250900A JPS63250900A JP62084713A JP8471387A JPS63250900A JP S63250900 A JPS63250900 A JP S63250900A JP 62084713 A JP62084713 A JP 62084713A JP 8471387 A JP8471387 A JP 8471387A JP S63250900 A JPS63250900 A JP S63250900A
- Authority
- JP
- Japan
- Prior art keywords
- power module
- heat
- mounting structure
- heat sink
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- NCGICGYLBXGBGN-UHFFFAOYSA-N 3-morpholin-4-yl-1-oxa-3-azonia-2-azanidacyclopent-3-en-5-imine;hydrochloride Chemical compound Cl.[N-]1OC(=N)C=[N+]1N1CCOCC1 NCGICGYLBXGBGN-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、パワーモジュールの実装構造に係り、特に制
御装置に内蔵されるパワーモジュールの放熱および小形
化に好適な実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure for a power module, and particularly to a mounting structure suitable for heat dissipation and miniaturization of a power module built into a control device.
従来のパワーモジュールの実装構造は、例えば第４図の
断面図に示す如きものであった。A conventional power module mounting structure is, for example, as shown in the cross-sectional view of FIG.
即ち、スイッチング素子を複数個内蔵したパワーモジュ
ール１のリード端子２と、プリント配線基板３とを半田
付４によって機械的および電気的に接合せしめ、前記プ
リント配線基板３を筐体５の底部から突設された支持具
６によって所定の位置に固定している。上記パワーモジ
ュール１のヒートシンクは、放熱フィン８とネジ９によ
って固着された構造になっている。That is, the lead terminals 2 of the power module 1 containing a plurality of switching elements are mechanically and electrically connected to the printed wiring board 3 by soldering 4, and the printed wiring board 3 is protruded from the bottom of the casing 5. It is fixed in a predetermined position by a support 6 provided therein. The heat sink of the power module 1 has a structure in which heat radiation fins 8 and screws 9 are used to fix the heat sink.
なお、この種の装置として関連するものには、例えば、
特開昭５０−１５２５７１号が挙げられる〔発明が解決
しようとする問題点〕
上記従来構造は、パワーモジュールの実装構造による制
御装置全体の小形化の点について配慮がされておらず、
例えば、１．２ＫＷ級インバータのパワーモジュールの
発熱量は約４０Ｗになるが、その熱を外部に放散する放
熱フィンの高さは上記発熱量に対応するには約３０ｎｗ
ｎは必要になり、制御装置−を体の外形寸法はフィンの
高さを考慮する必要があるため大形になる。また上記フ
ィンの重量は約１５０ｇ程度に達っし、この重量を支持
するリード端子と配線基板の半田付部には過大なりリー
プ応力が加わり半田クラックが生じやすくなるため、半
田付の強度を大きくするように半田対面積を大きくして
いた。このため配線基板が大きくなり、制御装置全体が
大形化するという問題点を有している。Note that related devices of this type include, for example,
JP-A-50-152571 is mentioned. [Problems to be solved by the invention] The above conventional structure does not take into consideration the miniaturization of the entire control device due to the mounting structure of the power module,
For example, the heat generation amount of a power module of a 1.2KW class inverter is approximately 40W, but the height of the heat dissipation fins that dissipate that heat to the outside is approximately 30NW to correspond to the above heat generation amount.
n is required, and the external dimensions of the control device become large because it is necessary to take into account the height of the fins. In addition, the weight of the fins mentioned above reaches approximately 150g, and the soldered parts of the lead terminals and wiring board that support this weight are subject to excessive leap stress, making solder cracks more likely to occur. Therefore, the strength of the soldering should be increased. The solder area was increased so that Therefore, there is a problem in that the wiring board becomes large and the entire control device becomes large.
本発明の目的は放熱フィンを無くし、パワーモジュール
が搭載される制御装置全体を小形化できるパワーモジュ
ールの実装構造を提供することにある。An object of the present invention is to provide a power module mounting structure that eliminates heat radiation fins and can downsize the entire control device on which the power module is mounted.
上記目的は、配線基板上に載置されたパワーモジュール
のヒートシンク部と、上記配線基板全体を囲うための金
属製筐体の一部とを接合した構造にすることにより、達
成される。The above object is achieved by forming a structure in which a heat sink portion of a power module placed on a wiring board is joined to a part of a metal casing for surrounding the entire wiring board.
パワーモジュールは大電流をスイッチングする素子を内
蔵しているため、スイッチング素子に電流が通過する際
の抵抗による損失とスイッチング時の損失によって、多
大な熱を発生する。また、スイッチング素子の保証温度
は一般には１２５℃であるため、常時保証温度以下にす
ることがパワーモジュールの支障を来たさず動作させる
ために必要なことである。Since power modules have built-in elements that switch large currents, a large amount of heat is generated due to losses due to resistance when current passes through the switching elements and losses during switching. Further, since the guaranteed temperature of the switching element is generally 125° C., it is necessary to keep the temperature below the guaranteed temperature at all times in order to operate the power module without causing any trouble.
従ってパワーモジュールを動作させる場合、従来構造の
ように放熱フィンを通して、放熱させることが一般的で
ある。また、フィンの大きさは周囲の温度条件および気
流等によって、所定の外形を選択し、スイッチング素子
の温度が保証温度を超えることなく運転することが構造
設計上必要である。Therefore, when operating a power module, it is common to radiate heat through heat radiating fins as in the conventional structure. Furthermore, it is necessary in structural design to select a predetermined external shape for the size of the fins depending on the ambient temperature conditions, airflow, etc., and to operate the switching element without the temperature exceeding the guaranteed temperature.
本発明ではパワーモジュールのヒートシンク部から金ｇ
ｃ製筐体の一部に伝熱して、放熱は前記筐体によって行
う構造であり、パワーモジュールを搭載する制御装置を
大形化させることがない。In the present invention, gold g is removed from the heat sink part of the power module.
The structure is such that heat is transferred to a part of the c-made casing and heat is radiated by the casing, so that the control device on which the power module is mounted does not become large.
以下、本発明の一実施例を図面により説明する。従来構
造と同一符号は同一物を示す。An embodiment of the present invention will be described below with reference to the drawings. The same reference numerals as in the conventional structure indicate the same parts.
第１図は実施例のパワーモジュールの実装構造を示す断
面図である。パワーモジュール１とプリント配線基板３
はリード端子２を半田付４することによって、電気的に
接合される。５は亜鉛鉄板若しくはアルミニウム等の金
属から形成される金属製筐体で、支持具６でプリント配
＃！基板３を支持するとともに、金属製筐体を折曲部５
ａで９０’に曲折し、水平部５ｂとビートシンク７の裏
面部をネジ９で密着させる。FIG. 1 is a sectional view showing the mounting structure of a power module according to an embodiment. Power module 1 and printed wiring board 3
are electrically connected by soldering 4 the lead terminals 2. 5 is a metal casing formed from a metal such as a galvanized iron plate or aluminum, and is printed with a support 6! While supporting the board 3, the metal casing is bent at the bending part 5.
Bend 90' at point a, and screw the horizontal part 5b and the back side of the beat sink 7 into close contact with each other with screws 9.
第２図は他の実施例の断面図である。ヒートシンク７と
金属製筐体５の間に伝熱板１０を介在せしめ、９０°曲
折した一方を金属筐体５と固定ネジ１１で固着し、他方
をヒートシンク７とネジ９で密着させている。FIG. 2 is a sectional view of another embodiment. A heat transfer plate 10 is interposed between the heat sink 7 and the metal casing 5, one bent at 90° is fixed to the metal casing 5 with fixing screws 11, and the other is tightly attached to the heat sink 7 with screws 9.
かかる構造において、パワーモジュールから発生した熱
はヒートシンク７から金属製筐体５に伝熱され５次に金
属製筐体の外周部と接触する空気へと伝熱することによ
って放熱させる。In this structure, the heat generated from the power module is transferred from the heat sink 7 to the metal casing 5, and then to the air in contact with the outer periphery of the metal casing, thereby radiating the heat.
ここで、金属製筐体の放熱量を熱抵抗で求めると■式に
なる。Here, if the amount of heat dissipated from the metal casing is determined by the thermal resistance, the formula (2) is obtained.
−Ａ
θ
Ｒ８ｆａ：筐体の熱抵抗
Ａ ：筐体の表面積
ｈ ：筐体の熱伝達率
またスイッチング素子のジャンクション温度は■Ｗ
：パワーモジュールの発熱量
θ
Ｒ＋ｊｃ：ジャンクション、ヒートシンク間の熱抵抗
θ
Ｒｅｅｆ：ヒートシンク、筐体間の熱抵抗Ｔａ ：周囲
空気温度
従って、スイッチング素子の保証温度Ｔｊｍａｘ以下に
するための筐体の表面積はω、■式で求まる。-A θ R8fa: Thermal resistance of the housing A: Surface area of the housing h: The heat transfer coefficient of the housing and the junction temperature of the switching element are ■W
: Calorific value of power module θ R+jc: Thermal resistance between junction and heat sink θ Reef: Thermal resistance between heat sink and casing Ta: Ambient air temperature Therefore, the surface area of the casing to keep the guaranteed temperature of the switching element below Tjmax is ω, is determined by the formula.
発明者等の実験によれば１．２ＫＷ級インバータの場合
、パワーモジュールの発熱量は約４０Ｗであり、周囲温
度の最高が４３℃とすると筐体の外形寸法は、１５０ｗ
＋Ｘ１００＋ａＸ５Ｑ；ｍｎ以上あればスイッチング素
子のジャンクション温度Ｔｊは保証温度以下になること
が明らかになった。According to experiments conducted by the inventors, in the case of a 1.2KW class inverter, the power module generates approximately 40W of heat, and assuming the maximum ambient temperature is 43℃, the external dimensions of the casing are approximately 150W.
It has become clear that if +X100+aX5Q;mn or more, the junction temperature Tj of the switching element will be below the guaranteed temperature.
この外形寸法は、従来構造の筐体寸法と比較して約２八
になる。従ってインバータ制御装置の小形化が可能にな
る他、放熱フィンを削除できるので、原価低減が図れる
とともに軽量化されるので、半田付部の荷重応力が軽減
される。このため、半田付の強度を小さくできるので、
配′ｍ基板を小さくでき、制御装置全体の小形化ができ
る。上記実施例によれば、制御装置全体の大きさを約３
分の２にできた。This external dimension is approximately 2.8 mm compared to the casing dimension of the conventional structure. Therefore, not only can the inverter control device be made smaller, but also the radiation fins can be eliminated, which reduces the cost and weight, reducing the load stress on the soldered portions. Therefore, the strength of soldering can be reduced, so
The mounting board can be made smaller, and the entire control device can be made smaller. According to the above embodiment, the overall size of the control device is approximately 3
I was able to do it in half.
また、上記の説明はパワーモジュールのパッケージ形態
がデュアルインライン形のものに対してであるが、シン
グルインライン形パワーモジュールに対してもシートシ
ンク部と金属製筐体とを接合すれば同様の効果がある。Furthermore, although the above explanation is for a dual-inline power module package, the same effect can be obtained for a single-inline power module by joining the seat sink and the metal casing. be.
さらに第３図は本発明によるパワーモジュールの実装構
造のさらに他の実施例の断面図である。図に示すように
、パワーモジュール１のヒートシンク７と金属製筐体５
を接合する放熱板１２を曲折した形状にすれば、振動等
による応力に対してクッション効果があり、半田付部の
荷重応力はさらに軽減される。Furthermore, FIG. 3 is a sectional view of still another embodiment of the power module mounting structure according to the present invention. As shown in the figure, the heat sink 7 and metal housing 5 of the power module 1
If the heat dissipation plate 12 to be joined is formed into a bent shape, it will have a cushioning effect against stress caused by vibrations, etc., and the load stress on the soldered portion will be further reduced.
本発明によれば、放熱フィンを削除できるので、パワー
モジュールが搭載される制御装置全体を小形化できる。According to the present invention, since the radiation fins can be eliminated, the entire control device in which the power module is mounted can be downsized.
第１図は本発明の実施例によるパワーモジュールの実装
構造を示す断面図、第２図は他の実施例の実装構造を示
す断面図、第３図はさらに他の実施例の実′！Ａ構造を
示す断面図、第４図は従来のパワーモジュールの実装構
造を示す断面図である。
１・・・パワーモジュール、２・・・リード端子、３・
・・プリント配線基板、４・・・半田付部、５・・・筐
体、６・・・支持具、７・・・ヒートシンク、８・・・
放熱フィン。
９・・・ネジ、１０・・・放熱板、１１・・・固定ネジ
、１２・・・曲折放熱板。
代理人 弁理士 小 川 勝 男
第１ 口
１−・ノマワーモシ゛ニー」し
３、・・アリント命こＲ基才反
５、・、ｆ床
７・・・ヒートシン１
ｔｏ・・・ガ（熱板
Ｔ、３ 図
茎４い
１２・・・曲祈底棹省反FIG. 1 is a sectional view showing a mounting structure of a power module according to an embodiment of the present invention, FIG. 2 is a sectional view showing a mounting structure of another embodiment, and FIG. 3 is an actual diagram of still another embodiment. FIG. 4 is a cross-sectional view showing the structure A, and FIG. 4 is a cross-sectional view showing the mounting structure of a conventional power module. 1... Power module, 2... Lead terminal, 3...
...Printed wiring board, 4...Soldering part, 5...Housing, 6...Support, 7...Heat sink, 8...
heat dissipation fins. 9...screw, 10...heat sink, 11...fixing screw, 12...bent heat sink. Agent Patent Attorney Masaru Ogawa Man No. 1 Mouth 1-・Nomawarmoshiney” 3, ・・Alint Life ・R Basics ・ 5 ・・F Floor 7 ・Heat Sin 1 to ・Ga (Hot Plate T, 3 Figure stem 4-12... Song prayer bottom reflection
Claims (1)
シンク部が、前記配線基板を囲う金属製筐体の一部に接
合されて成ることを特徴とするパワーモジュールの実装
構造。1. A power module mounting structure characterized in that a heat sink portion of a power module placed on a wiring board is joined to a part of a metal casing surrounding the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62084713A JPS63250900A (en) | 1987-04-08 | 1987-04-08 | Mounting structure of power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62084713A JPS63250900A (en) | 1987-04-08 | 1987-04-08 | Mounting structure of power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63250900A true JPS63250900A (en) | 1988-10-18 |
Family
ID=13838307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62084713A Pending JPS63250900A (en) | 1987-04-08 | 1987-04-08 | Mounting structure of power module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63250900A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JPH02164100A (en) * | 1988-12-19 | 1990-06-25 | Sanyo Electric Co Ltd | Electronic device |
| US5764483A (en) * | 1993-11-15 | 1998-06-09 | Hitachi, Ltd. | Cooling unit for electronic equipment |
| US6094343A (en) * | 1995-10-13 | 2000-07-25 | Hitachi, Ltd. | Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler |
| US6574101B2 (en) | 2000-05-12 | 2003-06-03 | Fujitsu Limited | Portable electronic device capable of efficiently cooling heat-generation electronic component |
| JP2010232403A (en) * | 2009-03-27 | 2010-10-14 | Kyushu Institute Of Technology | Heatsink integrated package and method for manufacturing the same |
-
1987
- 1987-04-08 JP JP62084713A patent/JPS63250900A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258385U (en) * | 1988-10-19 | 1990-04-26 | ||
| JPH02164100A (en) * | 1988-12-19 | 1990-06-25 | Sanyo Electric Co Ltd | Electronic device |
| US5764483A (en) * | 1993-11-15 | 1998-06-09 | Hitachi, Ltd. | Cooling unit for electronic equipment |
| US6094343A (en) * | 1995-10-13 | 2000-07-25 | Hitachi, Ltd. | Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler |
| US6094344A (en) * | 1995-10-13 | 2000-07-25 | Hitachi, Ltd. | Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates |
| US6574101B2 (en) | 2000-05-12 | 2003-06-03 | Fujitsu Limited | Portable electronic device capable of efficiently cooling heat-generation electronic component |
| JP2010232403A (en) * | 2009-03-27 | 2010-10-14 | Kyushu Institute Of Technology | Heatsink integrated package and method for manufacturing the same |
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