JPH10126924A - Electric connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent temperature rise of a connector effectively through a simple structure. SOLUTION: A wiring member 14 is housed in a case 12 comprising upper and lower cases 12A, 12B to constitute a joint box J/B 10a. The wiring member 14 is applied, to the back surface thereof, with a thermally conductive member 20 made of a metal excellent in thermal conductivity, e.g. aluminum. The thermally conductive member 20 comprises a planar heat absorber 22 being fixed to the wiring member 14, and a radiator 24 being fixed to the rear of the heat absorber 22 projecting to the outside through an opening 28 made in the lower case 12B. The heat absorber 22 is provided with many fins 26 on the surface at the forward end thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric connection device in which a circuit body constituting a branch circuit is accommodated in a case, and more particularly to an electric connection device capable of radiating heat generated from the circuit body to the outside of the case. is there.

[0002]

2. Description of the Related Art Conventionally, in vehicle wiring, an internal circuit comprising a bus bar is provided inside a case, a board on which electronic components are mounted is housed in the case, and the internal circuit is connected to a circuit on the board. By providing an electrical connection device that forms a high-density and intensive branch circuit, and connecting the electric wire of a wire harness to the electrical connection device, various electrical components, a power supply, and the like are interconnected. .

In this type of electrical connection device, a component that generates a large amount of heat, such as a power transistor, is often mounted on a substrate. Therefore, in order to prevent malfunction due to heat storage, some measures for preventing heat storage are generally taken. It is a target.

For example, it is common practice to attach a heat radiating plate to a component having a large heat value among the mounted components. In this case, heat is radiated in the case, so that the temperature of the device is prevented from becoming high. Is not enough. Therefore, recently, such a radiator plate is led out of the case and fixed to a vehicle frame or the like so that heat is released outside the case.
Thereby, it is performed to prevent heat from being trapped in the case and raised to a high temperature.

[0005]

However, in recent years, an extremely large number of electronic parts have been mounted on a vehicle, and an extremely large number of electronic parts have been mounted on the branch circuit of the electric connection device. The densification is progressing.

Therefore, simply attaching a heat radiating plate to a component and partially releasing heat to the outside of the case may not provide a sufficient heat radiating effect for the entire device, and may require a large number of heat radiating plates. As a result, the size of the device may be increased, or problems such as complicating the work of attaching the device to a vehicle frame or the like may occur. Also, when it is necessary to provide a large number of heat sinks, the degree of freedom in branch circuit design is impaired, and it may be difficult to design an electrical connection device.

[0007] In addition, as described above, the electric connection device in which a large number of relays and fuses are incorporated in the bus bar circuit is not limited to the one that houses the board on which the electronic components are mounted, but the high temperature due to the heat generated by the relays and fuses. This may cause a problem, and it is necessary to effectively prevent a high temperature in such an electrical connection device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide an electric connection device that can effectively prevent a high temperature with a simple configuration.

[0009]

In order to solve the above-mentioned problems, the present invention provides a circuit device in which a circuit body constituting a branch circuit is housed in a case, which is formed from a material having high thermal conductivity. A heat conductive member having a plate-shaped heat absorbing portion laminated on the circuit body and a heat radiating portion formed to be smaller than the heat absorbing portion in a plane and protruding outside through an opening formed in the case. It is provided in the case (claim 1).

According to this device, the heat of the entire portion of the circuit body on which the heat absorbing portions are laminated is effectively conducted from the heat absorbing portion to the outside of the case via the heat radiating portion, and is radiated to the atmosphere. The heat storage is reduced. Further, heat in the atmosphere in the device is also radiated to the outside of the case via the heat conducting member.

In this configuration, if the heat absorbing portion is laminated over the entire circuit body (claim 2), the entire heat generated in the circuit body can be effectively conducted to the outside of the case and radiated. Becomes

Further, a large number of fins are formed on the projecting portion of the heat radiating portion to the outside of the case to thereby provide a large heat radiating area (claim 3), or when the case is fixed to a metal frame. If the heat radiating section is brought into close contact with the metal frame so that the metal frame functions as a heat radiating plate (claim 4), it is possible to suppress an increase in the size of the device while improving the heat radiating function.

Further, if cooling means for forcibly cooling the externally projecting portion of the heat radiating portion is provided (claim 5), heat radiation from the heat radiating portion to the atmosphere is promoted, and heat storage of the device is more effectively prevented. It is possible to do. In this case, as the cooling means, a structure in which a cooling fan is mounted on the heat radiating portion (claim 6) or a passage surrounding the projecting portion of the heat radiating portion to the outside of the case is provided, and the air in this passage is caused to flow by the fan. By adopting such a configuration (claim 7), the above-described effects can be obtained with a simple configuration.

Further, if a thermoelectric cooling element for forcibly conducting the heat of the heat absorbing section to the heat radiating section by energization is provided between the heat absorbing section and the heat radiating section (claim 8), the heat absorbing section is provided. The heat conduction from the case to the heat radiating portion can be actively promoted, and the heat in the case can be effectively radiated to the atmosphere.

Further, an insulating layer is formed on the surface of the heat absorbing portion,
If a wiring circuit constituting a part of the branch circuit is formed on the insulating layer (claim 9), heat generated from the circuit body can be more effectively conducted to the outside of the case and radiated. Becomes

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 and FIG. 2 are perspective views showing an electric connection device according to the present invention. The electric connection device shown in this figure is a joint box 10a (hereinafter, referred to as J / B 10a) mounted on a vehicle. For example, various electric components and a power supply mounted on the vehicle via wires of a wire harness are connected to the J / B 10a. / B10a to connect the electrical components and the like to each other.

As shown in these figures, J / B 10a is
Routing member 14 (circuit body) with bus bar arranged on insulating plate
The wiring member 14 is connected to the upper case 12
It is configured to be housed in a case 12 composed of A and a lower case 12B.

A large number of terminals 18 are provided on the surface of the wiring member 14 by erecting the ends of the bus bars. When the wiring member 14 is stored in the case 12, the terminals 18 are turned off. It protrudes into the socket part 16 formed in the upper case 12A. That is, when the housing of the connector mounted on the wire of the wire harness is fitted into the socket portion 16, the wire of the wire harness is electrically connected to the J / B 10a.

Further, as shown in the drawing, relay terminals 50 and 51 are mounted on some of the terminals provided at the ends of the bus bars provided on the routing member 14, and the routing member 14 is attached to the case 12. In the state stored in the upper case 12
A fuse and relay incorporated in A
It is configured to be connected to the routing member 14 via 0,51.

On the other hand, on the back surface of the wiring member 14, a heat conductive member 20 made of a metal such as aluminum having excellent heat conductivity is fixed. The heat conducting member 20 is the wiring member 1
The heat absorber 22 is composed of a plate-shaped heat absorber 22 (heat absorber) that is in close contact with the heat sink 4 and a heat radiator 24 (heat radiator) fixed to the back surface of the heat absorber 22.

As shown in FIG. 1, the heat absorbing body 22 is formed to have substantially the same planar shape as the wiring member 14,
They are stacked on the routing member 14 with their contours matched. The wiring member 14 and the heat absorber 22 are electrically isolated from each other by, for example, forming an insulating layer on the wiring member 14 side.

The radiator 24 is formed to be smaller in plan than the heat absorber 22. However, the upper and lower dimensions (thickness) are formed sufficiently thick, and the leading end portion is shown in FIG.
As shown in the figure, the lower case 12B protrudes downward and outward from an opening 28 formed in the lower case 12B. Also,
The surface area (heat radiation area) is increased by forming a large number of fins 26 at the tip of the heat radiator 24.

The J / B 10a is connected to the lower case 12
For example, it is fixed to a vehicle frame or the like with a bolt and a nut via a mounting portion 13 formed at B. And, as described above, by connecting the electric wire of the wire harness to the J / B 10a, various electric components, a power supply, and the like are mutually connected.

In the J / B 10a thus configured,
The heat generated in the wiring member 14 due to the heat generation action of the fuse or the relay, or the heat in the atmosphere in the case 12 is transmitted to the outside of the case 12 through the heat absorber 22 and the heat radiator 24 and is radiated to the atmosphere. You. At this time, since the heat absorber 22 is in contact with the entire back surface of the wiring member 14 as described above, the heat of the entire wiring member 14 is conducted to the outside of the case 12 and radiated, and the heat absorber 22 is 12 occupies a large area, the heat in the atmosphere in the case is absorbed by the heat absorber 2.
The heat is suitably transmitted to the outside of the case 12 through the second heat radiation. Therefore, as compared with a conventional device of this type in which a heat radiating plate is attached to every part to radiate heat to the outside, it is possible to effectively suppress the high temperature of the J / B 10a.

In the configuration of the J / B 10a,
The size of the heat absorber 22 of the heat conducting member 20 is determined according to J / B10
It is desirable to set the size to an appropriate size in consideration of the amount of heat to be dissipated and the material cost. In this case, the above J /
As shown in B10a, a large number of fins 26
Is advantageous in that the J / B 10a can be prevented from increasing in size while securing a large heat dissipation area. Further, in this example, the heat absorber 22 is laminated over the entire wiring member 14, but of course, the wiring member 1
4 may be laminated.

The configuration of the J / B 10a is not limited to the examples shown in FIGS. 1 and 2 (first embodiment), but may be variously modified as shown in FIGS. A sixth embodiment) can be considered. Hereinafter, these examples will be described. In the description, the components that perform the same functions as those of the J / B 10a will be described with the same reference numerals.

First, the J / B 10b (second embodiment) shown in FIG. 3 is an example in which the surface of the radiator 24 of the heat conducting member 20 of the J / B 10a is brought into contact with the metal frame 11 of the vehicle. The surface of the radiator 24 is formed in a shape corresponding to the surface of the frame 11, and
Are adhered to the surface of the frame 11.

According to such a configuration, the heat of the wiring member 14 is transmitted to the frame 11 via the heat conducting member 20, and the frame 11 finally functions as a heat radiating plate. The heat and the like of the routing member 14 can be radiated to the outside. In addition, in the case of this configuration, since the frame 11 functions as a heat radiating plate, a sufficient heat radiating effect can be obtained even if the heat radiator 24 is small, so that the J / B 10b can have a compact configuration. There is an advantage.

4 and 5 are examples in which the radiator 24 of the heat conducting member 20 is forcibly cooled outside the case 12.

First, a J / B 10c (third embodiment) shown in FIG. 4 is a cooling fan for blowing external air to the radiator 24 of the heat conducting member 20 in the J / B 10a. 30 is attached. According to the J / B 10c, the heat radiator 2 is
4 the outside air is blown onto the surface, so that the radiator 24
From the outside, the heat of the wiring member 14 and the like can be efficiently radiated to the outside of the case 12. Therefore, it is possible to more effectively prevent the temperature of the J / B 10c from increasing with a relatively simple configuration.

On the other hand, an example shown in FIG. 5 (fourth embodiment)
The J / B 10a is attached to a vehicle frame in a state where the J / B 10a is housed inside the air duct 32, and an exhaust fan 34 is attached to an opening on one side of the air duct 32. In the example shown in this figure, outside air is introduced from the opening on the other side of the air duct 32 in accordance with the exhaust from the air duct 32 by the exhaust fan 34, whereby cool air is supplied to the vicinity of the J / B 10 and heat is radiated from the radiator 24. Is promoted. Therefore, even with this configuration, J / B10 shown in FIG.
The same operation and effect as those of the item (c) can be obtained.

In the case of the configuration shown in FIG. 5, for example, J /
The same operation and effect can be obtained even if only the radiator 24 is interposed in the air duct without disposing the entire B10a inside the air duct 32. However,
Since the heat inside the case 12 is radiated to the outside even through the case 12, as shown in FIG. 5, disposing the entire J / B 10a in the air duct 32 promotes the heat radiation from the entire J / B 10a. There is an advantage that can be.

Next, a J / B 10d (fifth embodiment) shown in FIG. 6 is different from the J / B 10c in that the Peltier element 3 is provided between the heat absorber 22 and the heat radiator 24 of the heat conducting member 20.
6 (thermo-electronic cooling element). The Peltier element 36 includes a pair of terminals, and when a current flows between the terminals, the Peltier element 36 extends from the heat absorber 22 toward the heat radiator 24 at a degree corresponding to the magnitude of the current. It is configured to forcibly cause heat transfer.

According to this configuration, the conduction of heat from the heat absorber 22 to the heat radiator 24 can be forcibly promoted by conducting electricity to the Peltier element 36 to release the heat, so that the heat of the wiring member 14 can be reliably reduced. In addition, heat can be effectively radiated to the outside. In particular, in the case of this configuration, if a temperature sensor is installed in the case 12 and the amount of electricity supplied to the Peltier element 36 is controlled in accordance with the temperature detected by this sensor, the heat of the wiring member 14 becomes necessary. Can be dissipated according to the temperature.

A J / B 10e (sixth embodiment) shown in FIG. 7 uses the heat absorber 22 of the heat conducting member 20 itself as a circuit in the J / B 10d shown in FIG. . That is, the heat absorber 22 of the heat conducting member 20
An insulating layer 38 is formed on the surface of the device, a circuit 40 is formed on the insulating layer 38, and electronic components 42 and the like are mounted. By connecting the circuit 40 to the wiring member 14 in a three-dimensional manner, the heat absorber 22 and the wiring member 14 are integrated, and the circuit 4 formed on the heat absorber 22 is integrated.
0 is incorporated in the circuit of the routing member 14.

According to such a configuration, since the heat generated in the electronic component 42 is immediately transmitted to the outside via the radiator 24 and is radiated, the heat generated in the electronic component 42 is radiated to the outside very efficiently. can do. Therefore, when it is necessary to mount components having a large amount of heat, such as a power transistor, as the electronic component 42, if these components are intensively mounted on the heat absorber 22, the heat of the power transistor or the like can be increased. Can be effectively radiated to the outside of the case. Note that, as described above, a metal core substrate can be used as the one in which the insulating layer 38 is formed on the surface of the heat absorber 22 of the heat conducting member 20.

The first to sixth embodiments have been described with respect to an example in which the case 12 accommodates the routing member 14 having a bus bar disposed on an insulating plate as a circuit body. A circuit body in which various electronic components and relays are mounted on a printed circuit board on which a branch conductive path is formed, or a circuit body in which this type of printed circuit board is connected and integrated with the above-described wiring member to form a branch circuit. It is equally effective. In this case, for example, when mounting a component having a large amount of heat such as a power transistor among components mounted on the circuit body, a heat sink is attached to each component as in the related art, and the heat sink is placed outside the case. It may be derived to promote heat radiation. However, when installing a heat sink for each component, a space for installing the heat sink is required, so that the circuit body must be enlarged or the circuit body must be designed to secure the space for installing the heat sink. A complicated problem occurs at the stage. For this reason, from the viewpoint of increasing the size of the J / B and simplifying the design work, it is desirable to avoid installing a heat sink for each component more than necessary.

In the above-described embodiment, the wiring member 14 in which the branch conductive path is formed by the bus bar obtained by press-molding the metal plate has been described as an example. Of course, the present invention is also applicable to a wiring member in which a conductive path is formed.

[0040]

As described above, according to the present invention, a heat conducting member formed of a material having a high thermal conductivity is laminated on a circuit body, and heat in the circuit body or its atmosphere is absorbed by the heat conducting member. Since the heat is transmitted to the outside of the case through the heat radiating portion from the portion and radiated to the atmosphere, the heat generated in the circuit body can be effectively released to the outside. Therefore, the temperature of the electric connection device can be effectively prevented from rising.

In particular, in such a configuration, if the heat absorbing portion is laminated over the entire circuit body, the entire heat generated in the circuit body can be effectively conducted to the outside of the case and radiated.

Further, when a large number of fins are formed on the projecting portion of the heat radiating portion to the outside of the case, or when the case is fixed to a metal frame, the external projecting portion of the heat radiating portion is brought into contact with the metal frame. By doing so, it is possible to increase the size of the device while effectively dissipating the heat in the case to the atmosphere by increasing the heat radiation area.

Further, if cooling means for forcibly cooling the externally protruding portion of the heat radiating portion is provided, heat radiation to the atmosphere in the heat radiating portion is promoted, and heat storage of the device can be more effectively prevented. .

Further, if a thermoelectric cooling element for forcibly conducting the heat of the heat absorbing portion to the heat radiating portion is provided, the heat conduction from the heat absorbing portion to the heat radiating portion is promoted to effectively reduce the heat in the case. Heat can be released into the atmosphere.

Further, an insulating layer is formed on the surface of the heat absorbing portion,
If a wiring circuit constituting a part of the branch circuit is formed on the insulating layer, the heat generated in the circuit body can be extremely efficiently conducted to the outside of the case and radiated.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an example (first embodiment) of a joint box according to the present invention.

FIG. 2 is a sectional view showing the joint box.

FIG. 3 is a cross-sectional view illustrating another example (second embodiment) of the joint box.

FIG. 4 is a cross-sectional view illustrating another example (third embodiment) of the joint box.

FIG. 5 is a sectional view showing another example (fourth embodiment) of the joint box.

FIG. 6 is a sectional view showing another example (fifth embodiment) of the joint box.

FIG. 7 is a sectional view showing another example (sixth embodiment) of the joint box.

[Explanation of symbols]

 10a to 10e Joint box 12 Case 12A Upper case 12B Lower case 14 Routing member 16 Socket part 18 Terminal 20 Heat conduction member 22 Heat absorber 24 Heat radiator 26 Fin 28 Opening 30 Cooling fan 32 Air duct 34 Exhaust fan 36 Peltier element 38 Insulating layer 40 circuits 42 electronic components

Claims (9)

[Claims] 1. A circuit body comprising a branch circuit housed in a case. The circuit body is formed of a material having high thermal conductivity, and is formed of a plate-shaped heat absorbing portion laminated on the circuit body. The case further comprises a heat conducting member having a heat dissipating portion which is formed small in a plane and has a heat radiating portion protruding outside through an opening formed in the case. 2. The electrical connection device according to claim 1, wherein the heat absorbing portion is laminated over the entire circuit body. 3. The electrical connection device according to claim 1, wherein a large number of fins are formed at a portion of the heat radiation portion protruding outside the case. 4. The case according to claim 1, wherein the case is fixed to a metal frame, and the heat radiating portion is formed to be in close contact with the metal frame. An electrical connection device as described. 5. The electrical connection device according to claim 1, further comprising cooling means for forcibly cooling a protruding portion of the heat radiating portion to the outside of the case. 6. The electrical connection device according to claim 5, wherein said cooling means is a cooling fan mounted on said heat radiating portion. 7. The electric device according to claim 5, wherein said cooling means comprises a passage surrounding at least a projecting portion of said heat radiating portion to the outside of the case, and a fan for flowing air in said passage. Connection device. 8. The thermoelectric cooling element according to claim 1, wherein the heat conducting member is provided with a thermoelectric cooling element for forcibly conducting the heat of the heat absorbing section to the heat radiating section by energization. The electrical connection device according to any one of the above. 9. An insulating layer is formed on a surface of the heat absorbing portion, and a wiring circuit forming a part of the branch circuit is formed on the insulating layer.
An electrical connection device according to any one of claims 1 to 8.